component
MC74HC365ADTR2G
Public Made by Adomby adom
onsemi Buffers / Drivers, TSSOP-16. Pinout settled in review by an AI reviewer against the manufacturer's datasheet, KiCad symbol/footprint/3D.
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Symbol & Footprint
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README
markdownMC74HC365ADTR2G
onsemi · Buffers / Drivers · TSSOP-16
MC74HC365ADTR2G from onsemi, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OE1 | input | Active-low Output Enable 1; when either enable (OE1 or OE2) is high, the buffer outputs go to high-impedance. |
| 2 | A0 | input | Data input to buffer 0; Vin must stay between GND and VCC, and unused inputs must be tied to GND or VCC. |
| 3 | Y0 | tri_state | Noninverting 3-state output of buffer 0; left open if unused. |
| 4 | A1 | input | Data input to buffer 1; Vin must stay between GND and VCC, and unused inputs must be tied to GND or VCC. |
| 5 | Y1 | tri_state | Noninverting 3-state output of buffer 1; left open if unused. |
| 6 | A2 | input | Data input to buffer 2; Vin must stay between GND and VCC, and unused inputs must be tied to GND or VCC. |
| 7 | Y2 | tri_state | Noninverting 3-state output of buffer 2; left open if unused. |
| 8 | GND | power_in | Ground reference for all voltages; the device is specified with VCC referenced to GND. |
| 9 | Y3 | tri_state | Noninverting 3-state output of buffer 3; left open if unused. |
| 10 | A3 | input | Data input to buffer 3; Vin must stay between GND and VCC, and unused inputs must be tied to GND or VCC. |
| 11 | Y4 | tri_state | Noninverting 3-state output of buffer 4; left open if unused. |
| 12 | A4 | input | Data input to buffer 4; Vin must stay between GND and VCC, and unused inputs must be tied to GND or VCC. |
| 13 | Y5 | tri_state | Noninverting 3-state output of buffer 5; left open if unused. |
| 14 | A5 | input | Data input to buffer 5; Vin must stay between GND and VCC, and unused inputs must be tied to GND or VCC. |
| 15 | OE2 | input | Active-low Output Enable 2; when either enable (OE1 or OE2) is high, the buffer outputs go to high-impedance. |
| 16 | VCC | power_in | Positive supply, specified at 2.0 V to 6.0 V referenced to GND (absolute maximum 7.0 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TSSOP-16 |
| Category | Logic ICs |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage (Referenced to GND) | VCC | 2 | 6 | V | 3 | ||
| DC Input Voltage, Output Voltage (Referenced to GND) | Vin, Vout | 0 | V | max = VCC | 3 | ||
| Operating Temperature, All Package Types | TA | -55 | 125 | °C | 3 | ||
| Input Rise and Fall Time | tr, tf | 0 | 1000 | ns | VCC = 2.0 V (Figure 1) | 3 | |
| Input Rise and Fall Time | tr, tf | 0 | 600 | ns | VCC = 3.0 V (Figure 1) | 3 | |
| Input Rise and Fall Time | tr, tf | 0 | 500 | ns | VCC = 4.5 V (Figure 1) | 3 | |
| Input Rise and Fall Time | tr, tf | 0 | 400 | ns | VCC = 6.0 V (Figure 1) | 3 | |
| DC Supply Voltage | VCC | -0.5 | 7 | V | Referenced to GND | 3 | |
| DC Input Voltage | Vin | -0.5 | V | Referenced to GND; max = VCC + 0.5 V | 3 | ||
| DC Output Voltage | Vout | -0.5 | V | Referenced to GND; max = VCC + 0.5 V | 3 | ||
| DC Input Current, per Pin | Iin | -20 | 20 | mA | 3 | ||
| DC Output Current, per Pin | Iout | -25 | 25 | mA | 3 | ||
| DC Supply Current, VCC and GND Pins | ICC | -50 | 50 | mA | 3 | ||
| Power Dissipation in Still Air, TSSOP Package | PD | 450 | mW | TSSOP package; still air | 3 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 3 | ||
| Lead Temperature | TL | 260 | °C | SOIC or TSSOP package; 1 mm from case for 10 seconds | 3 | ||
| Minimum High-Level Input Voltage | VIH | 1.5 | V | VCC = 2.0 V; Vout = VCC, 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Input Voltage | VIH | 2.1 | V | VCC = 3.0 V; Vout = VCC, 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Input Voltage | VIH | 3.15 | V | VCC = 4.5 V; Vout = VCC, 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Input Voltage | VIH | 4.2 | V | VCC = 6.0 V; Vout = VCC, 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.5 | V | VCC = 2.0 V; Vout = 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 0.9 | V | VCC = 3.0 V; Vout = 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 1.35 | V | VCC = 4.5 V; Vout = 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Maximum Low-Level Input Voltage | VIL | 1.8 | V | VCC = 6.0 V; Vout = 0.1 V; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 1.9 | V | VCC = 2.0 V; Vin = VIH; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 4.4 | V | VCC = 4.5 V; Vin = VIH; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 5.9 | V | VCC = 6.0 V; Vin = VIH; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 2.2 | V | VCC = 3.0 V; Vin = VIH; /Iout/ ≤ 3.6 mA; TA = 125 °C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 3.7 | V | VCC = 4.5 V; Vin = VIH; /Iout/ ≤ 6.0 mA; TA = 125 °C | 3 | ||
| Minimum High-Level Output Voltage | VOH | 5.2 | V | VCC = 6.0 V; Vin = VIH; /Iout/ ≤ 7.8 mA; TA = 125 °C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.1 | V | VCC = 2.0 V; Vin = VIL; /Iout/ ≤ 20 μA; TA -55 to 125 °C | 3 | ||
| Maximum Low-Level Output Voltage | VOL | 0.4 | V | VCC = 3.0 V; Vin = VIL; /Iout/ ≤ 3.6 mA; TA = 125 °C | 3 | ||
| Maximum Input Leakage Current | Iin | -1 | 1 | μA | VCC = 6.0 V; Vin = VCC or GND; TA = 125 °C | 4 | |
| Maximum Three-State Leakage Current | IOZ | -10 | 10 | μA | VCC = 6.0 V; output in high-impedance state; Vin = VIL or VIH; Vout = VCC or GND; TA = 125 °C | 4 | |
| Maximum Quiescent Supply Current (per Package) | ICC | 160 | μA | VCC = 6.0 V; Vin = VCC or GND; Iout = 0 μA; TA = 125 °C | 4 | ||
| Maximum Input Capacitance | Cin | 10 | pF | 4 | |||
| Maximum Three-State Output Capacitance | Cout | 15 | pF | Output in high-impedance state | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 180 | ns | VCC = 2.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 90 | ns | VCC = 3.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 36 | ns | VCC = 4.5 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Input A to Output Y | tPLH, tPHL | 31 | ns | VCC = 6.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Propagation Delay, Output Enable to Output Y | tPLZ, tPHZ | 330 | ns | VCC = 2.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 2 and 4) | 4 | ||
| Maximum Propagation Delay, Output Enable to Output Y | tPLZ, tPHZ | 170 | ns | VCC = 3.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 2 and 4) | 4 | ||
| Maximum Propagation Delay, Output Enable to Output Y | tPLZ, tPHZ | 66 | ns | VCC = 4.5 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 2 and 4) | 4 | ||
| Maximum Propagation Delay, Output Enable to Output Y | tPLZ, tPHZ | 56 | ns | VCC = 6.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 2 and 4) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 90 | ns | VCC = 2.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 34 | ns | VCC = 3.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 18 | ns | VCC = 4.5 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 | ||
| Maximum Output Transition Time, Any Output | tTLH, tTHL | 15 | ns | VCC = 6.0 V; CL = 50 pF; tr = tf = 6 ns; TA = 125 °C (Figures 1 and 3) | 4 |
CAD (KiCad official)
- Symbol:
MC74HC365ADTR2G - Footprint:
Package_SO:TSSOP-16_4.4x5mm_P0.65mm - 3D model: TSSOP-16 (KiCad packages3D, STEP)
- 3D model files:
mc74hc365adtr2g-etched.step/mc74hc365adtr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc74hc365adtr2g.step/mc74hc365adtr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
eb31c6ff0662833b, retrieved 2026-11-05, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).