component
MC74VHC244DTG
Public Made by Adomby adom
onsemi Buffers / Drivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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MC74VHC244DTG
onsemi · Buffers / Drivers · TSSOP-20
MC74VHC244DTG from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OEA | input | Active-low output enable for the YA1-YA4 outputs; when high, the YA outputs are placed in the high-impedance (Z) state per the function table. |
| 2 | A1 | input | Data input for buffer 1 of the A bank, passed noninverted to YA1 when OEA is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 3 | YB4 | tri_state | Noninverting 3-state buffer output of the B bank, high-impedance when OEB is high; maximum DC output current is 25 mA per pin. |
| 4 | A2 | input | Data input for buffer 2 of the A bank, passed noninverted to YA2 when OEA is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 5 | YB3 | tri_state | Noninverting 3-state buffer output of the B bank, high-impedance when OEB is high; maximum DC output current is 25 mA per pin. |
| 6 | A3 | input | Data input for buffer 3 of the A bank, passed noninverted to YA3 when OEA is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 7 | YB2 | tri_state | Noninverting 3-state buffer output of the B bank, high-impedance when OEB is high; maximum DC output current is 25 mA per pin. |
| 8 | A4 | input | Data input for buffer 4 of the A bank, passed noninverted to YA4 when OEA is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 9 | YB1 | tri_state | Noninverting 3-state buffer output of the B bank, high-impedance when OEB is high; maximum DC output current is 25 mA per pin. |
| 10 | GND | power_in | Ground reference; all device voltages are referenced to GND, and the recommended VCC range is 2.0 V to 5.5 V. |
| 11 | B4 | input | Data input for buffer 4 of the B bank, passed noninverted to YB4 when OEB is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 12 | YA4 | tri_state | Noninverting 3-state buffer output of the A bank, high-impedance when OEA is high; maximum DC output current is 25 mA per pin. |
| 13 | B3 | input | Data input for buffer 3 of the B bank, passed noninverted to YB3 when OEB is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 14 | YA3 | tri_state | Noninverting 3-state buffer output of the A bank, high-impedance when OEA is high; maximum DC output current is 25 mA per pin. |
| 15 | B2 | input | Data input for buffer 2 of the B bank, passed noninverted to YB2 when OEB is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 16 | YA2 | tri_state | Noninverting 3-state buffer output of the A bank, high-impedance when OEA is high; maximum DC output current is 25 mA per pin. |
| 17 | B1 | input | Data input for buffer 1 of the B bank, passed noninverted to YB1 when OEB is low; the datasheet recommends VIN between 0 V and 5.5 V. |
| 18 | YA1 | tri_state | Noninverting 3-state buffer output of the A bank, high-impedance when OEA is high; maximum DC output current is 25 mA per pin. |
| 19 | OEB | input | Active-low output enable for the YB1-YB4 outputs; when high, the YB outputs are placed in the high-impedance (Z) state per the function table. |
| 20 | VCC | power_in | Positive DC supply; the datasheet specifies a recommended operating range of 2.0 V to 5.5 V and an absolute maximum of 7.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-20 |
| Category | Logic ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Positive DC Supply Voltage | VCC | -0.5 | 7 | V | 2 | ||
| Digital Input Voltage | VIN | -0.5 | 7 | V | 2 | ||
| DC Output Voltage | VOUT | -0.5 | V | upper limit printed as VCC +0.5 V | 2 | ||
| Input Diode Current | IIK | -20 | mA | 2 | |||
| Output Diode Current | IOK | 20 | mA | 2 | |||
| DC Output Current, per Pin | IOUT | 25 | mA | 2 | |||
| DC Supply Current, VCC and GND Pins | ICC | 75 | mA | 2 | |||
| Power Dissipation in Still Air | PD | 450 | mW | TSSOP | 2 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 2 | ||
| ESD Withstand Voltage, Human Body Model | VESD | 2000 | V | Human Body Model (Note 2); printed >2000 | 2 | ||
| ESD Withstand Voltage, Machine Model | VESD | 200 | V | Machine Model (Note 3); printed >200 | 2 | ||
| ESD Withstand Voltage, Charged Device Model | VESD | 2000 | V | Charged Device Model (Note 4); printed >2000 | 2 | ||
| Latchup Performance | ILATCHUP | 300 | mA | Above VCC and below GND at 125°C (Note 5) | 2 | ||
| DC Supply Voltage | VCC | 2 | 5.5 | V | 3 | ||
| DC Input Voltage | VIN | 0 | 5.5 | V | 3 | ||
| DC Output Voltage | VOUT | 0 | V | upper limit printed as VCC | 3 | ||
| Operating Temperature Range, all Package Types | TA | -55 | 125 | °C | 3 | ||
| Input Rise or Fall Time | tr, tf | 0 | 100 | ns/V | VCC = 3.3 V + 0.3 V | 3 | |
| Input Rise or Fall Time | tr, tf | 0 | 20 | ns/V | VCC = 5.0 V + 0.5 V | 3 | |
| Thermal Resistance, Junction-to-Ambient | JA | 128 | °C/W | TSSOP | 2 | ||
| Minimum High-Level Input Voltage | VIH | 1.5 | V | VCC = 2.0 V, TA = 25°C | 3 | ||
| Minimum High-Level Input Voltage | VIH | 0.7 | ×VCC | VCC = 3.0 to 5.5 V, TA = 25°C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.5 | V | VCC = 2.0 V, TA = 25°C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.3 | ×VCC | VCC = 3.0 to 5.5 V, TA = 25°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 1.9 | V | VIN = VIH or VIL, IOH = −50 µA, VCC = 2.0 V, TA = 25°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 2.9 | V | VIN = VIH or VIL, IOH = −50 µA, VCC = 3.0 V, TA = 25°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 4.4 | V | VIN = VIH or VIL, IOH = −50 µA, VCC = 4.5 V, TA = 25°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 2.58 | V | VIN = VIH or VIL, IOH = −4 mA, VCC = 3.0 V, TA = 25°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 3.94 | V | VIN = VIH or VIL, IOH = −8 mA, VCC = 4.5 V, TA = 25°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 2.34 | V | VIN = VIH or VIL, IOH = −4 mA, VCC = 3.0 V, −55°C ≤ TA ≤ 125°C | 3 | ||
| Maximum High-Level Output Voltage | VOH | 3.66 | V | VIN = VIH or VIL, IOH = −8 mA, VCC = 4.5 V, −55°C ≤ TA ≤ 125°C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.1 | V | VIN = VIH or VIL, IOL = 50 µA, VCC = 2.0 V, TA = 25°C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.36 | V | VIN = VIH or VIL, IOL = 4 mA, VCC = 3.0 V, TA = 25°C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.52 | V | VIN = VIH or VIL, IOL = 4 mA, VCC = 3.0 V, −55°C ≤ TA ≤ 125°C | 3 | ||
| Input Leakage Current | IIN | -0.1 | 0.1 | µA | VIN = 5.5 V or GND, VCC = 0 to 5.5 V, TA = 25°C | 3 | |
| Input Leakage Current | IIN | -1 | 1 | µA | VIN = 5.5 V or GND, VCC = 0 to 5.5 V, −55°C ≤ TA ≤ 125°C | 3 | |
| Maximum 3-State Leakage Current | IOZ | -0.25 | 0.25 | µA | VIN = VIH or VIL, VOUT = VCC or GND, VCC = 5.5 V, TA = 25°C | 3 | |
| Maximum 3-State Leakage Current | IOZ | -2.5 | 2.5 | µA | VIN = VIH or VIL, VOUT = VCC or GND, VCC = 5.5 V, −55°C ≤ TA ≤ 125°C | 3 | |
| Maximum Quiescent Supply Current (per package) | ICC | 4 | µA | VIN = VCC or GND, VCC = 5.5 V, TA = 25°C | 3 | ||
| Maximum Quiescent Supply Current (per package) | ICC | 40 | µA | VIN = VCC or GND, VCC = 5.5 V, −55°C ≤ TA ≤ 125°C | 3 | ||
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 1 | 8.3 | ns | VCC = 3.3 ± 0.3 V, CL = 15 pF, TA = 25°C | 4 | |
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 1 | 11.9 | ns | VCC = 3.3 ± 0.3 V, CL = 50 pF, TA = 25°C | 4 | |
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 1 | 5.4 | ns | VCC = 5.0 ± 0.5 V, CL = 15 pF, TA = 25°C | 4 | |
| Maximum Propagation Delay, A to YA or B to YB | tPLH, tPHL | 1 | 7.5 | ns | VCC = 5.0 ± 0.5 V, CL = 50 pF, TA = 25°C | 4 | |
| Maximum Input Capacitance | Cin | 4 | 10 | pF | TA = 25°C | 4 | |
| Quiet Output Maximum Dynamic VOL | VOLP | 0.6 | 0.9 | V | Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 5.0 V, TA = 25°C | 4 |
CAD (KiCad official)
- Symbol:
MC74VHC244DTG - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files:
mc74vhc244dtg-etched.step/mc74vhc244dtg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74vhc244dtg.step/mc74vhc244dtg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
9dd1c8301742cae4, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).