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MCP1407-E

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Microchip Tech Gate Drive ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MCP1407-E

Microchip Tech · Gate Drive ICs · SOP-8

MCP1407-E from Microchip Tech, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Supply input for the MOSFET driver with a 4.5V to 18V range, which must be decoupled to ground with local capacitors and connected together with pin 8.
2 INPUT input High-impedance TTL/CMOS-compatible non-inverting control input (MCP1407) with hysteresis, withstanding -5V to VDD+0.3V.
3 NC unconnected No connection.
4 GND power_in Ground return pin that carries high peak discharge currents and must be connected together with pin 5 with a low impedance path to the supply return.
5 GND power_in Ground return pin that carries high peak discharge currents and must be connected together with pin 4 with a low impedance path to the supply return.
6 OUTPUT output CMOS push-pull output sourcing 6A peak (VDD = 18V) with 1.5A reverse current latch-up rating, to be connected together with pin 7.
7 OUTPUT output CMOS push-pull output sourcing 6A peak (VDD = 18V) with 1.5A reverse current latch-up rating, to be connected together with pin 6.
8 VDD power_in Supply input for the MOSFET driver with a 4.5V to 18V range, which must be decoupled to ground with local capacitors and connected together with pin 1.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOP-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Logic 1 High Input Voltage VIH 2.4 1.8 V TA = +25°C, 4.5V ≤ VDD ≤ 18V 4
Logic 0 Low Input Voltage VIL 1.3 0.8 V TA = +25°C, 4.5V ≤ VDD ≤ 18V 4
Input Current IIN -10 10 µA 0V ≤ VIN ≤ VDD 4
Input Voltage VIN -5 V Max printed as VDD+0.3 4
Low Output Voltage VOL 0.025 V DC Test 4
Output Resistance, High ROH 2.1 2.8 Ω IOUT = 10 mA, VDD = 18V 4
Output Resistance, Low ROL 1.5 2.5 Ω IOUT = 10 mA, VDD = 18V 4
Rise Time tR 20 30 ns CL = 2500 pF, Figure 4-1, Figure 4-2 4
Fall Time tF 20 30 ns CL = 2500 pF, Figure 4-1, Figure 4-2 4
Delay Time tD1 40 55 ns Figure 4-1, Figure 4-2 4
Supply Voltage VDD 4.5 18 V 4
Power Supply Current IS 130 250 µA VIN = 3V 4
Power Supply Current IS 35 100 µA VIN = 0V 4
Logic 1 High Input Voltage (over temperature) VIH 2.4 V Operating temperature range, 4.5V ≤ VDD ≤ 18V 5
Logic 0 Low Input Voltage (over temperature) VIL 0.8 V Operating temperature range, 4.5V ≤ VDD ≤ 18V 5
Input Current (over temperature) IIN -10 10 µA 0V ≤ VIN ≤ VDD 5
Input Voltage (over temperature) VIN -5 V Max printed as VDD+0.3 5
Low Output Voltage (over temperature) VOL 0.025 V DC TEST 5
Output Resistance, High (over temperature) ROH 3 5 Ω IOUT = 10 mA, VDD = 18V 5
Output Resistance, Low (over temperature) ROL 2.3 5 Ω IOUT = 10 mA, VDD = 18V 5
Rise Time (over temperature) tR 25 40 ns CL = 2500 pF, Figure 4-1, Figure 4-2 5
Fall Time (over temperature) tF 25 40 ns CL = 2500 pF, Figure 4-1, Figure 4-2 5
Delay Time (over temperature) tD1 50 65 ns Figure 4-1, Figure 4-2 5
Supply Voltage (over temperature) VDD 4.5 18 V 5
Power Supply Current (over temperature) IS 200 500 µA VIN = 3V 5
Power Supply Current (over temperature) IS 50 150 µA VIN = 0V 5
Specified Temperature Range TA -40 125 °C 5
Storage Temperature Range TA -65 150 °C 5
Maximum Junction Temperature TJ 150 °C 5
Supply Voltage (absolute maximum) 20 V 4
Input Voltage (absolute maximum) -5 V Printed as (VDD + 0.3V) to (GND, 5V) 4
Input Current (absolute maximum) 50 mA VIN>VDD 4
Thermal Resistance, 8L-SOIC θJA 155 °C/W 5
Peak Output Current IPK 6 A VDD ≤ 18V (Note 2) 4
Latch-Up Protection Withstand Reverse Current IREV 1.5 A Duty cycle ≤ 2%, t ≤ 300 µsec 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin PA = Plastic DIP, (300 mil body), 8-lead SN = Plastic SOIC (150 mil Body), 8-Lead 25

CAD (KiCad official)

  • Symbol: MCP1407-E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: mcp1407-e-etched.step / mcp1407-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp1407-e.step / mcp1407-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (28 pp, sha256 4621b8975c45a5cb, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF