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MCP604T-E

Microchip Tech · Operational Amplifier · SOIC-14

MCP604T-E from Microchip Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Analog output of op amp A, a low-impedance voltage source.
2 VINA- input Inverting input of op amp A, a high-impedance CMOS input with low bias current.
3 VINA+ input Non-inverting input of op amp A, a high-impedance CMOS input with low bias current.
4 VDD power_in Positive power supply, 2.5V to 6.0V higher than VSS and needing bypass capacitors.
5 VINB+ input Non-inverting input of op amp B, a high-impedance CMOS input with low bias current.
6 VINB- input Inverting input of op amp B, a high-impedance CMOS input with low bias current.
7 VOUTB output Analog output of op amp B, a low-impedance voltage source.
8 VOUTC output Analog output of op amp C, a low-impedance voltage source.
9 VINC- input Inverting input of op amp C, a high-impedance CMOS input with low bias current.
10 VINC+ input Non-inverting input of op amp C, a high-impedance CMOS input with low bias current.
11 VSS power_in Negative power supply, connected to ground in single-supply use; VDD is 2.5V to 6.0V above it.
12 VIND+ input Non-inverting input of op amp D, a high-impedance CMOS input with low bias current.
13 VIND- input Inverting input of op amp D, a high-impedance CMOS input with low bias current.
14 VOUTD output Analog output of op amp D, a low-impedance voltage source.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-14
Category Operational Amplifier/Comparator
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS -2 0.7 2 mV TA = +25°C 2
Input Offset Voltage, Extended Temperature VOS -4.5 1 4.5 mV TA = -40°C to +125°C (Note 1) 2
Power Supply Rejection Ratio PSRR 80 88 dB VDD = 2.7V to 5.5V 2
Input Bias Current, Extended Temperature IB 450 5000 pA TA = +125°C (Note 1) 2
Common Mode Rejection Ratio CMRR 75 90 dB VDD = 5.0V, VCM = -0.3V to 3.8V 2
DC Open-loop Gain (large signal) AOL 100 115 dB RL = 25 kΩ to VL, VOUT = 0.1V to VDD, 0.1V 2
DC Open-loop Gain (large signal) AOL 95 110 dB RL = 5 kΩ to VL, VOUT = 0.1V to VDD, 0.1V 2
Supply Voltage VDD 2.7 6 V Note 2 2
Quiescent Current per Amplifier IQ 230 325 µA IO = 0 2
Supply Voltage (VDD, VSS) VDD-VSS 7 V 2
Current at Input Pins -2 2 mA ±2 mA 2
Analog Input Voltage (VIN+, VIN-) -1 1 V VSS, 1.0V to VDD + 1.0V (offsets relative to VSS/VDD) 2
All Other Inputs and Outputs -0.3 0.3 V VSS, 0.3V to VDD + 0.3V (offsets relative to VSS/VDD) 2
Current at Output and Supply Pins -30 30 mA ±30 mA 2
Storage Temperature -65 150 °C 2
Maximum Junction Temperature TJ 150 °C 2
Specified Temperature Range, Extended TA -40 125 °C Extended temperature parts 4
Operating Temperature Range TA -40 125 °C Note 4
Thermal Resistance, 14L-SOIC θJA 120 °C/W 4
Input Offset Temperature Drift ΔVOS/ΔTA 2.5 µV/°C TA = -40°C to +125°C (±2.5) 2
Input Bias Current IB 1 pA 2
Output Short Circuit Current ISC 22 mA VDD = 5.5V (±22) 2
Output Short Circuit Current ISC 12 mA VDD = 2.7V (±12) 2
Gain Bandwidth Product GBWP 2.8 MHz 3
Phase Margin PM 50 ° G = +1 V/V 3
Slew Rate SR 2.3 V/µs G = +1 V/V 3
Settling Time (0.01%) tsettle 4.5 µs G = +1 V/V, 3.8V step 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin P = Plastic DIP (300 mil body), 8, 14 lead SN = Plastic SOIC (3.90 mm body), 8 lead 31

CAD (KiCad official)

  • Symbol: MCP604T-E
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mcp604t-e-etched.step / mcp604t-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp604t-e.step / mcp604t-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (34 pp, sha256 bd8b64186a1924f8, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF