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MC74HCT245ADWR2G

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onsemi Buffers, Drivers, Receivers, Transceivers, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MC74HCT245ADWR2G

onsemi · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil

MC74HCT245ADWR2G from onsemi, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIRECTION input Direction control: low transmits data from bus B to bus A, high transmits data from bus A to bus B.
2 A1 bidirectional Data port A, bit 1; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
3 A2 bidirectional Data port A, bit 2; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
4 A3 bidirectional Data port A, bit 3; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
5 A4 bidirectional Data port A, bit 4; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
6 A5 bidirectional Data port A, bit 5; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
7 A6 bidirectional Data port A, bit 6; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
8 A7 bidirectional Data port A, bit 7; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
9 A8 bidirectional Data port A, bit 8; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
10 GND power_in Ground reference (0 V) for all voltages on the device.
11 B8 bidirectional Data port B, bit 8; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
12 B7 bidirectional Data port B, bit 7; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
13 B6 bidirectional Data port B, bit 6; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
14 B5 bidirectional Data port B, bit 5; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
15 B4 bidirectional Data port B, bit 4; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
16 B3 bidirectional Data port B, bit 3; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
17 B2 bidirectional Data port B, bit 2; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
18 B1 bidirectional Data port B, bit 1; Vin and Vout must stay within GND to VCC, and unused inputs must be tied to GND or VCC.
19 OUTPUT ENABLE input Active-low output enable; when high, both buses are placed in the high-impedance (isolated) state.
20 VCC power_in Positive supply, 4.5 V to 5.5 V referenced to GND.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-20-300mil
Category Logic
Pins 20

CAD (KiCad official)

  • Symbol: MC74HCT245ADWR2G
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: mc74hct245adwr2g-etched.step / mc74hct245adwr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hct245adwr2g.step / mc74hct245adwr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 516ac0a5323b54b9, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF