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MCP1700-3002E

Microchip Tech · IC · TO-92-3

MCP1700-3002E from Microchip Tech, in a TO-92-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Regulator ground; tie to the negative side of the output and input capacitors, only the 1.6 µA typical LDO bias current flows out of this pin and output regulation is referenced to it.
2 VIN power_in Unregulated supply voltage input (2.3V to 6.0V operating range); connect to the input source with about 1 µF of capacitance for stable operation.
3 VOUT power_out Regulated voltage output; connect to the positive side of the load and output capacitor, and the current flowing out equals the DC load current (up to 250 mA for VOUT ≥ 2.5V).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TO-92-3
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Operating Voltage VIN 2.3 6 V Note 1 3
Input Quiescent Current Iq 1.6 4 µA IL = 0 mA, VIN = VR +1V 3
Maximum Output Current IOUT_mA 250 mA For VR ≥ 2.5V 3
Output Voltage Regulation (over TJ) VOUT -3 3 % Note 2; VR-3.0% to VR+3.0% (boldface, TJ -40°C to +125°C) 3
Output Voltage Regulation (25°C) VOUT -2 0.4 2 % Note 2; VR-2.0% to VR+2.0%, typ VR±0.4 3
Line Regulation ΔVOUT/(VOUT×ΔVIN) -1 0.75 1 %/V (VR+1)V ≤ VIN ≤ 6V; typ ±0.75 3
Load Regulation ΔVOUT/VOUT -1.5 1 1.5 % IL = 0.1 mA to 250 mA for VR ≥ 2.5V, Note 4; typ ±1.0 3
Dropout Voltage VR > 2.5V VIN-VOUT 178 350 mV IL = 250 mA, (Note 1, Note 5) 3
Specified Temperature Range TA -40 125 °C 4
Operating Temperature Range TA -40 125 °C 4
Storage Temperature Range TA -65 150 °C 4
Maximum Supply Voltage VDD 6.5 V 3
Maximum Junction Temperature TJ 150 °C 3
Operating Junction Temperature TJ -40 125 °C 3
Input/Output pin voltage -0.3 0.3 V All inputs and outputs w.r.t. (VSS-0.3V) to (VIN+0.3V) 3
ESD protection HBM 4 kV ≥ 4 kV, all pins 3
ESD protection MM 400 V ≥ 400V, all pins 3
Thermal Resistance, TO-92 θJA 131.9 °C/W EIA/JEDEC JESD51-751-7 4-Layer Board 4
Output Short Circuit Current IOUT_SC 408 mA VIN = VR + V, VOUT = GND, peak current measured 10 ms after short is applied 3
VOUT Temperature Coefficient TCVOUT 50 ppm/°C Note 3 3
Output Rise Time TR 500 µs 10% VR to 90% VR VIN = 0V to 6V, RL = 50Ω resistive 3
Output Noise eN 3 µV/(Hz)1/2 IL = 100 mA, f = 1 kHz, COUT = 1 µF 3
Thermal Shutdown Protection TSD 140 °C VIN = VR + 1, IL = 100 µA 4

CAD (KiCad official)

  • Symbol: MCP1700-3002E
  • Footprint: Package_TO_SOT_THT:TO-92_Inline
  • 3D model: TO-92-3 (KiCad packages3D, STEP)
  • 3D model files: mcp1700-3002e-etched.step / mcp1700-3002e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1700-3002e.step / mcp1700-3002e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (24 pp, sha256 8b0857ed5a391656, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF