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MCP6294-E

Microchip Tech · Operational Amplifier · SOIC-14

MCP6294-E from Microchip Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Analog output of op amp A, a low-impedance voltage source that swings to within 15 mV of VDD and VSS (VDD - 15 mV min, VSS + 15 mV max) with RL = 10 kΩ to VDD/2 at VDD = 5.5 V.
2 VINA- input Inverting input of op amp A, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
3 VINA+ input Noninverting input of op amp A, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
4 VDD power_in Positive power supply, which must be 2.4 V to 6.0 V higher than VSS; bypass capacitors are needed on this pin.
5 VINB+ input Noninverting input of op amp B, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
6 VINB- input Inverting input of op amp B, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
7 VOUTB output Analog output of op amp B, a low-impedance voltage source with rail-to-rail swing (VDD - 15 mV min, VSS + 15 mV max at RL = 10 kΩ to VDD/2, VDD = 5.5 V).
8 VOUTC output Analog output of op amp C, a low-impedance voltage source with rail-to-rail swing (VDD - 15 mV min, VSS + 15 mV max at RL = 10 kΩ to VDD/2, VDD = 5.5 V).
9 VINC- input Inverting input of op amp C, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
10 VINC+ input Noninverting input of op amp C, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
11 VSS power_in Negative power supply; for single-supply operation this pin is connected to ground.
12 VIND+ input Noninverting input of op amp D, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
13 VIND- input Inverting input of op amp D, a high-impedance CMOS input with low bias current that can operate up to 0.3 V past either supply rail.
14 VOUTD output Analog output of op amp D, a low-impedance voltage source with rail-to-rail swing (VDD - 15 mV min, VSS + 15 mV max at RL = 10 kΩ to VDD/2, VDD = 5.5 V).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-14
Category Operational Amplifier/Comparator
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS -3 3 mV VCM = VSS (Note 1) 2
Power Supply Rejection Ratio PSRR 70 90 dB VCM = VSS (Note 1) 2
Input Bias Current at TA = +85°C IB 50 200 pA TA = +85°C (Note 2) 2
Input Bias Current at TA = +125°C IB 2 5 nA TA = +125°C (Note 2) 2
Common-mode Rejection Ratio CMRR 70 85 dB VCM = -0.3V to 2.5V, VDD = 5V 2
Common-mode Rejection Ratio CMRR 65 80 dB VCM = -0.3V to 5.3V, VDD = 5V 2
DC Open-Loop Gain (Large Signal) AOL 90 110 dB VOUT = 0.2V to VDD, 0.2V, VCM = VSS (Note 1) 3
Quiescent Current per Amplifier IQ 0.7 1 1.3 mA IO = 0 3
Supply Voltage VDD 2.4 6 V TA = -40°C to +125°C (Note 5) 3
Operating Temperature Range (E Temp) TA -40 125 °C Note 4
Storage Temperature Range TA -65 150 °C 4
VDD, VSS 7 V 2
Current at Input Pins -2 2 mA 2
Current at Output and Supply Pins -30 30 mA 2
Maximum Junction Temperature TJ 155 °C 2
ESD Protection On All Pins (HBM) 4 kV HBM 2
ESD Protection On All Pins (CDM) 2 kV CDM 2
ESD Protection On All Pins (MM) 400 V MM 2
Thermal Resistance, 14L-SOIC JA 120 °C/W 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] A A2 35

CAD (KiCad official)

  • Symbol: MCP6294-E
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mcp6294-e-etched.step / mcp6294-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp6294-e.step / mcp6294-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (50 pp, sha256 0d01a38965ca7436, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF