component
MC74VHC595DR2G
Public Made by Adomby adom
onsemi Shift Registers, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 5d ago |
| viewers | 5d ago |
| mc74vhc595dr2g-etched.glb | 5d ago |
| mc74vhc595dr2g-etched.step | 5d ago |
| mc74vhc595dr2g-hero.glb | 5d ago |
| mc74vhc595dr2g-hero.overlay.json | 5d ago |
| mc74vhc595dr2g.glb | 5d ago |
| mc74vhc595dr2g.kicad_mod | 5d ago |
| mc74vhc595dr2g.kicad_sym | 5d ago |
| mc74vhc595dr2g.lbr | 5d ago |
| mc74vhc595dr2g.step | 5d ago |
| package.json | 5d ago |
| page.json | 5d ago |
| README.md | 5d ago |
MC74VHC595DR2G
onsemi · Shift Registers · SOIC-16
MC74VHC595DR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | QB | tri_state | Parallel data output B of the 3-state storage register; forced to high impedance when OE is high. |
| 2 | QC | tri_state | Parallel data output C of the 3-state storage register; forced to high impedance when OE is high. |
| 3 | QD | tri_state | Parallel data output D of the 3-state storage register; forced to high impedance when OE is high. |
| 4 | QE | tri_state | Parallel data output E of the 3-state storage register; forced to high impedance when OE is high. |
| 5 | QF | tri_state | Parallel data output F of the 3-state storage register; forced to high impedance when OE is high. |
| 6 | QG | tri_state | Parallel data output G of the 3-state storage register; forced to high impedance when OE is high. |
| 7 | QH | tri_state | Parallel data output H of the 3-state storage register; forced to high impedance when OE is high. |
| 8 | GND | power_in | Ground reference pin for the device. |
| 9 | SQH | output | Serial data output taken from the shift register stage H, used for cascading devices. |
| 10 | SCLR | input | Active-low reset of the shift register; a low level clears the shift register contents, and the input tolerates up to 7 V. |
| 11 | SCK | input | Shift clock input; data is shifted into the shift register on its positive-going transition. |
| 12 | RCK | input | Register clock input; the storage register is loaded from the shift register on its positive-going transition. |
| 13 | OE | input | Active-low output enable; a high level forces QA to QH into the high-impedance state, while a low level enables them. |
| 14 | SI | input | Serial data input to the shift register; inputs tolerate voltages up to 7 V. |
| 15 | QA | tri_state | Parallel data output A of the 3-state storage register; forced to high impedance when OE is high. |
| 16 | VCC | power_in | Positive supply pin; the device is designed for a 2.0 V to 5.5 V operating range. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-16 |
| Category | Logic |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage | VCC | 2 | 5.5 | V | 4 | ||
| DC Input Voltage | Vin | 0 | 5.5 | V | 4 | ||
| DC Output Voltage | Vout | 0 | V | 4 | |||
| Operating Temperature, All Package Types | TA | -55 | 125 | °C | 4 | ||
| Input Rise and Fall Time | tr, tf | 0 | 100 | ns/V | VCC = 3.3 V ±0.3 V | 4 | |
| Input Rise and Fall Time | tr, tf | 0 | 20 | ns/V | VCC = 5.0 V ±0.5 V | 4 | |
| DC Supply Voltage (maximum rating) | VCC | -0.5 | 7 | V | 4 | ||
| DC Input Voltage (maximum rating) | Vin | -0.5 | 7 | V | 4 | ||
| DC Output Voltage (maximum rating) | Vout | -0.5 | V | 4 | |||
| Input Diode Current | IIK | -20 | mA | 4 | |||
| Output Diode Current | IOK | -20 | 20 | mA | 4 | ||
| DC Output Current, per Pin | Iout | -25 | 25 | mA | 4 | ||
| DC Supply Current, VCC and GND Pins | ICC | -50 | 50 | mA | 4 | ||
| Power Dissipation in Still Air, SOIC Packages | PD | 500 | mW | Still air, SOIC packages | 4 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 4 | ||
| Minimum High-Level Input Voltage | VIH | 1.5 | V | VCC = 2.0 V, TA = 25°C | 5 | ||
| Minimum High-Level Input Voltage | VIH | 2.1 | V | VCC = 3.0 V, TA = 25°C | 5 | ||
| Minimum High-Level Input Voltage | VIH | 3.15 | V | VCC = 4.5 V, TA = 25°C | 5 | ||
| Minimum High-Level Input Voltage | VIH | 3.85 | V | VCC = 5.5 V, TA = 25°C | 5 | ||
| Maximum Low-Level Input Voltage | VIL | 0.59 | V | VCC = 2.0 V, TA = 25°C | 5 | ||
| Maximum Low-Level Input Voltage | VIL | 0.9 | V | VCC = 3.0 V, TA = 25°C | 5 | ||
| Maximum Low-Level Input Voltage | VIL | 1.35 | V | VCC = 4.5 V, TA = 25°C | 5 | ||
| Maximum Low-Level Input Voltage | VIL | 1.65 | V | VCC = 5.5 V, TA = 25°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 1.9 | V | VIN = VIH or VIL, IOH = −50 μA, VCC = 2.0 V, TA = 25°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 2.9 | V | VIN = VIH or VIL, IOH = −50 μA, VCC = 3.0 V, TA = 25°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 4.4 | V | VIN = VIH or VIL, IOH = −50 μA, VCC = 4.5 V, TA = 25°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 2.58 | V | VIN = VIH or VIL, IOH = −4 mA, VCC = 3.0 V, TA = 25°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 3.94 | V | VIN = VIH or VIL, IOH = −8 mA, VCC = 4.5 V, TA = 25°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 2.34 | V | VIN = VIH or VIL, IOH = −4 mA, VCC = 3.0 V, TA = 125°C | 5 | ||
| Minimum High-Level Output Voltage | VOH | 3.66 | V | VIN = VIH or VIL, IOH = −8 mA, VCC = 4.5 V, TA = 125°C | 5 | ||
| Maximum Low-Level Output Voltage | VOL | 0 | 0.1 | V | VIN = VIH or VIL, IOL = 50 μA, VCC = 2.0 V, TA = 25°C | 5 | |
| Maximum Low-Level Output Voltage | VOL | 0.36 | V | VIN = VIH or VIL, IOL = 4 mA, VCC = 3.0 V, TA = 25°C | 5 | ||
| Maximum Low-Level Output Voltage | VOL | 0.52 | V | VIN = VIH or VIL, IOL = 4 mA, VCC = 3.0 V, TA = 125°C | 5 | ||
| Maximum Input Leakage Current | IIN | -0.1 | 0.1 | μA | VIN = 5.5 V or GND, 0 to 5.5 V, TA = 25°C | 5 | |
| Maximum Input Leakage Current | IIN | -1 | 1 | μA | VIN = 5.5 V or GND, 0 to 5.5 V, TA = 125°C | 5 | |
| Maximum Quiescent Supply Current | ICC | 4 | μA | VIN = VCC or GND, VCC = 5.5 V, TA = 25°C | 5 | ||
| Maximum Quiescent Supply Current | ICC | 40 | μA | VIN = VCC or GND, VCC = 5.5 V, TA = 125°C | 5 | ||
| Three-State Output Off-State Current | IOZ | -0.25 | 0.25 | μA | VIN = VIH or VIL, VOUT = VCC or GND, VCC = 5.5 V, TA = 25°C | 5 | |
| Three-State Output Off-State Current | IOZ | -2.5 | 2.5 | μA | VIN = VIH or VIL, VOUT = VCC or GND, VCC = 5.5 V, TA = 125°C | 5 | |
| Maximum Clock Frequency (50% Duty Cycle) | fmax | 80 | 150 | MHz | VCC = 3.3 ± 0.3 V, TA = 25°C | 6 | |
| Maximum Clock Frequency (50% Duty Cycle) | fmax | 135 | 185 | MHz | VCC = 5.0 ± 0.5 V, TA = 25°C | 6 | |
| Maximum Clock Frequency (50% Duty Cycle) | fmax | 70 | MHz | VCC = 3.3 ± 0.3 V, TA = 125°C | 6 | ||
| Maximum Clock Frequency (50% Duty Cycle) | fmax | 115 | MHz | VCC = 5.0 ± 0.5 V, TA = 125°C | 6 | ||
| Propagation Delay, SCK to SQH | tPLH, tPHL | 8.8 | 13 | ns | VCC = 3.3 ± 0.3 V, CL = 15 pF, TA = 25°C | 6 | |
| Propagation Delay, SCK to SQH | tPLH, tPHL | 11.3 | 16.5 | ns | VCC = 3.3 ± 0.3 V, CL = 50 pF, TA = 25°C | 6 | |
| Propagation Delay, SCK to SQH | tPLH, tPHL | 6.2 | 8.2 | ns | VCC = 5.0 ± 0.5 V, CL = 15 pF, TA = 25°C | 6 | |
| Propagation Delay, SCK to SQH | tPLH, tPHL | 7.7 | 10.2 | ns | VCC = 5.0 ± 0.5 V, CL = 50 pF, TA = 25°C | 6 | |
| Input Capacitance | CIN | 4 | 10 | pF | TA = 25°C | 6 | |
| Three-State Output Capacitance (Output in High-Impedance State), QA-QH | COUT | 6 | 10 | pF | Output in high-impedance state, TA = 25°C | 6 | |
| Quiet Output Maximum Dynamic VOL | VOLP | 0.8 | 1 | V | tr = tf = 3.0 ns, CL = 50 pF, VCC = 5.0 V, TA = 25°C | 6 | |
| Quiet Output Minimum Dynamic VOL | VOLV | -1 | -0.8 | V | tr = tf = 3.0 ns, CL = 50 pF, VCC = 5.0 V, TA = 25°C | 6 | |
| Setup Time, SI to SCK | tsu | 3.5 | ns | VCC = 3.3 V, TA = −55 to 125°C | 7 | ||
| Setup Time, SI to SCK | tsu | 3 | ns | VCC = 5.0 V, TA = −55 to 125°C | 7 | ||
| Pulse Width, SCK or RCK | tw | 5 | ns | VCC = 3.3 V, TA = −55 to 125°C | 7 | ||
| Thermal Derating, SOIC Packages | -7 | mW/°C | From 65 to 125°C | 4 |
CAD (KiCad official)
- Symbol:
MC74VHC595DR2G - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
mc74vhc595dr2g-etched.step/mc74vhc595dr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74vhc595dr2g.step/mc74vhc595dr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (11 pp, sha256
a7ed400791f6e932, retrieved 2026-10-18, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).