MAX3085EIMM

HGSEMI · RS-485 / RS-422 ICs · MSOP-8

MAX3085EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: with RE low, RO is high when A−B is at or above −50mV and low when A−B is at or below −200mV, and RO is high-Z when RE is high.
2	RE	input	Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3	DE	input	Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; RE high with DE low puts the device into low-power shutdown, and DE has a hot-plug input structure.
4	DI	input	Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5	GND	power_in	Ground.
6	A	bidirectional	Receiver non-inverting input and driver non-inverting output (A/Y); the receiver has 1/8 unit-load input impedance (96kΩ) and the input range is −7V to +12V.
7	B	bidirectional	Receiver inverting input and driver inverting output (B/Z); the receiver has 1/8 unit-load input impedance (96kΩ) and the input range is −7V to +12V.
8	VCC	power_in	Positive supply, 4.5V ≤ VCC ≤ 5.5V; bypass with a 0.1µF capacitor to ground.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	MSOP-8
Category	Interface
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage (absolute maximum)	VCC			6	V		4
Control input voltage	RE, DE	-0.3		6	V		4
Driver input voltage	DI	-0.3		6	V		4
Driver output voltage (A,B,Y,Z)		-7		12	V		4
Receiver input voltage (A,B)		-7		12	V		4
Receiver output voltage (RO), max is VCC+0.3	RO	-0.3			V		4
Storage temperature		-65		150	°C		4
Lead temperature (soldering)	TLEAD			260	°C	soldering 10 s	4
Operating temperature range (EI grade)		-40		85	°C	MAX308_EI	4
Supply voltage	VCC	4.5		5.5	V		5
Differential driver output, RL=100Ω (RS-422)	VOD	2.7			V	Figure 1, RL=100Ω (RS-422)	5
Differential driver output, RL=54Ω (RS-485)	VOD	2.1			V	Figure 1, RL=54Ω (RS-485)	5
Change in magnitude of differential driver output voltage	ΔVOD			0.2	V	Figure 1, RL=100Ω or RL=54Ω	5
Driver common-mode output voltage	VOC			3	V	Figure 1, RL=100Ω or RL=54Ω	5
Change in magnitude of driver common-mode output voltage	ΔVOC			0.2	V	Figure 1, RL=100Ω or RL=54Ω	5
Input high voltage	VIH	2			V	DE, DI, RE	5
Input low voltage	VIL			0.8	V	DE, DI,	5
Input current	IIN	-1		1	μA	DE, DI, RE	5
Driver short-circuit output current	IOSD			250	mA	0≤VOUT≤12V	5
Driver short-circuit output current	IOSD	-250			mA	-7≤VOUT≤Vcc	5
Receiver differential threshold voltage	VTH	-200	-125	-50	mV	-7V≤VCM≤12V	5
Receiver output low voltage	VOL			0.4	V	IO=4mA, VID=-200mV	5
Receiver tri-state output current	IOZR	-1		1	μA	0≤VO≤VCC	5
Receiver input resistance	RIN	96			kΩ	-7V≤VCM≤12V	5
Receiver output short-circuit current	IOSR	7		95	mA	0V≤VRO≤VCC	5
Supply current, no load	ICC		530	900	μA	No load, RE=VCC, DI=GND or VCC, DE=VCC	6
Supply current, no load	ICC		475	600	μA	No load, RE=VCC, DI=GND or VCC, DE=GND	6
Supply current, no load	ICC		530	1000	μA	No load, RE=GND, DI=GND or VCC, DE=VCC	6
Supply current, no load	ICC		475	800	μA	No load, RE=GND, DI=GND or VCC, DE=GND	6
Standby mode supply current	ISHDN		0.05	10	μA	DE=GND, RE=VCC	6
ESD IEC61000-4-2 air-gap discharge (RS-485 pins)		-16		16	kV	IEC61000-4-2 air-gap discharge	6
ESD IEC61000-4-2 contact discharge, half-duplex		-16		16	kV	IEC61000-4-2 contact discharge, half-duplex	6
ESD HBM, all pins		-4		4	kV	JEDEC JS-001-2010	6
ESD CDM, all pins		-500		500	V	JESD22-C101E	6
Driver propagation delay, low to high	tDPLH	200		1000	ns	Fig 2,5; RL=54Ω, CL=50pF	8
Driver propagation delay, high to low	tDPHL	200		1000	ns	Fig 2,5; RL=54Ω, CL=50pF	8
Driver differential output skew	tDSKEW	-140		140	ns	Fig 2,5; RL=54Ω, CL=50pF	8
Driver rise and fall time	tDR, tDF	250		900	ns	Fig 2,5; RL=54Ω, CL=50pF	8
Maximum data rate (driver, 500kbps part)	fMAX			500	kbps		8
Driver enable to output high	tDZH			2500	ns	Fig 3,6; CL=100pF; S3 closed	8
Driver enable to output low	tDZL			2500	ns	Fig 3,6; CL=100pF; S2 closed	8
Driver low to disable time	tDLZ			100	ns	Fig 3,6; CL=15pF; S2 closed	8
Driver high to disable time	tDHZ			100	ns	Fig 3,6; CL=15pF; S3 closed	8
Driver enable from standby to output high	tDZH(SHDN)			5500	ns	Fig 3,6; CL=15pF; S3 closed	8
Driver enable from standby to output low	tDZL(SHDN)			5500	ns	Fig 3,6; CL=15pF; S2 closed	8
Driver standby time	tSHDN	50		700	ns		8
Receiver propagation delay	tRPLH, tRPHL			200	ns	Fig 7,8; CL=15pF; /VID/≥2.0V, VID≤15ns	8
Receiver differential output skew	tRSKEW	-30		30	ns	Fig 7,8; CL=15pF; /VID/≥2.0V, VID≤15ns	8
Maximum data rate (receiver, 500kbps part)	fMAX			500	kbps		8
Receiver enable to output low	tRZL			50	ns	Fig 4,9; S1=-1.5V, S2 to VCC	8
Receiver enable to output high	tRZH			50	ns	Fig 4,9; S1=+1.5V, S2 to GND	8
Receiver low to disable time	tRLZ			50	ns	Fig 4,9; S1=-1.5V, S2 to VCC	8
Receiver high to disable time	tRHZ			50	ns	Fig 4,9; S1=+1.5V, S2 to GND	8
Receiver enable from standby to output high	tRZH(SHDN)			5500	ns	Fig 4,9; S1=-1.5V, S2 to VCC	8
Receiver enable from standby to output low	tRZL(SHDN)			5500	ns	Fig 4,9; S1=+1.5V, S2 to GND	8
Receiver standby time	tSHDN	50		700	ns		8
Input hysteresis	VHYS		100		mV	DE, DI, RE	5
Receiver input hysteresis	ΔVTH		15		mV	VA+VB=0	5
Thermal shutdown temperature	TTS		165		°C		5
Thermal shutdown hysteresis	TTSH		15		°C		5

CAD (KiCad official)

Symbol: MAX3085EIMM
Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
3D model: MSOP-8 (KiCad packages3D, STEP)
3D model files: max3085eimm-etched.step / max3085eimm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3085eimm.step / max3085eimm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (28 pp, sha256 a74bdc964ee9cb50, retrieved 2026-10-19, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# MAX3085EIMM

**HGSEMI** · RS-485 / RS-422 ICs · MSOP-8

MAX3085EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: with RE low, RO is high when A−B is at or above −50mV and low when A−B is at or below −200mV, and RO is high-Z when RE is high. |
| 2 | RE | input | Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure. |
| 3 | DE | input | Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; RE high with DE low puts the device into low-power shutdown, and DE has a hot-plug input structure. |
| 4 | DI | input | Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low. |
| 5 | GND | power_in | Ground. |
| 6 | A | bidirectional | Receiver non-inverting input and driver non-inverting output (A/Y); the receiver has 1/8 unit-load input impedance (96kΩ) and the input range is −7V to +12V. |
| 7 | B | bidirectional | Receiver inverting input and driver inverting output (B/Z); the receiver has 1/8 unit-load input impedance (96kΩ) and the input range is −7V to +12V. |
| 8 | VCC | power_in | Positive supply, 4.5V ≤ VCC ≤ 5.5V; bypass with a 0.1µF capacitor to ground. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Interface |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (absolute maximum) | VCC |  |  | 6 | V |  | 4 |
| Control input voltage | RE, DE | -0.3 |  | 6 | V |  | 4 |
| Driver input voltage | DI | -0.3 |  | 6 | V |  | 4 |
| Driver output voltage (A,B,Y,Z) |  | -7 |  | 12 | V |  | 4 |
| Receiver input voltage (A,B) |  | -7 |  | 12 | V |  | 4 |
| Receiver output voltage (RO), max is VCC+0.3 | RO | -0.3 |  |  | V |  | 4 |
| Storage temperature |  | -65 |  | 150 | °C |  | 4 |
| Lead temperature (soldering) | TLEAD |  |  | 260 | °C | soldering 10 s | 4 |
| Operating temperature range (EI grade) |  | -40 |  | 85 | °C | MAX308_EI | 4 |
| Supply voltage | VCC | 4.5 |  | 5.5 | V |  | 5 |
| Differential driver output, RL=100Ω (RS-422) | VOD | 2.7 |  |  | V | Figure 1, RL=100Ω (RS-422) | 5 |
| Differential driver output, RL=54Ω (RS-485) | VOD | 2.1 |  |  | V | Figure 1, RL=54Ω (RS-485) | 5 |
| Change in magnitude of differential driver output voltage | ΔVOD |  |  | 0.2 | V | Figure 1, RL=100Ω or RL=54Ω | 5 |
| Driver common-mode output voltage | VOC |  |  | 3 | V | Figure 1, RL=100Ω or RL=54Ω | 5 |
| Change in magnitude of driver common-mode output voltage | ΔVOC |  |  | 0.2 | V | Figure 1, RL=100Ω or RL=54Ω | 5 |
| Input high voltage | VIH | 2 |  |  | V | DE, DI, RE | 5 |
| Input low voltage | VIL |  |  | 0.8 | V | DE, DI, | 5 |
| Input current | IIN | -1 |  | 1 | μA | DE, DI, RE | 5 |
| Driver short-circuit output current | IOSD |  |  | 250 | mA | 0≤VOUT≤12V | 5 |
| Driver short-circuit output current | IOSD | -250 |  |  | mA | -7≤VOUT≤Vcc | 5 |
| Receiver differential threshold voltage | VTH | -200 | -125 | -50 | mV | -7V≤VCM≤12V | 5 |
| Receiver output low voltage | VOL |  |  | 0.4 | V | IO=4mA, VID=-200mV | 5 |
| Receiver tri-state output current | IOZR | -1 |  | 1 | μA | 0≤VO≤VCC | 5 |
| Receiver input resistance | RIN | 96 |  |  | kΩ | -7V≤VCM≤12V | 5 |
| Receiver output short-circuit current | IOSR | 7 |  | 95 | mA | 0V≤VRO≤VCC | 5 |
| Supply current, no load | ICC |  | 530 | 900 | μA | No load, RE=VCC, DI=GND or VCC, DE=VCC | 6 |
| Supply current, no load | ICC |  | 475 | 600 | μA | No load, RE=VCC, DI=GND or VCC, DE=GND | 6 |
| Supply current, no load | ICC |  | 530 | 1000 | μA | No load, RE=GND, DI=GND or VCC, DE=VCC | 6 |
| Supply current, no load | ICC |  | 475 | 800 | μA | No load, RE=GND, DI=GND or VCC, DE=GND | 6 |
| Standby mode supply current | ISHDN |  | 0.05 | 10 | μA | DE=GND, RE=VCC | 6 |
| ESD IEC61000-4-2 air-gap discharge (RS-485 pins) |  | -16 |  | 16 | kV | IEC61000-4-2 air-gap discharge | 6 |
| ESD IEC61000-4-2 contact discharge, half-duplex |  | -16 |  | 16 | kV | IEC61000-4-2 contact discharge, half-duplex | 6 |
| ESD HBM, all pins |  | -4 |  | 4 | kV | JEDEC JS-001-2010 | 6 |
| ESD CDM, all pins |  | -500 |  | 500 | V | JESD22-C101E | 6 |
| Driver propagation delay, low to high | tDPLH | 200 |  | 1000 | ns | Fig 2,5; RL=54Ω, CL=50pF | 8 |
| Driver propagation delay, high to low | tDPHL | 200 |  | 1000 | ns | Fig 2,5; RL=54Ω, CL=50pF | 8 |
| Driver differential output skew | tDSKEW | -140 |  | 140 | ns | Fig 2,5; RL=54Ω, CL=50pF | 8 |
| Driver rise and fall time | tDR, tDF | 250 |  | 900 | ns | Fig 2,5; RL=54Ω, CL=50pF | 8 |
| Maximum data rate (driver, 500kbps part) | fMAX |  |  | 500 | kbps |  | 8 |
| Driver enable to output high | tDZH |  |  | 2500 | ns | Fig 3,6; CL=100pF; S3 closed | 8 |
| Driver enable to output low | tDZL |  |  | 2500 | ns | Fig 3,6; CL=100pF; S2 closed | 8 |
| Driver low to disable time | tDLZ |  |  | 100 | ns | Fig 3,6; CL=15pF; S2 closed | 8 |
| Driver high to disable time | tDHZ |  |  | 100 | ns | Fig 3,6; CL=15pF; S3 closed | 8 |
| Driver enable from standby to output high | tDZH(SHDN) |  |  | 5500 | ns | Fig 3,6; CL=15pF; S3 closed | 8 |
| Driver enable from standby to output low | tDZL(SHDN) |  |  | 5500 | ns | Fig 3,6; CL=15pF; S2 closed | 8 |
| Driver standby time | tSHDN | 50 |  | 700 | ns |  | 8 |
| Receiver propagation delay | tRPLH, tRPHL |  |  | 200 | ns | Fig 7,8; CL=15pF; /VID/≥2.0V, VID≤15ns | 8 |
| Receiver differential output skew | tRSKEW | -30 |  | 30 | ns | Fig 7,8; CL=15pF; /VID/≥2.0V, VID≤15ns | 8 |
| Maximum data rate (receiver, 500kbps part) | fMAX |  |  | 500 | kbps |  | 8 |
| Receiver enable to output low | tRZL |  |  | 50 | ns | Fig 4,9; S1=-1.5V, S2 to VCC | 8 |
| Receiver enable to output high | tRZH |  |  | 50 | ns | Fig 4,9; S1=+1.5V, S2 to GND | 8 |
| Receiver low to disable time | tRLZ |  |  | 50 | ns | Fig 4,9; S1=-1.5V, S2 to VCC | 8 |
| Receiver high to disable time | tRHZ |  |  | 50 | ns | Fig 4,9; S1=+1.5V, S2 to GND | 8 |
| Receiver enable from standby to output high | tRZH(SHDN) |  |  | 5500 | ns | Fig 4,9; S1=-1.5V, S2 to VCC | 8 |
| Receiver enable from standby to output low | tRZL(SHDN) |  |  | 5500 | ns | Fig 4,9; S1=+1.5V, S2 to GND | 8 |
| Receiver standby time | tSHDN | 50 |  | 700 | ns |  | 8 |
| Input hysteresis | VHYS |  | 100 |  | mV | DE, DI, RE | 5 |
| Receiver input hysteresis | ΔVTH |  | 15 |  | mV | VA+VB=0 | 5 |
| Thermal shutdown temperature | TTS |  | 165 |  | °C |  | 5 |
| Thermal shutdown hysteresis | TTSH |  | 15 |  | °C |  | 5 |

## CAD (KiCad official)

- Symbol: `MAX3085EIMM`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `max3085eimm-etched.step` / `max3085eimm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `max3085eimm.step` / `max3085eimm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8770707250677723136) (28 pp, sha256 `a74bdc964ee9cb50`, retrieved 2026-10-19, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/max3085eimm-datasheet.pdf)