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MCP1700T-5002E

Microchip Tech · Linear Voltage Regulators (LDO) · SOT-23

MCP1700T-5002E from Microchip Tech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Regulator ground, tied to the negative side of the output and input capacitors, carrying only the 1.6 µA typical LDO bias current, and it is the reference for output regulation.
2 VOUT power_out Regulated voltage output, connected to the positive side of the load and output capacitor (1 µF stable), carrying the DC load current up to 250 mA for VOUT ≥ 2.5V.
3 VIN power_in Unregulated supply input accepting 2.3V to 6.0V, needing low source impedance with typically 1 µF of input capacitance for stable operation.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 2.3 6 V Note 1 3
Input Quiescent Current Iq 1.6 4 µA IL = 0 mA, VIN = VR + 1V 3
Maximum Output Current IOUT_mA 250 mA For VR ≥ 2.5V 3
Output Short Circuit Current IOUT_SC 408 mA VIN = VR + 1V, VOUT = GND; peak current measured 10 ms after short is applied 3
Output Voltage Regulation (25°C) VOUT -2 0.4 2 % Note 2; relative to VR; typ ±0.4% 3
Output Voltage Regulation (TJ -40 to +125°C) VOUT -3 3 % Note 2; boldface, TJ -40°C to +125°C; relative to VR 3
Line Regulation ΔVOUT/(VOUT×ΔVIN) -1 0.75 1 %/V (VR + 1)V ≤ VIN ≤ 6V; typ ±0.75 3
Load Regulation ΔVOUT/VOUT -1.5 1 1.5 % IL = 0.1 mA to 250 mA for VR ≥ 2.5V, Note 4; typ ±1.0 3
Dropout Voltage VIN-VOUT 178 350 mV VR ≥ 2.5V, IL = 250 mA, Note 1, Note 5 3
VOUT Temperature Coefficient TCVOUT 50 ppm/°C Note 3 3
Output Rise Time TR 500 µs 10% VR to 90% VR, VIN = 0V to 6V, RL = 50 Ω resistive 3
Output Noise eN 3 µV/√Hz IL = 100 mA, f = 1 kHz, COUT = 1 µF 4
Power Supply Ripple Rejection Ratio PSRR 44 dB f = 100 Hz, COUT = 1 µF, IL = 50 mA, VINAC = 100 mV pk-pk, CIN = 0 µF, VR = 1.2V 4
Thermal Shutdown Protection TSD 140 °C VIN = VR + 1V, IL = 100 µA 4
Specified Temperature Range TA -40 125 °C 4
Operating Temperature Range TJ -40 125 °C 4
Storage Temperature Range TA -65 150 °C 4
Supply Voltage VDD 6.5 V 3
Input/Output Pin Voltage -0.3 0.3 V All inputs and outputs w.r.t. (VSS - 0.3V) to (VIN + 0.3V) 3
Storage Temperature -65 150 °C 3
Maximum Junction Temperature TJ 150 °C 3
Operating Junction Temperature TJ -40 125 °C 3
ESD protection HBM 4 kV HBM, all pins 3
ESD protection MM 400 V MM, all pins 3
Thermal Resistance, SOT-23 Junction to Ambient θJA 212 °C/W EIA/JEDEC JESD51-7 FR-4 4-Layer Board 4
Thermal Resistance, SOT-23 Junction to Case (Top) θJC(Top) 139 °C/W EIA/JEDEC JESD51-7 FR-4 4-Layer Board 4
Thermal Resistance, SOT-23 Junction to Case (Bottom) θJC(Bottom) 11.95 °C/W EIA/JEDEC JESD51-7 FR-4 4-Layer Board 4
Thermal Resistance, SOT-23 Junction to Top ψJT 6.15 °C/W EIA/JEDEC JESD51-7 FR-4 4-Layer Board 4

CAD (KiCad official)

  • Symbol: MCP1700T-5002E
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mcp1700t-5002e-etched.step / mcp1700t-5002e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1700t-5002e.step / mcp1700t-5002e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (32 pp, sha256 44919ee695b5d6ef, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF