# MGSF1N03L

**UMW** · MOSFETs · SOT-23

MGSF1N03L from UMW, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE terminal of the N-channel MOSFET; the gate-to-source voltage is rated ±20 V (VGS) in the maximum ratings. |
| 2 | S | passive | SOURCE terminal of the N-channel MOSFET; the drain-to-source voltage is rated 30 V (VDS) referenced to this pin. |
| 3 | D | passive | DRAIN terminal of the N-channel MOSFET; continuous drain current is rated 2.1 A at TA=25°C (steady state) with VDS of 30 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | V(BR)DSS | 30 |  |  | V | ID=10µA, VGS=0V | 3 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | µA | VDS=30V, VGS=0V | 3 |
| Zero Gate Voltage Drain Current (TJ=125°C) | IDSS |  |  | 10 | µA | VDS=30V, VGS=0V, TJ=125°C | 3 |
| Gate-Body Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V, VDS=0V | 3 |
| Gate Threshold Voltage | VGS(th) | 1 | 1.7 | 2.5 | V | VDS=VGS, ID=250µA | 3 |
| Static Drain-to-Source On-Resistance | RDS(ON) |  |  | 0.1 | Ω | VGS=10V, ID=1.2A | 3 |
| Static Drain-to-Source On-Resistance | RDS(ON) |  |  | 0.145 | Ω | VGS=4.5V, ID=1A | 3 |
| Drain-Source Voltage | VDS |  |  | 30 | V |  | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Pulsed Drain Current | IDM |  |  | 6 | A | tp=10µs | 1 |
| Operating Junction and Storage Temperature | TJ,TSTG | -55 |  | 150 | °C |  | 1 |
| Lead Temperature for Soldering Purposes | TL |  |  | 260 | °C | 1/8 in from case, 10 s | 1 |
| Junction-to-Foot Thermal Resistance | RθJL |  |  | 180 | °C/W | Steady state | 2 |
| Junction-to-Ambient Thermal Resistance | RθJA |  |  | 300 | °C/W | Steady state, Note 1 (FR4, 650 mm² pad) | 2 |
| Junction-to-Ambient Thermal Resistance | RθJA |  |  | 250 | °C/W | t<10s, Note 1 (FR4, 650 mm² pad) | 2 |
| Junction-to-Ambient Thermal Resistance | RθJA |  |  | 400 | °C/W | Steady state, Note 2 (FR4, 50 mm² pad) | 2 |

## CAD (KiCad official)

- Symbol: `MGSF1N03L`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `mgsf1n03l-etched.step` / `mgsf1n03l-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mgsf1n03l.step` / `mgsf1n03l.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [UMW datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8755878516179521536) (8 pp, sha256 `85b59802ca84b620`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mgsf1n03l-datasheet.pdf)