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MC14076BDR2G

onsemi · Flip Flops · SOIC-16

MC14076BDR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTPUT DISABLE A input OR-gated output-disable input; when either output disable A or B is high, the Q outputs go to the high-impedance state without affecting flip-flop sequencing.
2 OUTPUT DISABLE B input OR-gated output-disable input; when either output disable A or B is high, the Q outputs go to the high-impedance state without affecting flip-flop sequencing.
3 Q0 tri_state Three-state output of flip-flop 0, which goes high-impedance when output disable A or B is high; unused outputs must be left open.
4 Q1 tri_state Three-state output of flip-flop 1, which goes high-impedance when output disable A or B is high; unused outputs must be left open.
5 Q2 tri_state Three-state output of flip-flop 2, which goes high-impedance when output disable A or B is high; unused outputs must be left open.
6 Q3 tri_state Three-state output of flip-flop 3, which goes high-impedance when output disable A or B is high; unused outputs must be left open.
7 CLOCK input Common clock that synchronously loads the four D-type flip-flops; the clock input is fully independent of the reset and disable inputs.
8 VSS power_in Negative supply and reference for all voltages; inputs and outputs must stay within VSS ≤ (Vin or Vout) ≤ VDD.
9 DATA DISABLE B input OR-gated data-disable input; when either data disable A or B is high, the Q outputs are fed back to the D inputs so the registers hold state while the clock continues.
10 DATA DISABLE A input OR-gated data-disable input; when either data disable A or B is high, the Q outputs are fed back to the D inputs so the registers hold state while the clock continues.
11 D3 input Parallel data input to flip-flop 3; unused inputs must be tied to VSS or VDD and must not be left floating.
12 D2 input Parallel data input to flip-flop 2; unused inputs must be tied to VSS or VDD and must not be left floating.
13 D1 input Parallel data input to flip-flop 1; unused inputs must be tied to VSS or VDD and must not be left floating.
14 D0 input Parallel data input to flip-flop 0; unused inputs must be tied to VSS or VDD and must not be left floating.
15 RESET input Asynchronous master reset; when high it clears all four flip-flops to 0 independent of the clock or disable inputs.
16 VDD power_in Positive supply, specified from 3.0 Vdc to 18 Vdc with absolute maximum DC supply of −0.5 to +18.0 V referenced to VSS.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Logic
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage Range VDD -0.5 18 V Voltages referenced to VSS 1
Input or Output Voltage Range (DC or Transient) Vin, Vout -0.5 V DC or transient; upper limit printed as VDD + 0.5 1
Input or Output Current (DC or Transient) per Pin Iin, Iout -10 10 mA DC or transient, per pin; printed as ±10 mA 1
Power Dissipation, per Package PD 500 mW Per package (Note 1) 1
Ambient Temperature Range TA -55 125 °C 1
Storage Temperature Range Tstg -65 150 °C 1
Lead Temperature TL 260 °C 8-second soldering 1
Supply Voltage Range VDD 3 18 Vdc Supply voltage range as listed in Features 1
Output Voltage '0' Level VOL 0 0.05 Vdc VDD 5.0 Vdc; Vin = VDD or 0; 25C 3
Output Voltage '1' Level VOH 4.95 5 Vdc VDD 5.0 Vdc; Vin = 0 or VDD; 25C 3
Output Voltage '1' Level VOH 9.95 10 Vdc VDD 10 Vdc; Vin = 0 or VDD; 25C 3
Output Voltage '1' Level VOH 14.95 15 Vdc VDD 15 Vdc; Vin = 0 or VDD; 25C 3
Input Voltage '0' Level VIL 2.25 1.5 Vdc VDD 5.0 Vdc; VO = 4.5 or 0.5 Vdc; 25C 3
Input Voltage '0' Level VIL 4.5 3 Vdc VDD 10 Vdc; VO = 9.0 or 1.0 Vdc; 25C 3
Input Voltage '0' Level VIL 6.75 4 Vdc VDD 15 Vdc; VO = 13.5 or 1.5 Vdc; 25C 3
Input Voltage '1' Level VIH 3.5 2.75 Vdc VDD 5.0 Vdc; VO = 0.5 or 4.5 Vdc; 25C 3
Input Voltage '1' Level VIH 7 5.5 Vdc VDD 10 Vdc; VO = 1.0 or 9.0 Vdc; 25C 3
Input Voltage '1' Level VIH 11 8.25 Vdc VDD 15 Vdc; VO = 1.5 or 13.5 Vdc; 25C 3
Output Drive Current, Source IOH -2.4 -4.2 mAdc VDD 5.0 Vdc; VOH = 2.5 Vdc; 25C 3
Output Drive Current, Source IOH -0.51 -0.88 mAdc VDD 5.0 Vdc; VOH = 4.6 Vdc; 25C 3
Output Drive Current, Source IOH -1.3 -2.25 mAdc VDD 10 Vdc; VOH = 9.5 Vdc; 25C 3
Output Drive Current, Source IOH -3.4 -8.8 mAdc VDD 15 Vdc; VOH = 13.5 Vdc; 25C 3
Output Drive Current, Sink IOL 0.51 0.88 mAdc VDD 5.0 Vdc; VOL = 0.4 Vdc; 25C 3
Output Drive Current, Sink IOL 1.3 2.25 mAdc VDD 10 Vdc; VOL = 0.5 Vdc; 25C 3
Output Drive Current, Sink IOL 3.4 8.8 mAdc VDD 15 Vdc; VOL = 1.5 Vdc; 25C 3
Quiescent Current (Per Package) IDD 0.005 5 Adc VDD 5.0 Vdc; per package; 25C 3
Quiescent Current (Per Package) IDD 0.01 10 Adc VDD 10 Vdc; per package; 25C 3
Quiescent Current (Per Package) IDD 0.015 20 Adc VDD 15 Vdc; per package; 25C 3
Input Capacitance Cin 5 7.5 pF Vin = 0; 25C 3
Input Current Iin -0.1 1e-05 0.1 Adc VDD 15 Vdc; 25C; printed as ±0.1 3
Three-State Leakage Current ITL -0.1 0.0001 0.1 Adc VDD 15 Vdc; 25C; printed as ±0.1 3
Output Voltage '0' Level VOL 0.05 Vdc VDD 5.0 Vdc; Vin = VDD or 0; 125C 3
Output Voltage '1' Level VOH 4.95 Vdc VDD 5.0 Vdc; Vin = 0 or VDD; 125C 3
Output Voltage '1' Level VOH 9.95 Vdc VDD 10 Vdc; Vin = 0 or VDD; 125C 3
Output Voltage '1' Level VOH 14.95 Vdc VDD 15 Vdc; Vin = 0 or VDD; 125C 3
Input Voltage '0' Level VIL 1.5 Vdc VDD 5.0 Vdc; VO = 4.5 or 0.5 Vdc; 125C 3
Input Voltage '0' Level VIL 3 Vdc VDD 10 Vdc; VO = 9.0 or 1.0 Vdc; 125C 3
Input Voltage '0' Level VIL 4 Vdc VDD 15 Vdc; VO = 13.5 or 1.5 Vdc; 125C 3
Input Voltage '1' Level VIH 3.5 Vdc VDD 5.0 Vdc; VO = 0.5 or 4.5 Vdc; 125C 3
Input Voltage '1' Level VIH 7 Vdc VDD 10 Vdc; VO = 1.0 or 9.0 Vdc; 125C 3
Input Voltage '1' Level VIH 11 Vdc VDD 15 Vdc; VO = 1.5 or 13.5 Vdc; 125C 3
Quiescent Current (Per Package) IDD 150 Adc VDD 5.0 Vdc; per package; 125C 3
Quiescent Current (Per Package) IDD 300 Adc VDD 10 Vdc; per package; 125C 3
Quiescent Current (Per Package) IDD 600 Adc VDD 15 Vdc; per package; 125C 3
Output Drive Current, Source IOH -1.7 mAdc VDD 5.0 Vdc; VOH = 2.5 Vdc; 125C 3
Output Drive Current, Source IOH -0.36 mAdc VDD 5.0 Vdc; VOH = 4.6 Vdc; 125C 3
Output Drive Current, Source IOH -0.9 mAdc VDD 10 Vdc; VOH = 9.5 Vdc; 125C 3
Output Drive Current, Source IOH -2.4 mAdc VDD 15 Vdc; VOH = 13.5 Vdc; 125C 3
Output Drive Current, Sink IOL 0.36 mAdc VDD 5.0 Vdc; VOL = 0.4 Vdc; 125C 3
Output Drive Current, Sink IOL 0.9 mAdc VDD 10 Vdc; VOL = 0.5 Vdc; 125C 3
Output Drive Current, Sink IOL 2.4 mAdc VDD 15 Vdc; VOL = 1.5 Vdc; 125C 3
Input Current Iin -1 1 Adc VDD 15 Vdc; 125C; printed as ±1.0 3
Three-State Leakage Current ITL -3 3 Adc VDD 15 Vdc; 125C; printed as ±3.0 3
Quiescent Current (Per Package) IDD 5 Adc VDD 5.0 Vdc; per package; -55C 3
Quiescent Current (Per Package) IDD 10 Adc VDD 10 Vdc; per package; -55C 3
Quiescent Current (Per Package) IDD 20 Adc VDD 15 Vdc; per package; -55C 3

CAD (KiCad official)

  • Symbol: MC14076BDR2G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: mc14076bdr2g-etched.step / mc14076bdr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc14076bdr2g.step / mc14076bdr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 df82d0401a9230af, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF