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MCP1640T-I

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Microchip Tech DC-DC Converters, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MCP1640T-I

Microchip Tech · DC-DC Converters · SOT-23-6

MCP1640T-I from Microchip Tech, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW passive Switch node connecting the boost inductor from the input voltage; carries inductor current up to 800 mA peak, joining the internal N-Channel switch drain and P-Channel switch source.
2 GND power_in Ground/return pin for circuit ground; keep traces from input cap return, output cap return and GND pin as short as possible to minimize noise.
3 EN input Logic-level enable input where logic high (>90% of VIN) enables the regulator output and logic low (<20% of VIN) disables it, lowering quiescent current.
4 VFB input Feedback voltage pin for output regulation via a resistor divider, with 1.21V typical when the output is in regulation.
5 VOUT power_out Output voltage pin connecting the integrated P-Channel MOSFET to the output capacitor, and to which the FB voltage divider is also connected for regulation.
6 VIN power_in Input voltage pin for the source, which should be decoupled to GND with a 4.7 µF minimum capacitor.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23-6
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Minimum Start-Up Voltage VIN 0.65 0.8 V Note 1: 3.3 kΩ resistive load, 3.3VOUT (1 mA) 3
Output Voltage Adjust Range VOUT 2 5.5 V VOUT ≥ VIN; Note 2 3
Feedback Voltage VFB 1.175 1.21 1.245 V 3
Quiescent Current, PFM Mode IQPFM 19 30 µA Measured at VOUT = 4.0V; EN = VIN, IOUT = 0 mA; Note 3 3
Quiescent Current, Shutdown IQSHDN 0.7 2.3 µA VOUT = EN = GND; Includes N-Channel and P-Channel Switch Leakage 3
NMOS Switch Leakage INLK 0.3 1 µA VIN = VSW = 5V; VOUT = 5.5V; VEN = VFB = GND 3
PMOS Switch Leakage IPLK 0.05 0.2 µA VIN = VSW = GND; VOUT = 5.5V 3
NMOS Peak Switch Current Limit IN(MAX) 600 850 mA Note 5 4
VOUT Accuracy VOUT% -3 3 % Includes Line and Load Regulation; VIN = 1.5V 4
Line Regulation ΔVOUT/VOUT/ΔVIN -1 0.01 1 %/V VIN = 1.5V to 3V, IOUT = 25 mA 4
Load Regulation ΔVOUT/VOUT -1 0.01 1 % IOUT = 25 mA to 100 mA; VIN = 1.5V 4
Maximum Duty Cycle DCMAX 88 90 % 4
Switching Frequency fSW 425 500 575 kHz 4
EN Input Logic High VIH 90 % of VIN IOUT = 1 mA 4
EN Input Logic Low VIL 20 % of VIN IOUT = 1 mA 4
Operating Junction Temperature Range TJ -40 125 °C Steady State 4
Storage Temperature Range TA -65 150 °C 4
Maximum Junction Temperature TJ 150 °C Transient 4
EN, VFB, VIN, VSW, VOUT - GND 6.5 V 3
Ambient Temp. with Power Applied -40 85 °C 3
ESD Protection HBM 3 kV All pins 3
Thermal Resistance, 6LD-SOT-23 θJA 190.5 °C/W 4
Minimum Input Voltage After Start-Up VIN 0.35 V Note 1 3
Maximum Output Current IOUT 150 mA 1.2V VIN, 2.0V VOUT 3
Maximum Output Current IOUT 350 mA 3.3V VIN, 5.0V VOUT 3
Quiescent Current, PWM Mode IQPWM 220 µA Measured at VOUT = 4.0V; EN = VIN, IOUT = 0 mA; Note 3 3
NMOS Switch ON Resistance RDS(ON)N 0.6 Ω VIN = 3.3V, ISW = 100 mA 4
PMOS Switch ON Resistance RDS(ON)P 0.9 Ω VIN = 3.3V, ISW = 100 mA 4
Soft-Start Time tSS 750 µS EN Low-to-High, 90% of VOUT; Note 4 4
Thermal Shutdown Die Temperature TSD 150 °C 4
Die Temperature Hysteresis TSDHYS 10 °C 4
Input Capacitor CIN CIN 4.7 µF Recommended range 16
Output Capacitor COUT COUT 10 100 µF Recommended range 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts gold MC =Plastic Dual Flat, No Lead (2x3 DFN), 8-lead *Y = Nickel palladium gold manufacturing designator. 29

CAD (KiCad official)

  • Symbol: MCP1640T-I
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: mcp1640t-i-etched.step / mcp1640t-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1640t-i.step / mcp1640t-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (32 pp, sha256 2cb0a5fd4fc8550b, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF