component

MCP6V02-E

Public Made by Adom

by adom

Microchip Tech Precision OpAmps, DFN-8-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentoperational amplifier-comparatormcp6v02-efactory-2.0.0extractor-text

Verified MCP6V02-E

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 9 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MCP6V02-E · DFN-8-EP(4x4) · 9 pins
  • ✓copper: 9 copper pads, none touching another net
  • ✓datasheet: all 9 pin names found in the 44-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-p8_9m8jx/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 9 pins = 9 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 9 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ mcp6v02-e.kicad_sym✓ mcp6v02-e.kicad_mod✓ mcp6v02-e.step
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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 7d ago
viewers mcp6v02-e: viewers · Ray 7d ago
mcp6v02-e-etched.glb Publish 0.1.0 · Ray 7d ago
mcp6v02-e-etched.step mcp6v02-e: factory component page (tier=mfr) · Ray 7d ago
mcp6v02-e-hero.glb mcp6v02-e: hero GLB from the etched model (keeps the MPN mark) · Ray 7d ago
mcp6v02-e-hero.overlay.json Publish 0.1.0 · Ray 7d ago
mcp6v02-e.glb Publish 0.1.0 · Ray 7d ago
mcp6v02-e.kicad_mod Publish 0.1.0 · Ray 7d ago
mcp6v02-e.kicad_sym Publish 0.1.0 · Ray 7d ago
mcp6v02-e.lbr Publish 0.1.0 · Ray 7d ago
mcp6v02-e.step Publish 0.1.0 · Ray 7d ago
package.json Publish 0.1.0 · Ray 7d ago
page.json Set visibility: public · Ray 7d ago
README.md Publish 0.1.0 · Ray 7d ago
verification.json Verified: Published by the parts factory: tier mfr, 9 pins · Ray 7d ago

MCP6V02-E

Microchip Tech · Precision OpAmps · DFN-8-EP(4x4)

MCP6V02-E from Microchip Tech, in a DFN-8-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Op amp A output, a low-impedance voltage source.
2 VINA- input Op amp A inverting input, a high-impedance CMOS input with low bias current.
3 VINA+ input Op amp A non-inverting input, a high-impedance CMOS input with low bias current.
4 VSS power_in Negative power supply, normally connected to ground in single-supply use.
5 VINB+ input Op amp B non-inverting input, a high-impedance CMOS input with low bias current.
6 VINB- input Op amp B inverting input, a high-impedance CMOS input with low bias current.
7 VOUTB output Op amp B output, a low-impedance voltage source.
8 VDD power_in Positive power supply, 1.8V to 5.5V above VSS, and needs bypass capacitors.
9 EP power_in Exposed thermal pad internally connected to VSS and must be connected to the same potential as VSS on the PCB; it can be tied to a ground plane to lower thermal resistance (θJA).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package DFN-8-EP(4x4)
Category Operational Amplifier/Comparator
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS -2 2 µV TA = +25°C (Note 1) 3
Input Offset Voltage Drift with Temperature (linear Temp. Co.) TC1 -50 50 nV/°C TA = -40 to +125°C (Note 1) 3
Power Supply Rejection PSRR 130 143 dB (Note 1) 3
Input Bias Current across Temperature IB 600 5000 pA TA = +125°C 3
Input Offset Current across Temperature IOS -1000 -75 1000 pA TA = +125°C 3
Common-Mode Input Voltage Range VCMR -0.2 0.2 V VSS − 0.20 to VDD + 0.20 (Note 2) 3
Common-Mode Rejection CMRR 130 142 dB VDD = 1.8V, VCM = -0.2V to 2.0V (Note 1, Note 2) 3
Common-Mode Rejection CMRR 140 152 dB VDD = 5.5V, VCM = -0.2V to 5.7V (Note 1, Note 2) 3
DC Open-Loop Gain (large signal) AOL 130 145 dB VDD = 1.8V, VOUT = 0.2V to 1.6V (Note 1) 3
DC Open-Loop Gain (large signal) AOL 140 156 dB VDD = 5.5V, VOUT = 0.2V to 5.3V (Note 1) 3
Maximum Output Voltage Swing VOL, VOH 15 15 mV G = +2, 0.5V input overdrive; VSS + 15 mV min / VDD − 15 mV 4
Supply Voltage VDD 1.8 5.5 V 4
Quiescent Current per amplifier IQ 200 300 400 µA IO = 0 4
POR Trip Voltage VPOR 1.15 1.65 V 4
Specified Temperature Range TA -40 125 °C 5
Operating Temperature Range TA -40 125 °C (Note 1) 5
Storage Temperature Range TA -65 150 °C 5
Current at Input Pins -2 2 mA 3
Current at Output and Supply Pins -30 30 mA 3
Max. Junction Temperature TJ 150 °C 3
ESD protection (HBM) 4 kV all pins, HBM 3
ESD protection (MM) 300 V all pins, MM 3
Thermal Resistance, 8L-4x4 DFN θJA 44 °C/W (Note 2) JC51-7 four layer board with ground plane and vias 5
Input Offset Voltage Quadratic Temp. Co. TC2 0.1 nV/°C² TA = -40 to +125°C; printed ±0.1 3
Input Bias Current IB 1 pA printed ±1 3
Output Short Circuit Current ISC 7 mA VDD = 1.8V; printed ±7 4
Output Short Circuit Current ISC 22 mA VDD = 5.5V; printed ±22 4
Gain Bandwidth Product GBWP 1.3 MHz 4
Slew Rate SR 0.5 V/µs 4
Phase Margin PM 65 ° G = +1 4
Input Noise Voltage Eni 2.5 µVP-P f = 0.1 Hz to 10 Hz 4
Input Noise Voltage Density eni 120 nV/√Hz f < 2.5 kHz 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts gold SN = Plastic SOIC (150mil Body), 8-lead * Y = nickel palladium gold manufacturing designator. Only 41

CAD (KiCad official)

  • Symbol: MCP6V02-E
  • Footprint: Package_DFN_QFN:DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
  • 3D model: DFN-8-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: mcp6v02-e-etched.step / mcp6v02-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp6v02-e.step / mcp6v02-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (44 pp, sha256 28cdd67b1fe05611, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF