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MCP14E5-E

Microchip Tech · Gate Drivers · SOIC-8

MCP14E5-E from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ENB_A input Enable control for Output A, active high and internally pulled up to VDD so it can be left floating; Output A is forced off when the pin is pulled below VEN_L (2.0V typical).
2 IN A input Input A is a high-impedance TTL/CMOS compatible input with hysteresis between its high and low input levels.
3 GND power_in Device return pin; it should have a low-impedance connection to the bias supply source return because high peak currents flow out of it when the capacitive load discharges.
4 IN B input Input B is a high-impedance TTL/CMOS compatible input with hysteresis between its high and low input levels.
5 OUT B output Output B is a CMOS push-pull output capable of sourcing and sinking 4.0A peak current (VDD = 18V) with a reverse latch-up rating of 1.5A.
6 VDD power_in Bias supply input with a voltage range of 4.5V to 18V, which must be decoupled to ground with a local ceramic capacitor.
7 OUT A output Output A is a CMOS push-pull output capable of sourcing and sinking 4.0A peak current (VDD = 18V) with a reverse latch-up rating of 1.5A.
8 ENB_B input Enable control for Output B, active high and internally pulled up to VDD so it can be left floating; Output B is forced off when the pin is pulled below VEN_L (2.0V typical).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage (Logic 1, High) VIH 2.4 1.5 V TA = +25°C (table header) 3
Input Voltage (Logic 0, Low) VIL 1.3 0.8 V TA = +25°C (table header) 3
Input Current IIN -1 1 µA TA = +25°C; 0V ≤ VIN ≤ VDD 3
Input Voltage VIN -5 V TA = +25°C; maximum printed as VDD+0.3V (expression, not numeric) 3
Low Output Voltage VOL 0.025 V TA = +25°C; DC Test 3
Output Resistance, High ROH 2.5 3.5 Ω TA = +25°C; IOUT = 10 mA, VDD = 18V 3
Output Resistance, Low ROL 2.5 3 Ω TA = +25°C; IOUT = 10 mA, VDD = 18V 3
Rise Time tR 15 30 ns TA = +25°C; Figure 4-1, Figure 4-2; CL = 2200 pF 3
Fall Time tF 18 30 ns TA = +25°C; Figure 4-1, Figure 4-2; CL = 2200 pF 3
Propagation Delay Time (tD1) tD1 46 55 ns TA = +25°C; Figure 4-1, Figure 4-2 3
Propagation Delay Time (tD2) tD2 50 55 ns TA = +25°C; Figure 4-1, Figure 4-2 3
Enable High-Level Input Voltage VEN_H 1.6 1.9 2.9 V TA = +25°C; VDD = 12V, LO to HI Transition 3
Enable Low-Level Input Voltage VEN_L 1.3 2.2 2.4 V TA = +25°C; VDD = 12V, HI to LO Transition 3
Enable Hysteresis VHYST 0.1 0.3 0.6 V TA = +25°C 3
Enable Leakage Current IENBL 40 85 115 µA TA = +25°C; VDD = 12V, ENB_A = ENB_B = GND 3
Supply Voltage VDD 4.5 18 V TA = +25°C 4
Supply Current IDD 1.6 2 mA TA = +25°C; VIN_A = 3V, VIN_B = 3V, ENB_A = ENB_B = High 4
Supply Current IDD 0.6 0.9 mA TA = +25°C; VIN_A = 0V, VIN_B = 0V, ENB_A = ENB_B = High 4
Supply Current IDD 1.2 1.4 mA TA = +25°C; VIN_A = 3V, VIN_B = 0V, ENB_A = ENB_B = High 4
Supply Current IDD 1.4 1.8 mA TA = +25°C; VIN_A = 3V, VIN_B = 3V, ENB_A = ENB_B = Low 4
Supply Current IDD 0.55 0.75 mA TA = +25°C; VIN_A = 0V, VIN_B = 0V, ENB_A = ENB_B = Low 4
Supply Current IDD 1 1.2 mA TA = +25°C; VIN_A = 3V, VIN_B = 0V, ENB_A = ENB_B = Low 4
Input Voltage (Logic 1, High) over temperature VIH 2.4 V Over operating temperature range 5
Input Voltage (Logic 0, Low) over temperature VIL 0.8 V Over operating temperature range 5
Input Current over temperature IIN -10 10 µA Over operating temperature range; 0V ≤ VIN ≤ VDD 5
Low Output Voltage over temperature VOL 0.025 V Over operating temperature range; DC TEST 5
Output Resistance, High over temperature ROH 3 6 Ω Over operating temperature range; IOUT = 10 mA, VDD = 18V 5
Output Resistance, Low over temperature ROL 3 5 Ω Over operating temperature range; IOUT = 10 mA, VDD = 18V 5
Rise Time over temperature tR 25 40 ns Over operating temperature range; Figure 4-1, Figure 4-2; CL = 2200 pF 5
Fall Time over temperature tF 28 40 ns Over operating temperature range; Figure 4-1, Figure 4-2; CL = 2200 pF 5
Delay Time (tD1) over temperature tD1 50 70 ns Over operating temperature range; Figure 4-1, Figure 4-2 5
Delay Time (tD2) over temperature tD2 50 70 ns Over operating temperature range; Figure 4-1, Figure 4-2 5
Enable High-Level Input Voltage over temperature VEN_H 1.6 2.2 2.9 V Over operating temperature range; VDD = 12V, LO to HI Transition 5
Enable Low-Level Input Voltage over temperature VEN_L 1.3 1.8 2.4 V Over operating temperature range; VDD = 12V, HI to LO Transition 5
Enable Leakage Current over temperature IENBL 40 87 115 µA Over operating temperature range; VDD = 12V, ENB_A = ENB_B = GND 5
Supply Current over temperature IDD 2 3 mA Over operating temperature range; VIN_A = 3V, VIN_B = 3V, ENB_A = ENB_B = High 5
Supply Current over temperature IDD 0.8 1.1 mA Over operating temperature range; VIN_A = 0V, VIN_B = 0V, ENB_A = ENB_B = High 5
Supply Current over temperature IDD 1.5 2 mA Over operating temperature range; VIN_A = 3V, VIN_B = 0V, ENB_A = ENB_B = High 5
Supply Current over temperature IDD 1.8 2.8 mA Over operating temperature range; VIN_A = 3V, VIN_B = 3V, ENB_A = ENB_B = Low 5
Supply Current over temperature IDD 0.6 0.8 mA Over operating temperature range; VIN_A = 0V, VIN_B = 0V, ENB_A = ENB_B = Low 5
Supply Current over temperature IDD 1.1 1.8 mA Over operating temperature range; VIN_A = 3V, VIN_B = 0V, ENB_A = ENB_B = Low 5
Supply Voltage (absolute maximum) 20 V 3
Input Current (VIN > VDD) 50 mA VIN > VDD 3
Specified Temperature Range TA -40 125 °C 6
Maximum Junction Temperature TJ 150 °C 6
Storage Temperature Range TA -65 150 °C 6
Thermal Resistance, 8L-SOIC θJA 149.5 °C/W 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN), Narrow, 3.90 mm Body [SOIC] Notes: 18

CAD (KiCad official)

  • Symbol: MCP14E5-E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mcp14e5-e-etched.step / mcp14e5-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp14e5-e.step / mcp14e5-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (26 pp, sha256 22c1a1b5392178e6, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF