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MC74LCX240DTR2G

Public Made by Adom

by adom

onsemi Buffers, Drivers, Receivers, Transceivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MC74LCX240DTR2G

onsemi · Buffers, Drivers, Receivers, Transceivers · TSSOP-20

MC74LCX240DTR2G from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Active-low output enable for outputs 1O0 to 1O3; when HIGH it disables those outputs into the high-impedance (HIGH Z) state.
2 1D0 input Data input 0 for the first buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
3 2O0 tri_state Inverting 3-state output 0 of the second buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
4 1D1 input Data input 1 for the first buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
5 2O1 tri_state Inverting 3-state output 1 of the second buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
6 1D2 input Data input 2 for the first buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
7 2O2 tri_state Inverting 3-state output 2 of the second buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
8 1D3 input Data input 3 for the first buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
9 2O3 tri_state Inverting 3-state output 3 of the second buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
10 GND power_in Ground reference for the device.
11 2D3 input Data input 3 for the second buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
12 1O3 tri_state Inverting 3-state output 3 of the first buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
13 2D2 input Data input 2 for the second buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
14 1O2 tri_state Inverting 3-state output 2 of the first buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
15 2D1 input Data input 1 for the second buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
16 1O1 tri_state Inverting 3-state output 1 of the first buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
17 2D0 input Data input 0 for the second buffer bank; TTL-compatible and 5 V tolerant, with inputs rated to 5.5 V.
18 1O0 tri_state Inverting 3-state output 0 of the first buffer bank, rated for 24 mA balanced sink and source at VCC = 3.0 V to 3.6 V.
19 2OE input Active-low output enable for outputs 2O0 to 2O3; when HIGH it disables those outputs into the high-impedance (HIGH Z) state.
20 VCC power_in Supply voltage; the datasheet specifies 2.0 V to 3.6 V operating (2.3 V to 3.6 V in the description) and 1.5 V minimum for data retention only.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-20
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage, Operating VCC 2 3.3 3.6 V Operating 3
Supply Voltage, Data Retention Only VCC 1.5 3.3 3.6 V Data Retention Only 3
Input Voltage VI 0 5.5 V 3
Output Voltage, HIGH or LOW State VO 0 V HIGH or LOW State 3
Output Voltage, 3-State VO 0 5.5 V 3-State 3
HIGH Level Output Current IOH -24 mA VCC = 3.0 V − 3.6 V 3
LOW Level Output Current IOL 24 mA VCC = 3.0 V − 3.6 V 3
HIGH Level Output Current IOH -12 mA VCC = 2.7 V − 3.0 V 3
LOW Level Output Current IOL 12 mA VCC = 2.7 V − 3.0 V 3
Operating Free-Air Temperature TA -40 125 °C 3
Input Transition Rise or Fall Rate t/V 0 10 ns/V VIN from 0.8 V to 2.0 V, VCC = 3.0 V 3
DC Supply Voltage VCC -0.5 7 V 3
DC Input Voltage VI -0.5 7 V 3
DC Output Voltage VO -0.5 7 V Output in 3-State 3
DC Output Voltage VO -0.5 V Output in HIGH or LOW State (Note 1) 3
DC Input Diode Current IIK -50 mA VI < GND 3
DC Output Diode Current IOK -50 mA VO < GND 3
DC Output Diode Current IOK 50 mA VO > VCC 3
DC Output Source/Sink Current IO -50 50 mA 3
DC Supply Current, Per Supply Pin ICC -100 100 mA Per Supply Pin 3
DC Ground Current, Per Ground Pin IGND -100 100 mA Per Ground Pin 3
Storage Temperature Range TSTG -65 150 °C 3
HIGH Level Input Voltage VIH 2 V 2.7 V ≤ VCC ≤ 3.6 V; TA = −40°C to +125°C 3
LOW Level Input Voltage VIL 0.8 V 2.7 V ≤ VCC ≤ 3.6 V; TA = −40°C to +125°C 3
HIGH Level Output Voltage VOH 2.2 V VCC = 2.7 V; IOH = −12 mA; TA = −40°C to +125°C 3
HIGH Level Output Voltage VOH 2.4 V VCC = 3.0 V; IOH = −18 mA; TA = −40°C to +125°C 3
LOW Level Output Voltage VOL 0.2 V 2.7 V ≤ VCC ≤ 3.6 V; IOL = 100 µA; TA = −40°C to +125°C 4
LOW Level Output Voltage VOL 0.4 V VCC = 2.7 V; IOL = 12 mA; TA = −40°C to +125°C 4
LOW Level Output Voltage VOL 0.6 V VCC = 3.0 V; IOL = 24 mA; TA = −40°C to +125°C 4
3-State Output Current IOZ -5 5 µA VCC = 3.6 V, VIN = VIH or VIL, VOUT = 0 to 5.5 V; TA = −40°C to +125°C 4
Power Off Leakage Current IOFF 10 µA VCC = 0, VIN = 5.5 V or VOUT = 5.5 V; TA = −40°C to +125°C 4
Input Leakage Current IIN -5 5 µA VCC = 3.6 V, VIN = 5.5 V or GND; TA = −40°C to +125°C 4
Quiescent Supply Current ICC 10 µA VCC = 3.6 V, VIN = 5.5 V or GND; TA = −40°C to +125°C 4
Increase in ICC per Input ICC 500 µA 2.3 V ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V; TA = −40°C to +125°C 4
Propagation Delay Input to Output (tPLH) tPLH 1.5 6.5 ns VCC = 3.0 V to 3.6 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Propagation Delay Input to Output (tPLH) tPLH 7.5 ns VCC = 2.7 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Propagation Delay Input to Output (tPHL) tPHL 1.5 6.5 ns VCC = 3.0 V to 3.6 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Propagation Delay Input to Output (tPHL) tPHL 7.5 ns VCC = 2.7 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Enable Time to High Level tPZH 1.5 8 ns VCC = 3.0 V to 3.6 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Enable Time to High Level tPZH 9 ns VCC = 2.7 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Enable Time to Low Level tPZL 1.5 8 ns VCC = 3.0 V to 3.6 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Enable Time to Low Level tPZL 9 ns VCC = 2.7 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Disable Time From High Level tPHZ 1.5 7 ns VCC = 3.0 V to 3.6 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Disable Time From High Level tPHZ 8 ns VCC = 2.7 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Disable Time From Low Level tPLZ 1.5 7 ns VCC = 3.0 V to 3.6 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output Disable Time From Low Level tPLZ 8 ns VCC = 2.7 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output-to-Output Skew (tOSHL) tOSHL 1 ns Note 3; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Output-to-Output Skew (tOSLH) tOSLH 1 ns Note 3; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; TA = −40°C to +125°C 4
Dynamic LOW Peak Voltage VOLP 0.8 V VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V; TA = +25°C 4
Dynamic LOW Valley Voltage VOLV 0.8 V VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V; TA = +25°C 4
Input Capacitance CIN 7 pF VCC = 3.3 V, VI = 0 V or VCC 4
Output Capacitance COUT 8 pF VCC = 3.3 V, VI = 0 V or VCC 4
Power Dissipation Capacitance CPD 25 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 4

CAD (KiCad official)

  • Symbol: MC74LCX240DTR2G
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: mc74lcx240dtr2g-etched.step / mc74lcx240dtr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74lcx240dtr2g.step / mc74lcx240dtr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 c24f3e24c01ab94f, retrieved 2026-10-18, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF