component
MC33152DR2G
Public Made by Adomby adom
onsemi Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MC33152DR2G
onsemi · Gate Drivers · SOIC-8
MC33152DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N.C. | unconnected | No connection; the datasheet pin connection diagram lists this pin as N.C. with no further function given. |
| 2 | Logic Input A | input | Noninverting logic input for channel A with 170 mV hysteresis and a 30 kΩ internal pulldown; the input accepts ground to VCC, and for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less. |
| 3 | GND | power_in | Ground reference for the logic inputs and drive outputs; the output stages are referenced to this pin. |
| 4 | Logic Input B | input | Noninverting logic input for channel B with 170 mV hysteresis and a 30 kΩ internal pulldown; the input accepts ground to VCC, and for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less. |
| 5 | Drive Output B | output | Totem-pole drive output for channel B capable of sourcing and sinking up to 1.5 A, with a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V; no overcurrent or thermal protection, so shorting to VCC or ground must be avoided. |
| 6 | VCC | power_in | Supply pin with an operating range of 6.1 V to 18 V and an absolute maximum of 20 V; the undervoltage lockout starts at 5.8 V with a lower threshold of 5.3 V. |
| 7 | Drive Output A | output | Totem-pole drive output for channel A capable of sourcing and sinking up to 1.5 A, with a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V; no overcurrent or thermal protection, so shorting to VCC or ground must be avoided. |
| 8 | N.C. | unconnected | No connection; the datasheet pin connection diagram lists this pin as N.C. with no further function given. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage | VCC | 20 | V | 2 | |||
| Logic Inputs Voltage | Vin | -0.3 | V | Printed as -0.3 to +VCC | 2 | ||
| Totem Pole Sink or Source Current | IO | 1.5 | A | Drive Outputs | 2 | ||
| Diode Clamp Current (Drive Output to VCC) | IO(clamp) | 1 | A | 2 | |||
| ESD Human Body Model | ESD | 2000 | V | HBM | 2 | ||
| ESD Machine Model | ESD | 200 | V | MM | 2 | ||
| Maximum Power Dissipation (D suffix SOIC-8) | PD | 0.56 | W | TA = 50°C | 2 | ||
| Thermal Resistance, Junction-to-Air (D suffix SOIC-8) | RJA | 180 | °C/W | D suffix package | 2 | ||
| Operating Junction Temperature | TJ | 150 | °C | 2 | |||
| Operating Ambient Temperature MC33152 | TA | -40 | 85 | °C | MC33152 | 2 | |
| Storage Temperature Range | Tstg | -65 | 150 | °C | 2 | ||
| Operating Voltage | VCC | 6.1 | 18 | V | 3 | ||
| Input Threshold Voltage Output Transition High-to-Low State | VIH | 1.75 | 2.6 | V | VCC = 12 V | 3 | |
| Input Threshold Voltage Output Transition Low-to-High State | VIL | 0.8 | 1.58 | V | VCC = 12 V | 3 | |
| Input Current High State | IIH | 100 | 300 | µA | VIH = 2.6 V | 3 | |
| Input Current Low State | IIL | 20 | 100 | µA | VIL = 0.8 V | 3 | |
| Output Voltage Low State | VOL | 0.8 | 1.2 | V | Isink = 10 mA | 3 | |
| Output Voltage Low State | VOL | 1.1 | 1.5 | V | Isink = 50 mA | 3 | |
| Output Voltage Low State | VOL | 1.8 | 2.5 | V | Isink = 400 mA | 3 | |
| Output Voltage High State | VOH | 10.5 | 11.2 | V | Isource = 10 mA | 3 | |
| Output Voltage High State | VOH | 10.4 | 11.1 | V | Isource = 50 mA | 3 | |
| Output Voltage High State | VOH | 10 | 10.8 | V | Isource = 400 mA | 3 | |
| Propagation Delay Drive Output Rise | tPLH (IN/OUT) | 55 | 120 | ns | CL = 1.0 nF | 3 | |
| Propagation Delay Drive Output Fall | tPHL (IN/OUT) | 40 | 120 | ns | CL = 1.0 nF | 3 | |
| Drive Output Rise Time (10% to 90%) | tr | 14 | 30 | ns | CL = 1.0 nF | 3 | |
| Drive Output Fall Time (90% to 10%) | tf | 15 | 30 | ns | CL = 1.0 nF | 3 | |
| Power Supply Current Standby | ICC | 6 | 8 | mA | Logic Inputs Grounded | 3 | |
| Power Supply Current Operating | ICC | 10.5 | 15 | mA | CL = 1.0 nF Drive Outputs 1 and 2, f = 100 kHz | 3 | |
| Startup Threshold (UVLO) | Vth | 5.8 | 6.1 | V | 3 |
CAD (KiCad official)
- Symbol:
MC33152DR2G - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
mc33152dr2g-etched.step/mc33152dr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mc33152dr2g.step/mc33152dr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (12 pp, sha256
a8e24b171b0f1c5d, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MC33152DR2G
**onsemi** · Gate Drivers · SOIC-8
MC33152DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N.C. | unconnected | No connection; the datasheet pin connection diagram lists this pin as N.C. with no further function given. |
| 2 | Logic Input A | input | Noninverting logic input for channel A with 170 mV hysteresis and a 30 kΩ internal pulldown; the input accepts ground to VCC, and for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less. |
| 3 | GND | power_in | Ground reference for the logic inputs and drive outputs; the output stages are referenced to this pin. |
| 4 | Logic Input B | input | Noninverting logic input for channel B with 170 mV hysteresis and a 30 kΩ internal pulldown; the input accepts ground to VCC, and for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less. |
| 5 | Drive Output B | output | Totem-pole drive output for channel B capable of sourcing and sinking up to 1.5 A, with a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V; no overcurrent or thermal protection, so shorting to VCC or ground must be avoided. |
| 6 | VCC | power_in | Supply pin with an operating range of 6.1 V to 18 V and an absolute maximum of 20 V; the undervoltage lockout starts at 5.8 V with a lower threshold of 5.3 V. |
| 7 | Drive Output A | output | Totem-pole drive output for channel A capable of sourcing and sinking up to 1.5 A, with a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V; no overcurrent or thermal protection, so shorting to VCC or ground must be avoided. |
| 8 | N.C. | unconnected | No connection; the datasheet pin connection diagram lists this pin as N.C. with no further function given. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage | VCC | | | 20 | V | | 2 |
| Logic Inputs Voltage | Vin | -0.3 | | | V | Printed as -0.3 to +VCC | 2 |
| Totem Pole Sink or Source Current | IO | | | 1.5 | A | Drive Outputs | 2 |
| Diode Clamp Current (Drive Output to VCC) | IO(clamp) | | | 1 | A | | 2 |
| ESD Human Body Model | ESD | | | 2000 | V | HBM | 2 |
| ESD Machine Model | ESD | | | 200 | V | MM | 2 |
| Maximum Power Dissipation (D suffix SOIC-8) | PD | | | 0.56 | W | TA = 50°C | 2 |
| Thermal Resistance, Junction-to-Air (D suffix SOIC-8) | RJA | | | 180 | °C/W | D suffix package | 2 |
| Operating Junction Temperature | TJ | | | 150 | °C | | 2 |
| Operating Ambient Temperature MC33152 | TA | -40 | | 85 | °C | MC33152 | 2 |
| Storage Temperature Range | Tstg | -65 | | 150 | °C | | 2 |
| Operating Voltage | VCC | 6.1 | | 18 | V | | 3 |
| Input Threshold Voltage Output Transition High-to-Low State | VIH | | 1.75 | 2.6 | V | VCC = 12 V | 3 |
| Input Threshold Voltage Output Transition Low-to-High State | VIL | 0.8 | 1.58 | | V | VCC = 12 V | 3 |
| Input Current High State | IIH | | 100 | 300 | µA | VIH = 2.6 V | 3 |
| Input Current Low State | IIL | | 20 | 100 | µA | VIL = 0.8 V | 3 |
| Output Voltage Low State | VOL | | 0.8 | 1.2 | V | Isink = 10 mA | 3 |
| Output Voltage Low State | VOL | | 1.1 | 1.5 | V | Isink = 50 mA | 3 |
| Output Voltage Low State | VOL | | 1.8 | 2.5 | V | Isink = 400 mA | 3 |
| Output Voltage High State | VOH | 10.5 | 11.2 | | V | Isource = 10 mA | 3 |
| Output Voltage High State | VOH | 10.4 | 11.1 | | V | Isource = 50 mA | 3 |
| Output Voltage High State | VOH | 10 | 10.8 | | V | Isource = 400 mA | 3 |
| Propagation Delay Drive Output Rise | tPLH (IN/OUT) | | 55 | 120 | ns | CL = 1.0 nF | 3 |
| Propagation Delay Drive Output Fall | tPHL (IN/OUT) | | 40 | 120 | ns | CL = 1.0 nF | 3 |
| Drive Output Rise Time (10% to 90%) | tr | | 14 | 30 | ns | CL = 1.0 nF | 3 |
| Drive Output Fall Time (90% to 10%) | tf | | 15 | 30 | ns | CL = 1.0 nF | 3 |
| Power Supply Current Standby | ICC | | 6 | 8 | mA | Logic Inputs Grounded | 3 |
| Power Supply Current Operating | ICC | | 10.5 | 15 | mA | CL = 1.0 nF Drive Outputs 1 and 2, f = 100 kHz | 3 |
| Startup Threshold (UVLO) | Vth | | 5.8 | 6.1 | V | | 3 |
## CAD (KiCad official)
- Symbol: `MC33152DR2G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `mc33152dr2g-etched.step` / `mc33152dr2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc33152dr2g.step` / `mc33152dr2g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586183213337624576) (12 pp, sha256 `a8e24b171b0f1c5d`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/mc33152dr2g-datasheet.pdf)