component
MD52E33WB6
Public Made by Adomby adom
Shanghai Mingda Microelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMD52E33WB6
Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-4-EP(1x1)
MD52E33WB6 from Shanghai Mingda Microelectronics, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated output; the datasheet states VOUT must not exceed VIN+0.3V, otherwise reverse current through the parasitic diode can destroy the IC. |
| 2 | GND | power_in | Ground reference pin for the regulator. |
| 3 | EN | input | ON/OFF control, enable high: VENH is 1.0 V to 7.0 V and VENL is 0 V to 0.38 V; driving EN low shuts the IC down and discharges COUT. |
| 4 | VIN | power_in | Input supply; the datasheet gives an operating input range of 2.2 V to 7.0 V and an absolute maximum of -0.3 V to 8 V. |
| 5 | EP | passive | Exposed pad shown on the DFN1*1-4L top view; the datasheet does not state its electrical connection or function. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Mingda Microelectronics |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (VOUT≥2.0V, 3.3V variant) | VOUT(S) | 0.98 | 1.02 | x VOUT(S) | VIN=VOUT(S)+1.0V, IOUT=10mA, VOUT(S)≥2.0V | 4 | |
| Output voltage accuracy (feature) | -2 | 2 | % | Highly Accurate feature | 1 | ||
| Temperature Stability | ΔVOUT/ΔT | -50 | 50 | ppm/℃ | VIN=VEN=VOUT(S)+1.0V, IOUT=1mA, -40℃≤Ta≤125℃ | 4 | |
| Dropout Voltage (VOUT≥3V) | VDROP | 230 | mV | VEN=VIN, VOUT≥3V, IOUT=500mA | 4 | ||
| Line Regulation | ΔVOUT/ΔVIN | 0.05 | 0.1 | %/V | VOUT(S)+0.5V≤VIN=VEN≤7V, IOUT=10mA | 4 | |
| Load Regulation | VOUT2 | 50 | 90 | mV | VIN=VEN=VOUT(S)+1.0V, 1mA≤IOUT≤500mA | 4 | |
| GND Current (no load) | IGND | 0.6 | 0.9 | μA | VEN=VIN, no load | 4 | |
| GND Current (IOUT=500mA) | IGND | 210 | μA | VEN=VIN, IOUT=500mA | 4 | ||
| Shutdown Current | ISHUT | 0.01 | 0.1 | μA | VIN=7.0V, VEN=0 | 4 | |
| Input Voltage | VIN | 2.2 | 7 | V | 4 | ||
| Maximum Output Current | IOUTMAX | 450 | 500 | mA | 4 | ||
| Current Limit | ILIM | 750 | mA | VIN=VEN=VOUT(S)+1.0V, VOUT=0.95×VOUT(S) | 4 | ||
| Short Circuit Current | ISHORT | 50 | mA | VIN=VEN=VOUT(S)+1.0V, VOUT=0V | 4 | ||
| COUT Auto Discharge Resistance | RDCHG | 280 | 450 | 640 | Ω | VEN=0, VOUT=VOUT(S) | 4 |
| Power Supply Rejection Ratio (10Hz) | PSRR | 64 | dB | f=10Hz, IOUT=10mA | 4 | ||
| Power Supply Rejection Ratio (100Hz) | PSRR | 51 | dB | f=100Hz, IOUT=10mA | 4 | ||
| Power Supply Rejection Ratio (1kHz) | PSRR | 34 | dB | f=1kHz, IOUT=10mA | 4 | ||
| EN 'H' Level Voltage | VENH | 1 | 7 | V | 4 | ||
| EN 'L' Level Voltage | VENL | 0 | 0.38 | V | 4 | ||
| EN 'H' Level Current | IENH | -0.1 | 0.1 | μA | VIN=7.0V, VEN=VIN | 4 | |
| EN 'L' Level Current | IENL | -0.1 | 0.1 | μA | VIN=7.0V, VEN=0 | 4 | |
| Input Voltage (absolute maximum) | VIN | -0.3 | 8 | V | 3 | ||
| ESD Protection HBM | ESD HBM | 6000 | V | 3 | |||
| Power Dissipation (DFN1*1-4L) | PD | 200 | mW | DFN1*1-4L package | 3 | ||
| Thermal Resistance Junction-to-Board (DFN1*1-4L) | RθJB | 160 | ℃/W | DFN1*1-4L; mounted on JEDEC standard 4-layer (2s2p) PCB | 3 | ||
| Operating Ambient Temperature | Topr | -40 | 85 | ℃ | 3 | ||
| Storage Temperature | Tstg | -40 | 125 | ℃ | 3 | ||
| Output Voltage (nominal, MD52E33 selection) | VOUT | 3.3 | V | Product selection MD52E33WB6 | 2 |
CAD (KiCad official)
- Symbol:
MD52E33WB6 - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
md52e33wb6-etched.step/md52e33wb6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);md52e33wb6.step/md52e33wb6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shanghai Mingda Microelectronics datasheet (14 pp, sha256
4168b8cf3e52f15f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).