component
MC74HCT245ADWR2G
Public Made by Adomby adom
onsemi Buffers, Drivers, Receivers, Transceivers, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
MC74HCT245ADWR2G
onsemi · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil
MC74HCT245ADWR2G from onsemi, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DIRECTION | input | Direction control: low transmits data from bus B to bus A, high transmits data from bus A to bus B. |
| 2 | A1 | bidirectional | Data port A, bit 1; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 3 | A2 | bidirectional | Data port A, bit 2; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 4 | A3 | bidirectional | Data port A, bit 3; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 5 | A4 | bidirectional | Data port A, bit 4; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 6 | A5 | bidirectional | Data port A, bit 5; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 7 | A6 | bidirectional | Data port A, bit 6; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 8 | A7 | bidirectional | Data port A, bit 7; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 9 | A8 | bidirectional | Data port A, bit 8; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 10 | GND | power_in | Ground reference (0 V) for all voltages on the device. |
| 11 | B8 | bidirectional | Data port B, bit 8; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 12 | B7 | bidirectional | Data port B, bit 7; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 13 | B6 | bidirectional | Data port B, bit 6; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 14 | B5 | bidirectional | Data port B, bit 5; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 15 | B4 | bidirectional | Data port B, bit 4; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 16 | B3 | bidirectional | Data port B, bit 3; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 17 | B2 | bidirectional | Data port B, bit 2; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 18 | B1 | bidirectional | Data port B, bit 1; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 19 | OUTPUT ENABLE | input | Active-low output enable; when high, both buses are placed in the high-impedance (isolated) state. |
| 20 | VCC | power_in | Positive supply, 4.5 V to 5.5 V referenced to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-20-300mil |
| Category | Logic |
| Pins | 20 |
CAD (KiCad official)
- Symbol:
MC74HCT245ADWR2G - Footprint:
Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm - 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
- 3D model files:
mc74hct245adwr2g-etched.step/mc74hct245adwr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hct245adwr2g.step/mc74hct245adwr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
516ac0a5323b54b9, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MC74HCT245ADWR2G
**onsemi** · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil
MC74HCT245ADWR2G from onsemi, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DIRECTION | input | Direction control: low transmits data from bus B to bus A, high transmits data from bus A to bus B. |
| 2 | A1 | bidirectional | Data port A, bit 1; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 3 | A2 | bidirectional | Data port A, bit 2; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 4 | A3 | bidirectional | Data port A, bit 3; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 5 | A4 | bidirectional | Data port A, bit 4; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 6 | A5 | bidirectional | Data port A, bit 5; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 7 | A6 | bidirectional | Data port A, bit 6; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 8 | A7 | bidirectional | Data port A, bit 7; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 9 | A8 | bidirectional | Data port A, bit 8; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 10 | GND | power_in | Ground reference (0 V) for all voltages on the device. |
| 11 | B8 | bidirectional | Data port B, bit 8; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 12 | B7 | bidirectional | Data port B, bit 7; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 13 | B6 | bidirectional | Data port B, bit 6; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 14 | B5 | bidirectional | Data port B, bit 5; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 15 | B4 | bidirectional | Data port B, bit 4; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 16 | B3 | bidirectional | Data port B, bit 3; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 17 | B2 | bidirectional | Data port B, bit 2; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 18 | B1 | bidirectional | Data port B, bit 1; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC. |
| 19 | OUTPUT ENABLE | input | Active-low output enable; when high, both buses are placed in the high-impedance (isolated) state. |
| 20 | VCC | power_in | Positive supply, 4.5 V to 5.5 V referenced to GND. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-20-300mil |
| Category | Logic |
| Pins | 20 |
## CAD (KiCad official)
- Symbol: `MC74HCT245ADWR2G`
- Footprint: `Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm`
- 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
- 3D model files: `mc74hct245adwr2g-etched.step` / `mc74hct245adwr2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc74hct245adwr2g.step` / `mc74hct245adwr2g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586193147353305088) (9 pp, sha256 `516ac0a5323b54b9`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mc74hct245adwr2g-datasheet.pdf)