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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206

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MBRA2H100T3G

onsemi · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

MBRA2H100T3G from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CATHODE	passive	Cathode terminal, marked by the polarity band on the package; part is rated for 100 V VRRM/VR and 2.0 A average forward current.
2	ANODE	passive	Anode terminal of the Schottky rectifier; forward voltage is 0.79 V max at 2.0 A and TJ = 25°C.

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	SMA(DO-214AC)
Category	Diodes
Pins	2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage	VRRM, VRWM, VR			100	V		2
Average Rectified Forward Current	IO			2	A	TL = 150°C	2
Non-Repetitive Peak Surge Current	IFSM			130	A	Surge applied at rated load conditions, halfwave, single phase, 60 Hz	2
Storage Temperature Range	Tstg	-65		175	°C		2
Operating Junction Temperature	TJ	-65		175	°C	dPD/dTJ < 1/RθJA	2
Maximum Instantaneous Forward Voltage	vF			0.79	V	iF = 2.0 A, TJ = 25°C, pulse width ≤ 380 µs, duty cycle ≤ 2.0%	2
Maximum Instantaneous Forward Voltage	vF			0.65	V	iF = 2.0 A, TJ = 125°C, pulse width ≤ 380 µs, duty cycle ≤ 2.0%	2
Maximum Instantaneous Reverse Current	IR			0.008	mA	VR = 100 V, TJ = 25°C, pulse width ≤ 380 µs, duty cycle ≤ 2.0%	2
Maximum Instantaneous Reverse Current	IR			1.5	mA	VR = 100 V, TJ = 125°C, pulse width ≤ 380 µs, duty cycle ≤ 2.0%	2
Thermal Resistance, Junction-to-Lead	RθJL		14		°C/W	Mounted with 700 mm square copper pad, 1 oz FR4 board (Note 2)	2
Thermal Resistance, Junction-to-Ambient	RθJA		75		°C/W	Mounted with 700 mm square copper pad, 1 oz FR4 board (Note 2)	2
Thermal Resistance, Junction-to-Ambient	RθJA		275		°C/W	Mounted with minimum recommended pad size, 1 oz FR4 board (Note 3)	2

CAD (KiCad official)

Symbol: MBRA2H100T3G
Footprint: Diode_SMD:D_SMA
3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
3D model files: mbra2h100t3g-etched.step / mbra2h100t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbra2h100t3g.step / mbra2h100t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (7 pp, sha256 57bceb5a0fa46b16, retrieved 2026-10-23, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF