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Ray Publish 0.1.0 f6218b8 15h ago

MC74HCU04ADTR2G

onsemi · Inverters · TSSOP-14

MC74HCU04ADTR2G from onsemi, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Input of inverter 1; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
2 Y1 output Output of inverter 1, the logic inverse of A1; unused outputs must be left open.
3 A2 input Input of inverter 2; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
4 Y2 output Output of inverter 2, the logic inverse of A2; unused outputs must be left open.
5 A3 input Input of inverter 3; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
6 Y3 output Output of inverter 3, the logic inverse of A3; unused outputs must be left open.
7 GND power_in Ground reference for all voltages; VCC is specified from 2.0 to 6.0 V referenced to GND.
8 Y4 output Output of inverter 4, the logic inverse of A4; unused outputs must be left open.
9 A4 input Input of inverter 4; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
10 Y5 output Output of inverter 5, the logic inverse of A5; unused outputs must be left open.
11 A5 input Input of inverter 5; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
12 Y6 output Output of inverter 6, the logic inverse of A6; unused outputs must be left open.
13 A6 input Input of inverter 6; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
14 VCC power_in Positive supply; recommended operating range is 2.0 V to 6.0 V referenced to GND, with a maximum DC supply of 7.0 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-14
Category Logic ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage (Referenced to GND) VCC -0.5 7 V Referenced to GND 2
DC Input Voltage (Referenced to GND) Vin -0.5 V Referenced to GND; upper limit printed as VCC + 0.5 2
DC Output Voltage (Referenced to GND) Vout -0.5 V Referenced to GND; upper limit printed as VCC + 0.5 2
DC Input Current, per Pin Iin -20 20 mA Per pin (printed ±20) 2
DC Output Current, per Pin Iout -25 25 mA Per pin (printed ±25) 2
DC Supply Current, VCC and GND Pins ICC -50 50 mA VCC and GND pins (printed ±50) 2
Power Dissipation in Still Air, TSSOP Package PD 450 mW Still air, TSSOP package 2
Storage Temperature Tstg -65 150 °C 2
Lead Temperature TL 260 °C 1 mm from case for 10 seconds; SOIC or TSSOP package 2
DC Supply Voltage (Referenced to GND) VCC 2 6 V Referenced to GND 2
DC Input Voltage, Output Voltage (Referenced to GND) Vin, Vout 0 V Referenced to GND; upper limit printed as VCC 2
Operating Temperature, All Package Types TA -55 125 °C All package types 2
Minimum High-Level Input Voltage VIH 1.7 V VCC = 2.0 V; column ≤125 °C (same value at all temperatures) 2
Minimum High-Level Input Voltage VIH 2.5 V VCC = 3.0 V; column ≤125 °C (same value at all temperatures) 2
Minimum High-Level Input Voltage VIH 3.6 V VCC = 4.5 V; column ≤125 °C (same value at all temperatures) 2
Minimum High-Level Input Voltage VIH 4.8 V VCC = 6.0 V; column ≤125 °C (same value at all temperatures) 2
Maximum Low-Level Input Voltage VIL 0.3 V VCC = 2.0 V; column ≤125 °C (same value at all temperatures) 2
Maximum Low-Level Input Voltage VIL 0.5 V VCC = 3.0 V; column ≤125 °C (same value at all temperatures) 2
Maximum Low-Level Input Voltage VIL 0.8 V VCC = 4.5 V; column ≤125 °C (same value at all temperatures) 2
Maximum Low-Level Input Voltage VIL 1.1 V VCC = 6.0 V; column ≤125 °C (same value at all temperatures) 2
Minimum High-Level Output Voltage VOH 1.8 V Vin = GND, /Iout/ ≤ 20 µA; VCC = 2.0 V; column ≤125 °C 2
Minimum High-Level Output Voltage VOH 4 V Vin = GND, /Iout/ ≤ 20 µA; VCC = 4.5 V; column ≤125 °C 2
Minimum High-Level Output Voltage VOH 5.5 V Vin = GND, /Iout/ ≤ 20 µA; VCC = 6.0 V; column ≤125 °C 2
Minimum High-Level Output Voltage VOH 2.2 V Vin = GND, /Iout/ ≤ 2.4 mA; VCC = 3.0 V; column ≤125 °C 2
Minimum High-Level Output Voltage VOH 3.7 V Vin = GND, /Iout/ ≤ 4.0 mA; VCC = 4.5 V; column ≤125 °C 2
Minimum High-Level Output Voltage VOH 5.2 V Vin = GND, /Iout/ ≤ 5.2 mA; VCC = 6.0 V; column ≤125 °C 2
Maximum Low-Level Output Voltage VOL 0.2 V Vin = VCC, /Iout/ ≤ 20 µA; VCC = 2.0 V; column ≤125 °C 3
Maximum Low-Level Output Voltage VOL 0.5 V Vin = VCC, /Iout/ ≤ 20 µA; VCC = 4.5 V; column ≤125 °C 3
Maximum Low-Level Output Voltage VOL 0.32 V Vin = VCC, /Iout/ ≤ 2.4 mA; VCC = 3.0 V; column ≤125 °C 3
Maximum Low-Level Output Voltage VOL 0.4 V Vin = VCC, /Iout/ ≤ 4.0 mA; VCC = 4.5 V; column ≤125 °C 3
Maximum Input Leakage Current Iin -1 1 µA Vin = VCC or GND; VCC = 6.0 V; column ≤125 °C (printed ±1.0) 3
Maximum Quiescent Supply Current (per Package) ICC 40 µA Vin = VCC or GND, Iout = 0 µA; VCC = 6.0 V; column ≤125 °C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 105 ns CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V; column ≤125 °C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 50 ns CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V; column ≤125 °C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 21 ns CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V; column ≤125 °C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 18 ns CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V; column ≤125 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 110 ns CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V; column ≤125 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 36 ns CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V; column ≤125 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 22 ns CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V; column ≤125 °C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 19 ns CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V; column ≤125 °C 3
Maximum Input Capacitance Cin 10 pF Printed as 10 in all temperature columns 3

CAD (KiCad official)

  • Symbol: MC74HCU04ADTR2G
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: mc74hcu04adtr2g-etched.step / mc74hcu04adtr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hcu04adtr2g.step / mc74hcu04adtr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 3dfa903fa9997a62, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF