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MCP3912A1-E
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Microchip Tech Analog To Digital Converters (ADCs), QFN-28(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MCP3912A1-E
Microchip Tech · Analog To Digital Converters (ADCs) · QFN-28(5x5)
MCP3912A1-E from Microchip Tech, in a QFN-28(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CH1- | input | Inverting analog input for channel 1; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 2 | CH1+ | input | Noninverting analog input for channel 1; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 3 | CH2+ | input | Noninverting analog input for channel 2; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 4 | CH2- | input | Inverting analog input for channel 2; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 5 | CH3- | input | Inverting analog input for channel 3; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 6 | CH3+ | input | Noninverting analog input for channel 3; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 7 | NC | unconnected | No connect; for better EMI results, connect to AGND. |
| 8 | REFIN+/OUT | bidirectional | Noninverting voltage reference input and internal reference output; internal reference has minimal drive capability and needs buffering and a 0.1 µF ceramic bypass if used as a source. |
| 9 | REFIN- | input | Inverting voltage reference input; connect directly to AGND when using the internal or a single-ended reference. |
| 10 | AGND | power_in | Analog ground, return path for internal analog circuitry; star-connect with pin 26 and to the same node as DGND. |
| 11 | AVDD | power_in | Analog power supply, 2.7V to 3.6V; connect with pin 25 and bypass with 10 µF in parallel with 0.1 µF ceramic. |
| 12 | DVDD | power_in | Digital power supply pin, 2.7V to 3.6V. |
| 13 | DGND | power_in | Digital ground, return path for internal digital circuitry; star-connect with pins 15 and 23 and to the same node as AGND. |
| 14 | DR | output | Data ready output giving an active-low pulse of half a DMCLK period when new ADC data are available; high-impedance or logic high when inactive per DR_HIZ. |
| 15 | DGND | power_in | Digital ground, return path for internal digital circuitry; star-connect with pins 13 and 23. |
| 16 | OSC1/CLKI | input | Oscillator crystal connection or external clock input. |
| 17 | OSC2 | passive | Oscillator crystal connection pin. |
| 18 | CS | input | Serial interface chip select input; falling edge starts and rising edge ends an SPI communication, SDO is high-impedance when CS is high. |
| 19 | SCK | input | Serial interface clock input for SPI Mode 0,0 and 1,1, up to 20 MHz. |
| 20 | SDO | tri_state | Serial interface data output clocked out on the falling edge of SCK; high-impedance when CS is high. |
| 21 | SDI | input | Serial interface data input latched on the rising edge of SCK. |
| 22 | RESET | input | Master reset logic input acting as a hard reset to the default power-up configuration. |
| 23 | DGND | power_in | Digital ground, return path for internal digital circuitry; star-connect with pins 13 and 15. |
| 24 | DVDD | power_in | Digital power supply pin, 2.7V to 3.6V. |
| 25 | AVDD | power_in | Analog power supply, 2.7V to 3.6V; connect with pin 11 and bypass with 10 µF in parallel with 0.1 µF ceramic. |
| 26 | AGND | power_in | Analog ground, return path for internal analog circuitry; star-connect with pin 10 and to the same node as DGND. |
| 27 | CH0+ | input | Noninverting analog input for channel 0; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 28 | CH0- | input | Inverting analog input for channel 0; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 29 | EP | passive | Exposed thermal pad; must be connected to AGND or floating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-28(5x5) |
| Category | ADC/DAC/Data Conversion |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VDD (absolute maximum) | VDD | -0.3 | 4 | V | 3 | ||
| Digital inputs and outputs w.r.t. AGND | -0.3 | 4 | V | 3 | |||
| Analog input w.r.t. AGND | -2 | 2 | V | 3 | |||
| Storage temperature | -65 | 150 | °C | 3 | |||
| Ambient temp. with power applied | -65 | 125 | °C | 3 | |||
| Soldering temperature of leads | 300 | °C | 10 seconds | 3 | |||
| VREF input w.r.t. AGND (min only; max is VDD + 0.6 V) | -0.6 | V | 3 | ||||
| Resolution (No Missing Codes) | 24 | bits | OSR = 256 or greater | 3 | |||
| Sampling Frequency | fS(DMCLK) | 1 | 4 | MHz | For maximum condition, BOOST[1:0] = 11 | 3 | |
| Output Data Rate | fD(DRCLK) | 4 | 125 | ksps | For maximum condition, BOOST[1:0] = 11, OSR = 32 | 3 | |
| Analog Input Absolute Voltage on CHn+/- Pins | CHn+/- | -1 | 1 | V | All analog input channels measured to AGND | 3 | |
| Offset Error | VOS | -2 | 0.2 | 2 | mV | Note 5 | 3 |
| Gain Error | GE | -6 | 6 | % | Note 5 | 3 | |
| Differential Input Impedance | ZIN | 232 | kΩ | G = 1, proportional to 1/AMCLK | 4 | ||
| Differential Input Impedance | ZIN | 142 | kΩ | G = 2, proportional to 1/AMCLK | 4 | ||
| Differential Input Impedance | ZIN | 72 | kΩ | G = 4, proportional to 1/AMCLK | 4 | ||
| Differential Input Impedance | ZIN | 38 | kΩ | G = 8, proportional to 1/AMCLK | 4 | ||
| Differential Input Impedance | ZIN | 36 | kΩ | G = 16, proportional to 1/AMCLK | 4 | ||
| Differential Input Impedance | ZIN | 33 | kΩ | G = 32, proportional to 1/AMCLK | 4 | ||
| Signal-to-Noise and Distortion Ratio | SINAD | 92 | 93.5 | dB | Note 1 | 4 | |
| Total Harmonic Distortion | THD | -107 | -103 | dBc | Includes the first 35 harmonics (Note 1) | 4 | |
| Signal-to-Noise Ratio | SNR | 92 | 94 | dB | Note 1 | 4 | |
| Internal Voltage Reference Tolerance | VREF | 1.176 | 1.2 | 1.224 | V | VREFEXT = 0, TA = +25°C only | 5 |
| Differential Input Voltage Range (VREF+, VREF-) | VREF | 1.1 | 1.3 | V | VREFEXT = 1 | 5 | |
| Absolute Voltage REFIN- Pin | VREF- | -0.1 | 0.1 | V | REFIN- should be connected to AGND when VREFEXT = 0 | 5 | |
| Voltage Reference Input Capacitance | 10 | pF | 5 | ||||
| Master Clock Input Frequency Range | fMCLK | 20 | MHz | CLKEXT = 1 (Note 7) | 5 | ||
| Crystal Oscillator Operating Frequency Range | fXTAL | 1 | 20 | MHz | CLKEXT = 0 (Note 7) | 5 | |
| Analog Master Clock | AMCLK | 16 | MHz | (Note 7) | 5 | ||
| Operating Voltage, Analog | AVDD | 2.7 | 3.6 | V | 5 | ||
| Operating Voltage, Digital | DVDD | 2.7 | 3.6 | V | 5 | ||
| Operating Current, Analog | IDD,A | 2.8 | 4 | mA | BOOST[1:0] = 00 (Note 2) | 5 | |
| Operating Current, Analog | IDD,A | 3.4 | 4.5 | mA | BOOST[1:0] = 01 (Note 2) | 5 | |
| Operating Current, Analog | IDD,A | 4.7 | 6.4 | mA | BOOST[1:0] = 10 (Note 2) | 5 | |
| Operating Current, Analog | IDD,A | 8.1 | 11.8 | mA | BOOST[1:0] = 11 (Note 2) | 5 | |
| Operating Current, Digital | IDD,D | 0.28 | 0.6 | mA | MCLK = 4 MHz, proportional to MCLK (Note 2) | 6 | |
| Shutdown Current, Analog | IDDS,A | 0.01 | 2 | µA | AVDD pin only (Notes 3 and 8) | 6 | |
| Shutdown Current, Digital | IDDS,D | 0.01 | 4 | µA | DVDD pin only (Notes 3 and 8) | 6 | |
| Input Leakage Current | ILI | -1 | 1 | µA | CS = DVDD, VIN = DGND to DVDD | 6 | |
| Output Leakage Current | ILO | -1 | 1 | µA | CS = DVDD, VOUT = DGND or DVDD | 6 | |
| Internal Capacitance (All Inputs and Outputs) | CINT | 7 | pF | TA = +25°C, SCK = 1.0 MHz, DVDD =3.3V (Note 1) | 6 | ||
| Serial Clock Frequency | fSCK | 20 | MHz | 7 | |||
| CS Setup Time | tCSS | 25 | ns | 7 | |||
| CS Hold Time | tCSH | 50 | ns | 7 | |||
| CS Disable Time | tCSD | 50 | ns | 7 | |||
| Data Setup Time | tSU | 5 | ns | 7 | |||
| Data Hold Time | tHD | 10 | ns | 7 | |||
| Serial Clock High Time | tHI | 20 | ns | 7 | |||
| Serial Clock Low Time | tLO | 20 | ns | 7 | |||
| Serial Clock Delay Time | tCLD | 50 | ns | 7 | |||
| Serial Clock Enable Time | tCLE | 50 | ns | 7 | |||
| Output Valid from SCK Low | tDO | 25 | ns | 7 | |||
| Output Hold Time | tHO | 0 | ns | Note 1 | 7 | ||
| Output Disable Time | tDIS | 25 | ns | Note 1 | 7 | ||
| Reset Pulse Width (RESET) | tMCLR | 100 | ns | 7 | |||
| Data Transfer Time to DR (Data Ready) | tDODR | 25 | ns | Note 2 | 7 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | Note 1 | 7 | |
| Thermal Resistance, 28-Lead QFN | θJA | 41 | °C/W | 7 | |||
| Temperature Coefficient of internal voltage reference | TCVREF | 9 | ppm/°C | TA = -40°C to +125°C, VREFEXT = 0, VREFCAL[7:0] = 0x50 | 5 | ||
| Measurement Error | ME | 0.1 | % | Measured with a 10,000:1 dynamic range (from 600 mVPeak to 60 µVPeak), AVDD = DVDD = 3V | 4 |
CAD (KiCad official)
- Symbol:
MCP3912A1-E - Footprint:
Package_DFN_QFN:QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm - 3D model: QFN-28(5x5) (KiCad packages3D, STEP)
- 3D model files:
mcp3912a1-e-etched.step/mcp3912a1-e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp3912a1-e.step/mcp3912a1-e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (84 pp, sha256
ccb784a37702432f, retrieved 2026-10-24, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MCP3912A1-E
**Microchip Tech** · Analog To Digital Converters (ADCs) · QFN-28(5x5)
MCP3912A1-E from Microchip Tech, in a QFN-28(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CH1- | input | Inverting analog input for channel 1; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 2 | CH1+ | input | Noninverting analog input for channel 1; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 3 | CH2+ | input | Noninverting analog input for channel 2; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 4 | CH2- | input | Inverting analog input for channel 2; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 5 | CH3- | input | Inverting analog input for channel 3; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 6 | CH3+ | input | Noninverting analog input for channel 3; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 7 | NC | unconnected | No connect; for better EMI results, connect to AGND. |
| 8 | REFIN+/OUT | bidirectional | Noninverting voltage reference input and internal reference output; internal reference has minimal drive capability and needs buffering and a 0.1 µF ceramic bypass if used as a source. |
| 9 | REFIN- | input | Inverting voltage reference input; connect directly to AGND when using the internal or a single-ended reference. |
| 10 | AGND | power_in | Analog ground, return path for internal analog circuitry; star-connect with pin 26 and to the same node as DGND. |
| 11 | AVDD | power_in | Analog power supply, 2.7V to 3.6V; connect with pin 25 and bypass with 10 µF in parallel with 0.1 µF ceramic. |
| 12 | DVDD | power_in | Digital power supply pin, 2.7V to 3.6V. |
| 13 | DGND | power_in | Digital ground, return path for internal digital circuitry; star-connect with pins 15 and 23 and to the same node as AGND. |
| 14 | DR | output | Data ready output giving an active-low pulse of half a DMCLK period when new ADC data are available; high-impedance or logic high when inactive per DR_HIZ. |
| 15 | DGND | power_in | Digital ground, return path for internal digital circuitry; star-connect with pins 13 and 23. |
| 16 | OSC1/CLKI | input | Oscillator crystal connection or external clock input. |
| 17 | OSC2 | passive | Oscillator crystal connection pin. |
| 18 | CS | input | Serial interface chip select input; falling edge starts and rising edge ends an SPI communication, SDO is high-impedance when CS is high. |
| 19 | SCK | input | Serial interface clock input for SPI Mode 0,0 and 1,1, up to 20 MHz. |
| 20 | SDO | tri_state | Serial interface data output clocked out on the falling edge of SCK; high-impedance when CS is high. |
| 21 | SDI | input | Serial interface data input latched on the rising edge of SCK. |
| 22 | RESET | input | Master reset logic input acting as a hard reset to the default power-up configuration. |
| 23 | DGND | power_in | Digital ground, return path for internal digital circuitry; star-connect with pins 13 and 15. |
| 24 | DVDD | power_in | Digital power supply pin, 2.7V to 3.6V. |
| 25 | AVDD | power_in | Analog power supply, 2.7V to 3.6V; connect with pin 11 and bypass with 10 µF in parallel with 0.1 µF ceramic. |
| 26 | AGND | power_in | Analog ground, return path for internal analog circuitry; star-connect with pin 10 and to the same node as DGND. |
| 27 | CH0+ | input | Noninverting analog input for channel 0; linear range is ±600 mV/GAIN with VREF = 1.2V. |
| 28 | CH0- | input | Inverting analog input for channel 0; max absolute voltage vs AGND is ±1V with no distortion and ±2V with no breakdown. |
| 29 | EP | passive | Exposed thermal pad; must be connected to AGND or floating. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-28(5x5) |
| Category | ADC/DAC/Data Conversion |
| Pins | 29 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VDD (absolute maximum) | VDD | -0.3 | | 4 | V | | 3 |
| Digital inputs and outputs w.r.t. AGND | | -0.3 | | 4 | V | | 3 |
| Analog input w.r.t. AGND | | -2 | | 2 | V | | 3 |
| Storage temperature | | -65 | | 150 | °C | | 3 |
| Ambient temp. with power applied | | -65 | | 125 | °C | | 3 |
| Soldering temperature of leads | | | | 300 | °C | 10 seconds | 3 |
| VREF input w.r.t. AGND (min only; max is VDD + 0.6 V) | | -0.6 | | | V | | 3 |
| Resolution (No Missing Codes) | | 24 | | | bits | OSR = 256 or greater | 3 |
| Sampling Frequency | fS(DMCLK) | | 1 | 4 | MHz | For maximum condition, BOOST[1:0] = 11 | 3 |
| Output Data Rate | fD(DRCLK) | | 4 | 125 | ksps | For maximum condition, BOOST[1:0] = 11, OSR = 32 | 3 |
| Analog Input Absolute Voltage on CHn+/- Pins | CHn+/- | -1 | | 1 | V | All analog input channels measured to AGND | 3 |
| Offset Error | VOS | -2 | 0.2 | 2 | mV | Note 5 | 3 |
| Gain Error | GE | -6 | | 6 | % | Note 5 | 3 |
| Differential Input Impedance | ZIN | 232 | | | kΩ | G = 1, proportional to 1/AMCLK | 4 |
| Differential Input Impedance | ZIN | 142 | | | kΩ | G = 2, proportional to 1/AMCLK | 4 |
| Differential Input Impedance | ZIN | 72 | | | kΩ | G = 4, proportional to 1/AMCLK | 4 |
| Differential Input Impedance | ZIN | 38 | | | kΩ | G = 8, proportional to 1/AMCLK | 4 |
| Differential Input Impedance | ZIN | 36 | | | kΩ | G = 16, proportional to 1/AMCLK | 4 |
| Differential Input Impedance | ZIN | 33 | | | kΩ | G = 32, proportional to 1/AMCLK | 4 |
| Signal-to-Noise and Distortion Ratio | SINAD | 92 | 93.5 | | dB | Note 1 | 4 |
| Total Harmonic Distortion | THD | | -107 | -103 | dBc | Includes the first 35 harmonics (Note 1) | 4 |
| Signal-to-Noise Ratio | SNR | 92 | 94 | | dB | Note 1 | 4 |
| Internal Voltage Reference Tolerance | VREF | 1.176 | 1.2 | 1.224 | V | VREFEXT = 0, TA = +25°C only | 5 |
| Differential Input Voltage Range (VREF+, VREF-) | VREF | 1.1 | | 1.3 | V | VREFEXT = 1 | 5 |
| Absolute Voltage REFIN- Pin | VREF- | -0.1 | | 0.1 | V | REFIN- should be connected to AGND when VREFEXT = 0 | 5 |
| Voltage Reference Input Capacitance | | | | 10 | pF | | 5 |
| Master Clock Input Frequency Range | fMCLK | | | 20 | MHz | CLKEXT = 1 (Note 7) | 5 |
| Crystal Oscillator Operating Frequency Range | fXTAL | 1 | | 20 | MHz | CLKEXT = 0 (Note 7) | 5 |
| Analog Master Clock | AMCLK | | | 16 | MHz | (Note 7) | 5 |
| Operating Voltage, Analog | AVDD | 2.7 | | 3.6 | V | | 5 |
| Operating Voltage, Digital | DVDD | 2.7 | | 3.6 | V | | 5 |
| Operating Current, Analog | IDD,A | | 2.8 | 4 | mA | BOOST[1:0] = 00 (Note 2) | 5 |
| Operating Current, Analog | IDD,A | | 3.4 | 4.5 | mA | BOOST[1:0] = 01 (Note 2) | 5 |
| Operating Current, Analog | IDD,A | | 4.7 | 6.4 | mA | BOOST[1:0] = 10 (Note 2) | 5 |
| Operating Current, Analog | IDD,A | | 8.1 | 11.8 | mA | BOOST[1:0] = 11 (Note 2) | 5 |
| Operating Current, Digital | IDD,D | | 0.28 | 0.6 | mA | MCLK = 4 MHz, proportional to MCLK (Note 2) | 6 |
| Shutdown Current, Analog | IDDS,A | | 0.01 | 2 | µA | AVDD pin only (Notes 3 and 8) | 6 |
| Shutdown Current, Digital | IDDS,D | | 0.01 | 4 | µA | DVDD pin only (Notes 3 and 8) | 6 |
| Input Leakage Current | ILI | -1 | | 1 | µA | CS = DVDD, VIN = DGND to DVDD | 6 |
| Output Leakage Current | ILO | -1 | | 1 | µA | CS = DVDD, VOUT = DGND or DVDD | 6 |
| Internal Capacitance (All Inputs and Outputs) | CINT | | | 7 | pF | TA = +25°C, SCK = 1.0 MHz, DVDD =3.3V (Note 1) | 6 |
| Serial Clock Frequency | fSCK | | | 20 | MHz | | 7 |
| CS Setup Time | tCSS | 25 | | | ns | | 7 |
| CS Hold Time | tCSH | 50 | | | ns | | 7 |
| CS Disable Time | tCSD | 50 | | | ns | | 7 |
| Data Setup Time | tSU | 5 | | | ns | | 7 |
| Data Hold Time | tHD | 10 | | | ns | | 7 |
| Serial Clock High Time | tHI | 20 | | | ns | | 7 |
| Serial Clock Low Time | tLO | 20 | | | ns | | 7 |
| Serial Clock Delay Time | tCLD | 50 | | | ns | | 7 |
| Serial Clock Enable Time | tCLE | 50 | | | ns | | 7 |
| Output Valid from SCK Low | tDO | | | 25 | ns | | 7 |
| Output Hold Time | tHO | 0 | | | ns | Note 1 | 7 |
| Output Disable Time | tDIS | | | 25 | ns | Note 1 | 7 |
| Reset Pulse Width (RESET) | tMCLR | 100 | | | ns | | 7 |
| Data Transfer Time to DR (Data Ready) | tDODR | | | 25 | ns | Note 2 | 7 |
| Operating Temperature Range | TA | -40 | | 125 | °C | Note 1 | 7 |
| Thermal Resistance, 28-Lead QFN | θJA | | 41 | | °C/W | | 7 |
| Temperature Coefficient of internal voltage reference | TCVREF | | 9 | | ppm/°C | TA = -40°C to +125°C, VREFEXT = 0, VREFCAL[7:0] = 0x50 | 5 |
| Measurement Error | ME | | 0.1 | | % | Measured with a 10,000:1 dynamic range (from 600 mVPeak to 60 µVPeak), AVDD = DVDD = 3V | 4 |
## CAD (KiCad official)
- Symbol: `MCP3912A1-E`
- Footprint: `Package_DFN_QFN:QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm`
- 3D model: QFN-28(5x5) (KiCad packages3D, STEP)
- 3D model files: `mcp3912a1-e-etched.step` / `mcp3912a1-e-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mcp3912a1-e.step` / `mcp3912a1-e.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](docs/mcp3912a1-e-datasheet.pdf) (84 pp, sha256 `ccb784a37702432f`, retrieved 2026-10-24, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mcp3912a1-e-datasheet.pdf)