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MCP3302-BI

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Microchip Tech Analog To Digital Converters (ADCs), TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentadc-dac-data conversionmcp3302-bifactory-2.0.0extractor-text

Verified MCP3302-BI

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 14 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MCP3302-BI · TSSOP-14 · 14 pins
  • ✓copper: 14 copper pads, none touching another net
  • ✓datasheet: all 14 pin names found in the 48-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: TSSOP-14_4.4x5mm_P0.65mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-7lf01kp4/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 14 pins = 14 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 14 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ mcp3302-bi.kicad_sym✓ mcp3302-bi.kicad_mod✓ mcp3302-bi.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 6d ago
viewers mcp3302-bi: viewers · Ray 6d ago
mcp3302-bi-etched.glb Publish 0.1.0 · Ray 6d ago
mcp3302-bi-etched.step mcp3302-bi: factory component page (tier=mfr) · Ray 6d ago
mcp3302-bi-hero.glb mcp3302-bi: hero GLB from the etched model (keeps the MPN mark) · Ray 6d ago
mcp3302-bi-hero.overlay.json Publish 0.1.0 · Ray 6d ago
mcp3302-bi.glb Publish 0.1.0 · Ray 6d ago
mcp3302-bi.kicad_mod Publish 0.1.0 · Ray 6d ago
mcp3302-bi.kicad_sym Publish 0.1.0 · Ray 6d ago
mcp3302-bi.lbr Publish 0.1.0 · Ray 6d ago
mcp3302-bi.step Publish 0.1.0 · Ray 6d ago
package.json Publish 0.1.0 · Ray 6d ago
page.json Set visibility: public · Ray 6d ago
README.md Publish 0.1.0 · Ray 6d ago
verification.json Verified: Published by the parts factory: tier mfr, 14 pins · Ray 6d ago

MCP3302-BI

Microchip Tech · Analog To Digital Converters (ADCs) · TSSOP-14

MCP3302-BI from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CH0 input Analog input channel 0 with absolute voltage range of VSS - 0.3V to VDD + 0.3V.
2 CH1 input Analog input channel 1 with absolute voltage range of VSS - 0.3V to VDD + 0.3V.
3 CH2 input Analog input channel 2 with absolute voltage range of VSS - 0.3V to VDD + 0.3V.
4 CH3 input Analog input channel 3 with absolute voltage range of VSS - 0.3V to VDD + 0.3V; differential input magnitude cannot exceed VREF - 1 LSB.
5 NC unconnected No connection.
6 NC unconnected No connection.
7 DGND power_in Digital ground to internal digital circuitry; must be connected to the same ground as AGND.
8 CS/SHDN input Chip select/shutdown input: pulled low initiates communication, pulled high ends a conversion and enters low-power standby, and must be pulled high between conversions.
9 DIN input SPI serial data input used to clock in input channel configuration data, latched on the rising edge of the clock.
10 DOUT output SPI serial data output that shifts out the A/D conversion result, changing on the falling edge of each clock.
11 CLK input SPI serial clock that initiates a conversion and clocks out each bit of the conversion result.
12 AGND power_in Analog ground to internal analog circuitry; must be connected to the same ground as DGND.
13 VREF power_in Reference voltage input that sets the maximum analog input range and LSB size (LSB = 2 x VREF / 8192).
14 VDD power_in +4.5V to 5.5V power supply for specified conversion performance, with a 0.1 µF ceramic bypass capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-14
Category ADC/DAC/Data Conversion
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute max) VDD 7 V 3
Storage temperature -65 150 °C 3
Ambient temp. with power applied -65 125 °C 3
Maximum junction temperature 150 °C 3
ESD protection on all pins (HBM) 4 kV HBM 3
Operating voltage VDD 4.5 5.5 V Note 9 5
Maximum sampling frequency FSAMPLE 100 ksps See FCLK specification. Note 8 3
Integral nonlinearity INL -1 0.5 1 LSB MCP3302/04-B; typ printed ±0.5 3
Differential nonlinearity DNL -1 0.5 1 LSB Monotonic over temperature; typ printed ±0.5 3
Positive gain error -3 -0.75 2 LSB 3
Negative gain error -3 -0.5 2 LSB 3
Offset error -3 3 6 LSB 3
Reference input voltage range 0.4 5.5 V Note 2; max printed as VDD 3
Reference current drain 100 150 µA 3
Reference current drain (CS high) 0.001 3 µA CS = VDD = 5V 3
Analog input leakage current -1 0.001 1 µA 4
High level output voltage VOH 4.1 V IOH = -1 mA, VDD = 4.5V 4
Low level output voltage VOL 0.4 V IOL = 1 mA, VDD = 4.5V 4
Input leakage current ILI -10 10 µA VIN = VSS or VDD 4
Output leakage current ILO -10 10 µA VOUT = VSS or VDD 4
Pin capacitance CIN, COUT 10 pF TA = +25°C, F = 1 MHz, Note 1 4
Operating current IDD 300 450 µA VDD, VREF = 5V, DOUT unloaded 5
Standby current IDDS 0.05 1 µA CS = VDD = 5.0V 5
Clock frequency FCLK 0.105 2.1 MHz VDD = 5V, FSAMPLE = 100 ksps 4
Clock high time THI 210 ns Note 5 4
Clock low time TLO 210 ns Note 5 4
CS fall to first rising CLK edge TSUCS 100 ns 4
Data in setup time TSU 50 ns 4
Data in hold time THD 50 ns 4
CLK fall to output data valid TDO 125 ns VDD = 5V, see Figure 1-2 4
CLK fall to output enable TEN 125 ns VDD = 5V, see Figure 1-2 4
CS rise to output disable TDIS 100 ns See test circuits, Figure 1-2 Note 1 4
CS disable time TCSH 475 ns 4
DOUT rise time TR 100 ns See test circuits, Figure 1-2 Note 1 4
DOUT fall time TF 100 ns See test circuits, Figure 1-2 Note 1 4
Specified temperature range TA -40 125 °C 5
Operating temperature range TA -40 125 °C 5
Storage temperature range TA -65 150 °C 5
Thermal resistance, 14L-TSSOP θJA 100 °C/W 5
Total harmonic distortion THD -91 dB Note 3 3
Signal-to-noise and distortion SINAD 78 dB Note 3 3
Spurious free dynamic range SFDR 92 dB Note 3 3
Common mode rejection CMRR 79 dB Note 6 3
Power supply rejection PSR 74 dB Note 4 3
Switch resistance RS 1 kΩ See Figure 5-3 4
Sample capacitor CSAMPLE 25 pF See Figure 5-3 4

CAD (KiCad official)

  • Symbol: MCP3302-BI
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: mcp3302-bi-etched.step / mcp3302-bi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp3302-bi.step / mcp3302-bi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (48 pp, sha256 bd5671e61167c4eb, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF