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MC33152DR2G

onsemi · Gate Drivers · SOIC-8

MC33152DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected No connection; the datasheet pin connection diagram lists this pin as N.C. with no further function given.
2 Logic Input A input Noninverting logic input for channel A with 170 mV hysteresis and a 30 kΩ internal pulldown; the input accepts ground to VCC, and for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less.
3 GND power_in Ground reference for the logic inputs and drive outputs; the output stages are referenced to this pin.
4 Logic Input B input Noninverting logic input for channel B with 170 mV hysteresis and a 30 kΩ internal pulldown; the input accepts ground to VCC, and for optimum switching speed the maximum input voltage should be limited to 10 V or VCC, whichever is less.
5 Drive Output B output Totem-pole drive output for channel B capable of sourcing and sinking up to 1.5 A, with a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V; no overcurrent or thermal protection, so shorting to VCC or ground must be avoided.
6 VCC power_in Supply pin with an operating range of 6.1 V to 18 V and an absolute maximum of 20 V; the undervoltage lockout starts at 5.8 V with a lower threshold of 5.3 V.
7 Drive Output A output Totem-pole drive output for channel A capable of sourcing and sinking up to 1.5 A, with a 100 kΩ pulldown to keep the MOSFET gate low when VCC is below 1.4 V; no overcurrent or thermal protection, so shorting to VCC or ground must be avoided.
8 N.C. unconnected No connection; the datasheet pin connection diagram lists this pin as N.C. with no further function given.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Supply Voltage VCC 20 V 2
Logic Inputs Voltage Vin -0.3 V Printed as -0.3 to +VCC 2
Totem Pole Sink or Source Current IO 1.5 A Drive Outputs 2
Diode Clamp Current (Drive Output to VCC) IO(clamp) 1 A 2
ESD Human Body Model ESD 2000 V HBM 2
ESD Machine Model ESD 200 V MM 2
Maximum Power Dissipation (D suffix SOIC-8) PD 0.56 W TA = 50°C 2
Thermal Resistance, Junction-to-Air (D suffix SOIC-8) RJA 180 °C/W D suffix package 2
Operating Junction Temperature TJ 150 °C 2
Operating Ambient Temperature MC33152 TA -40 85 °C MC33152 2
Storage Temperature Range Tstg -65 150 °C 2
Operating Voltage VCC 6.1 18 V 3
Input Threshold Voltage Output Transition High-to-Low State VIH 1.75 2.6 V VCC = 12 V 3
Input Threshold Voltage Output Transition Low-to-High State VIL 0.8 1.58 V VCC = 12 V 3
Input Current High State IIH 100 300 µA VIH = 2.6 V 3
Input Current Low State IIL 20 100 µA VIL = 0.8 V 3
Output Voltage Low State VOL 0.8 1.2 V Isink = 10 mA 3
Output Voltage Low State VOL 1.1 1.5 V Isink = 50 mA 3
Output Voltage Low State VOL 1.8 2.5 V Isink = 400 mA 3
Output Voltage High State VOH 10.5 11.2 V Isource = 10 mA 3
Output Voltage High State VOH 10.4 11.1 V Isource = 50 mA 3
Output Voltage High State VOH 10 10.8 V Isource = 400 mA 3
Propagation Delay Drive Output Rise tPLH (IN/OUT) 55 120 ns CL = 1.0 nF 3
Propagation Delay Drive Output Fall tPHL (IN/OUT) 40 120 ns CL = 1.0 nF 3
Drive Output Rise Time (10% to 90%) tr 14 30 ns CL = 1.0 nF 3
Drive Output Fall Time (90% to 10%) tf 15 30 ns CL = 1.0 nF 3
Power Supply Current Standby ICC 6 8 mA Logic Inputs Grounded 3
Power Supply Current Operating ICC 10.5 15 mA CL = 1.0 nF Drive Outputs 1 and 2, f = 100 kHz 3
Startup Threshold (UVLO) Vth 5.8 6.1 V 3

CAD (KiCad official)

  • Symbol: MC33152DR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mc33152dr2g-etched.step / mc33152dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc33152dr2g.step / mc33152dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (12 pp, sha256 a8e24b171b0f1c5d, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF