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MGSF1N03L

Public Made by Adom

by adom

UMW MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MGSF1N03L

UMW · MOSFETs · SOT-23

MGSF1N03L from UMW, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input GATE terminal of the N-channel MOSFET; the gate-to-source voltage is rated ±20 V (VGS) in the maximum ratings.
2 S passive SOURCE terminal of the N-channel MOSFET; the drain-to-source voltage is rated 30 V (VDS) referenced to this pin.
3 D passive DRAIN terminal of the N-channel MOSFET; continuous drain current is rated 2.1 A at TA=25°C (steady state) with VDS of 30 V.

Key specifications

Parameter Value
Manufacturer UMW
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 30 V ID=10µA, VGS=0V 3
Zero Gate Voltage Drain Current IDSS 1 µA VDS=30V, VGS=0V 3
Zero Gate Voltage Drain Current (TJ=125°C) IDSS 10 µA VDS=30V, VGS=0V, TJ=125°C 3
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 3
Gate Threshold Voltage VGS(th) 1 1.7 2.5 V VDS=VGS, ID=250µA 3
Static Drain-to-Source On-Resistance RDS(ON) 0.1 Ω VGS=10V, ID=1.2A 3
Static Drain-to-Source On-Resistance RDS(ON) 0.145 Ω VGS=4.5V, ID=1A 3
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Pulsed Drain Current IDM 6 A tp=10µs 1
Operating Junction and Storage Temperature TJ,TSTG -55 150 °C 1
Lead Temperature for Soldering Purposes TL 260 °C 1/8 in from case, 10 s 1
Junction-to-Foot Thermal Resistance RθJL 180 °C/W Steady state 2
Junction-to-Ambient Thermal Resistance RθJA 300 °C/W Steady state, Note 1 (FR4, 650 mm² pad) 2
Junction-to-Ambient Thermal Resistance RθJA 250 °C/W t<10s, Note 1 (FR4, 650 mm² pad) 2
Junction-to-Ambient Thermal Resistance RθJA 400 °C/W Steady state, Note 2 (FR4, 50 mm² pad) 2

CAD (KiCad official)

  • Symbol: MGSF1N03L
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mgsf1n03l-etched.step / mgsf1n03l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mgsf1n03l.step / mgsf1n03l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (8 pp, sha256 85b59802ca84b620, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF