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MC74HCU04ADR2G

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onsemi Inverters, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MC74HCU04ADR2G

onsemi · Inverters · SOIC-14

MC74HCU04ADR2G from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Input of inverter 1; unused inputs must be tied to GND or VCC and Vin must stay between GND and VCC.
2 Y1 output Inverted output of inverter 1; unused outputs must be left open.
3 A2 input Input of inverter 2; unused inputs must be tied to GND or VCC and Vin must stay between GND and VCC.
4 Y2 output Inverted output of inverter 2; unused outputs must be left open.
5 A3 input Input of inverter 3; unused inputs must be tied to GND or VCC and Vin must stay between GND and VCC.
6 Y3 output Inverted output of inverter 3; unused outputs must be left open.
7 GND power_in Ground reference for all voltages; the supply is specified referenced to GND.
8 Y4 output Inverted output of inverter 4; unused outputs must be left open.
9 A4 input Input of inverter 4; unused inputs must be tied to GND or VCC and Vin must stay between GND and VCC.
10 Y5 output Inverted output of inverter 5; unused outputs must be left open.
11 A5 input Input of inverter 5; unused inputs must be tied to GND or VCC and Vin must stay between GND and VCC.
12 Y6 output Inverted output of inverter 6; unused outputs must be left open.
13 A6 input Input of inverter 6; unused inputs must be tied to GND or VCC and Vin must stay between GND and VCC.
14 VCC power_in Positive supply, 2.0 to 6.0 V referenced to GND per the recommended operating conditions.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage (Referenced to GND) VCC 2 6 V Referenced to GND 2
DC Input Voltage, Output Voltage (Referenced to GND) Vin, Vout 0 V Max is VCC 2
Operating Temperature, All Package Types TA -55 125 °C All package types 2
DC Supply Voltage (Referenced to GND) VCC -0.5 7 V Referenced to GND 2
DC Input Voltage (Referenced to GND) Vin -0.5 V Max is VCC+0.5 2
DC Output Voltage (Referenced to GND) Vout -0.5 V Max is VCC+0.5 2
DC Input Current, per Pin Iin -20 20 mA 2
DC Output Current, per Pin Iout -25 25 mA 2
DC Supply Current, VCC and GND Pins ICC -50 50 mA 2
Power Dissipation in Still Air PD 500 mW SOIC package; derate -7 mW/°C from 65 to 125°C 2
Storage Temperature Tstg -65 150 °C 2
Lead Temperature, 1 mm from case for 10 Seconds TL 260 °C SOIC or TSSOP package 2
Minimum High-Level Input Voltage VIH 1.7 V VCC 2.0 V; TA -55 to 125°C 2
Minimum High-Level Input Voltage VIH 2.5 V VCC 3.0 V; TA -55 to 125°C 2
Minimum High-Level Input Voltage VIH 3.6 V VCC 4.5 V; TA -55 to 125°C 2
Minimum High-Level Input Voltage VIH 4.8 V VCC 6.0 V; TA -55 to 125°C 2
Maximum Low-Level Input Voltage VIL 0.3 V VCC 2.0 V; TA -55 to 125°C 2
Maximum Low-Level Input Voltage VIL 0.5 V VCC 3.0 V; TA -55 to 125°C 2
Maximum Low-Level Input Voltage VIL 0.8 V VCC 4.5 V; TA -55 to 125°C 2
Maximum Low-Level Input Voltage VIL 1.1 V VCC 6.0 V; TA -55 to 125°C 2
Minimum High-Level Output Voltage VOH 1.8 V VCC 2.0 V; Vin=GND; /Iout/ ≤ 20 µA; TA -55 to 125°C 2
Minimum High-Level Output Voltage VOH 4 V VCC 4.5 V; Vin=GND; /Iout/ ≤ 20 µA; TA -55 to 125°C 2
Minimum High-Level Output Voltage VOH 5.5 V VCC 6.0 V; Vin=GND; /Iout/ ≤ 20 µA; TA -55 to 125°C 2
Maximum Low-Level Output Voltage VOL 0.2 V VCC 2.0 V; Vin=VCC; /Iout/ ≤ 20 µA; TA -55 to 125°C 3
Maximum Low-Level Output Voltage VOL 0.5 V VCC 4.5 V; Vin=VCC; /Iout/ ≤ 20 µA; TA -55 to 125°C 3
Minimum High-Level Output Voltage VOH 2.36 V VCC 3.0 V; Vin=GND; /Iout/ ≤ 2.4 mA; TA -55 to 25°C 2
Minimum High-Level Output Voltage VOH 2.26 V VCC 3.0 V; Vin=GND; /Iout/ ≤ 2.4 mA; TA 85°C 2
Minimum High-Level Output Voltage VOH 2.2 V VCC 3.0 V; Vin=GND; /Iout/ ≤ 2.4 mA; TA 125°C 2
Minimum High-Level Output Voltage VOH 3.86 V VCC 4.5 V; Vin=GND; /Iout/ ≤ 4.0 mA; TA -55 to 25°C 2
Minimum High-Level Output Voltage VOH 3.76 V VCC 4.5 V; Vin=GND; /Iout/ ≤ 4.0 mA; TA 85°C 2
Minimum High-Level Output Voltage VOH 3.7 V VCC 4.5 V; Vin=GND; /Iout/ ≤ 4.0 mA; TA 125°C 2
Minimum High-Level Output Voltage VOH 5.36 V VCC 6.0 V; Vin=GND; /Iout/ ≤ 5.2 mA; TA -55 to 25°C 2
Minimum High-Level Output Voltage VOH 5.26 V VCC 6.0 V; Vin=GND; /Iout/ ≤ 5.2 mA; TA 85°C 2
Minimum High-Level Output Voltage VOH 5.2 V VCC 6.0 V; Vin=GND; /Iout/ ≤ 5.2 mA; TA 125°C 2
Maximum Low-Level Output Voltage VOL 0.32 V VCC 3.0 V; Vin=VCC; /Iout/ ≤ 2.4 mA; TA -55 to 125°C 3
Maximum Low-Level Output Voltage VOL 0.37 V VCC 4.5 V; Vin=VCC; /Iout/ ≤ 4.0 mA; TA 85°C 3
Maximum Low-Level Output Voltage VOL 0.4 V VCC 6.0 V; Vin=VCC; /Iout/ ≤ 5.2 mA; TA 85°C 3
Maximum Input Leakage Current Iin -0.1 0.1 µA VCC 6.0 V; Vin=VCC or GND; TA -55 to 25°C 3
Maximum Input Leakage Current Iin -1 1 µA VCC 6.0 V; Vin=VCC or GND; TA 85°C 3
Maximum Quiescent Supply Current (per Package) ICC 1 µA VCC 6.0 V; Vin=VCC or GND; Iout=0 µA; TA -55 to 25°C 3
Maximum Quiescent Supply Current (per Package) ICC 10 µA VCC 6.0 V; Vin=VCC or GND; Iout=0 µA; TA 85°C 3
Maximum Quiescent Supply Current (per Package) ICC 40 µA VCC 6.0 V; Vin=VCC or GND; Iout=0 µA; TA 125°C 3
Maximum Input Capacitance Cin 10 pF 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 70 ns VCC 2.0 V; CL=50 pF; Input tr=tf=6 ns; TA -55 to 25°C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 90 ns VCC 2.0 V; CL=50 pF; Input tr=tf=6 ns; TA 85°C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 105 ns VCC 2.0 V; CL=50 pF; Input tr=tf=6 ns; TA 125°C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 12 ns VCC 6.0 V; CL=50 pF; Input tr=tf=6 ns; TA -55 to 25°C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 15 ns VCC 6.0 V; CL=50 pF; Input tr=tf=6 ns; TA 85°C 3
Maximum Propagation Delay, Input A to Output Y tPLH, tPHL 18 ns VCC 6.0 V; CL=50 pF; Input tr=tf=6 ns; TA 125°C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 75 ns VCC 2.0 V; CL=50 pF; Input tr=tf=6 ns; TA -55 to 25°C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 95 ns VCC 2.0 V; CL=50 pF; Input tr=tf=6 ns; TA 85°C 3
Maximum Output Transition Time, Any Output tTLH, tTHL 110 ns VCC 2.0 V; CL=50 pF; Input tr=tf=6 ns; TA 125°C 3

CAD (KiCad official)

  • Symbol: MC74HCU04ADR2G
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mc74hcu04adr2g-etched.step / mc74hcu04adr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hcu04adr2g.step / mc74hcu04adr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 e154ad67b07920fc, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed (audit)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF