# MBR1660

**SMC Sangdest Microelectronicstronic Nanjing** · Schottky Diodes · TO-220-2

MBR1660 from SMC Sangdest Microelectronicstronic Nanjing, in a TO-220-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Schottky rectifier (also connected to the mounting tab); 60 V max repetitive reverse voltage for MBR1660. |
| 2 | A | passive | Anode of the Schottky rectifier; 16 A average rectified forward current at Tc=135°C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC Sangdest Microelectronicstronic Nanjing |
| Package | TO-220-2 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage (MBR1660) | VRRM, VRWM, VR |  |  | 60 | V |  | 1 |
| Average Rectified Forward Current | IF(AV) |  |  | 16 | A | 50% duty cycle @Tc=135°C, rectangular wave form | 1 |
| Peak One Cycle Non-Repetitive Surge Current | IFSM |  |  | 150 | A | 8.3ms, Half Sine pulse, TC = 25 ℃ | 1 |
| Junction Temperature | TJ | -55 |  | 150 | C |  | 2 |
| Storage Temperature | Tstg | -55 |  | 150 | C |  | 2 |
| Forward Voltage Drop | VF1 |  |  | 0.75 | V | @16A, Pulse, TJ = 25 ℃ | 2 |
| Forward Voltage Drop | VF2 |  |  | 0.65 | V | @16A, Pulse, TJ = 125 ℃ | 2 |
| Reverse Current | IR1 |  |  | 1 | mA | @VR = rated VR TJ = 25 ℃ | 2 |
| Reverse Current | IR2 |  |  | 50 | mA | @VR = rated VR TJ = 125 ℃ | 2 |
| Voltage Rate of Change | dv/dt |  |  | 10000 | V/μs |  | 2 |
| Typical Thermal Resistance Junction to Case | RθJC |  | 1.5 |  | C/W | DC operation | 2 |
| Typical Thermal Resistance Case to Heat Sink | RθCS |  | 0.5 |  | C/W | Mounting surface, smooth and greased | 2 |

## CAD (KiCad official)

- Symbol: `MBR1660`
- Footprint: `Package_TO_SOT_THT:TO-220-2_Vertical`
- 3D model: TO-220-2 (KiCad packages3D, STEP)
- 3D model files: `mbr1660-etched.step` / `mbr1660-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mbr1660.step` / `mbr1660.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC Sangdest Microelectronicstronic Nanjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588891128221745152) (5 pp, sha256 `314f5d1d706e2692`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mbr1660-datasheet.pdf)