component
MC74HCU04ADTR2G
Public Made by Adomby adom
onsemi Inverters, TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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MC74HCU04ADTR2G
onsemi · Inverters · TSSOP-14
MC74HCU04ADTR2G from onsemi, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | input | Input of inverter 1; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 2 | Y1 | output | Output of inverter 1, the logic inverse of A1; unused outputs must be left open. |
| 3 | A2 | input | Input of inverter 2; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 4 | Y2 | output | Output of inverter 2, the logic inverse of A2; unused outputs must be left open. |
| 5 | A3 | input | Input of inverter 3; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 6 | Y3 | output | Output of inverter 3, the logic inverse of A3; unused outputs must be left open. |
| 7 | GND | power_in | Ground reference for all voltages; VCC is specified from 2.0 to 6.0 V referenced to GND. |
| 8 | Y4 | output | Output of inverter 4, the logic inverse of A4; unused outputs must be left open. |
| 9 | A4 | input | Input of inverter 4; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 10 | Y5 | output | Output of inverter 5, the logic inverse of A5; unused outputs must be left open. |
| 11 | A5 | input | Input of inverter 5; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 12 | Y6 | output | Output of inverter 6, the logic inverse of A6; unused outputs must be left open. |
| 13 | A6 | input | Input of inverter 6; Vin must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 14 | VCC | power_in | Positive supply; recommended operating range is 2.0 V to 6.0 V referenced to GND, with a maximum DC supply of 7.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-14 |
| Category | Logic ICs |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND) | VCC | -0.5 | 7 | V | Referenced to GND | 2 | |
| DC Input Voltage (Referenced to GND) | Vin | -0.5 | V | Referenced to GND; upper limit printed as VCC + 0.5 | 2 | ||
| DC Output Voltage (Referenced to GND) | Vout | -0.5 | V | Referenced to GND; upper limit printed as VCC + 0.5 | 2 | ||
| DC Input Current, per Pin | Iin | -20 | 20 | mA | Per pin (printed ±20) | 2 | |
| DC Output Current, per Pin | Iout | -25 | 25 | mA | Per pin (printed ±25) | 2 | |
| DC Supply Current, VCC and GND Pins | ICC | -50 | 50 | mA | VCC and GND pins (printed ±50) | 2 | |
| Power Dissipation in Still Air, TSSOP Package | PD | 450 | mW | Still air, TSSOP package | 2 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 2 | ||
| Lead Temperature | TL | 260 | °C | 1 mm from case for 10 seconds; SOIC or TSSOP package | 2 | ||
| DC Supply Voltage (Referenced to GND) | VCC | 2 | 6 | V | Referenced to GND | 2 | |
| DC Input Voltage, Output Voltage (Referenced to GND) | Vin, Vout | 0 | V | Referenced to GND; upper limit printed as VCC | 2 | ||
| Operating Temperature, All Package Types | TA | -55 | 125 | °C | All package types | 2 | |
| Minimum High-Level Input Voltage | VIH | 1.7 | V | VCC = 2.0 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Minimum High-Level Input Voltage | VIH | 2.5 | V | VCC = 3.0 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Minimum High-Level Input Voltage | VIH | 3.6 | V | VCC = 4.5 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Minimum High-Level Input Voltage | VIH | 4.8 | V | VCC = 6.0 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Maximum Low-Level Input Voltage | VIL | 0.3 | V | VCC = 2.0 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Maximum Low-Level Input Voltage | VIL | 0.5 | V | VCC = 3.0 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Maximum Low-Level Input Voltage | VIL | 0.8 | V | VCC = 4.5 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Maximum Low-Level Input Voltage | VIL | 1.1 | V | VCC = 6.0 V; column ≤125 °C (same value at all temperatures) | 2 | ||
| Minimum High-Level Output Voltage | VOH | 1.8 | V | Vin = GND, /Iout/ ≤ 20 µA; VCC = 2.0 V; column ≤125 °C | 2 | ||
| Minimum High-Level Output Voltage | VOH | 4 | V | Vin = GND, /Iout/ ≤ 20 µA; VCC = 4.5 V; column ≤125 °C | 2 | ||
| Minimum High-Level Output Voltage | VOH | 5.5 | V | Vin = GND, /Iout/ ≤ 20 µA; VCC = 6.0 V; column ≤125 °C | 2 | ||
| Minimum High-Level Output Voltage | VOH | 2.2 | V | Vin = GND, /Iout/ ≤ 2.4 mA; VCC = 3.0 V; column ≤125 °C | 2 | ||
| Minimum High-Level Output Voltage | VOH | 3.7 | V | Vin = GND, /Iout/ ≤ 4.0 mA; VCC = 4.5 V; column ≤125 °C | 2 | ||
| Minimum High-Level Output Voltage | VOH | 5.2 | V | Vin = GND, /Iout/ ≤ 5.2 mA; VCC = 6.0 V; column ≤125 °C | 2 | ||
| Maximum Low-Level Output Voltage | VOL | 0.2 | V | Vin = VCC, /Iout/ ≤ 20 µA; VCC = 2.0 V; column ≤125 °C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.5 | V | Vin = VCC, /Iout/ ≤ 20 µA; VCC = 4.5 V; column ≤125 °C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.32 | V | Vin = VCC, /Iout/ ≤ 2.4 mA; VCC = 3.0 V; column ≤125 °C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.4 | V | Vin = VCC, /Iout/ ≤ 4.0 mA; VCC = 4.5 V; column ≤125 °C | 3 | ||
| Maximum Input Leakage Current | Iin | -1 | 1 | µA | Vin = VCC or GND; VCC = 6.0 V; column ≤125 °C (printed ±1.0) | 3 | |
| Maximum Quiescent Supply Current (per Package) | ICC | 40 | µA | Vin = VCC or GND, Iout = 0 µA; VCC = 6.0 V; column ≤125 °C | 3 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 105 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V; column ≤125 °C | 3 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 50 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V; column ≤125 °C | 3 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 21 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V; column ≤125 °C | 3 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 18 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V; column ≤125 °C | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 110 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 2.0 V; column ≤125 °C | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 36 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 3.0 V; column ≤125 °C | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 22 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 4.5 V; column ≤125 °C | 3 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 19 | ns | CL = 50 pF, tr = tf = 6 ns; VCC = 6.0 V; column ≤125 °C | 3 | ||
| Maximum Input Capacitance | Cin | 10 | pF | Printed as 10 in all temperature columns | 3 |
CAD (KiCad official)
- Symbol:
MC74HCU04ADTR2G - Footprint:
Package_SO:TSSOP-14_4.4x5mm_P0.65mm - 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files:
mc74hcu04adtr2g-etched.step/mc74hcu04adtr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hcu04adtr2g.step/mc74hcu04adtr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
3dfa903fa9997a62, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).