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MAX3085EIMM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MAX3085EIMM

HGSEMI · RS-485 / RS-422 ICs · MSOP-8

MAX3085EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A−B is at or above −50mV and low when A−B is at or below −200mV, and RO is high-Z when RE is high.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3 DE input Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; RE high with DE low puts the device into low-power shutdown, and DE has a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5 GND power_in Ground.
6 A bidirectional Receiver non-inverting input and driver non-inverting output (A/Y); the receiver has 1/8 unit-load input impedance (96kΩ) and the input range is −7V to +12V.
7 B bidirectional Receiver inverting input and driver inverting output (B/Z); the receiver has 1/8 unit-load input impedance (96kΩ) and the input range is −7V to +12V.
8 VCC power_in Positive supply, 4.5V ≤ VCC ≤ 5.5V; bypass with a 0.1µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC 6 V 4
Control input voltage RE, DE -0.3 6 V 4
Driver input voltage DI -0.3 6 V 4
Driver output voltage (A,B,Y,Z) -7 12 V 4
Receiver input voltage (A,B) -7 12 V 4
Receiver output voltage (RO), max is VCC+0.3 RO -0.3 V 4
Storage temperature -65 150 °C 4
Lead temperature (soldering) TLEAD 260 °C soldering 10 s 4
Operating temperature range (EI grade) -40 85 °C MAX308_EI 4
Supply voltage VCC 4.5 5.5 V 5
Differential driver output, RL=100Ω (RS-422) VOD 2.7 V Figure 1, RL=100Ω (RS-422) 5
Differential driver output, RL=54Ω (RS-485) VOD 2.1 V Figure 1, RL=54Ω (RS-485) 5
Change in magnitude of differential driver output voltage ΔVOD 0.2 V Figure 1, RL=100Ω or RL=54Ω 5
Driver common-mode output voltage VOC 3 V Figure 1, RL=100Ω or RL=54Ω 5
Change in magnitude of driver common-mode output voltage ΔVOC 0.2 V Figure 1, RL=100Ω or RL=54Ω 5
Input high voltage VIH 2 V DE, DI, RE 5
Input low voltage VIL 0.8 V DE, DI, 5
Input current IIN -1 1 μA DE, DI, RE 5
Driver short-circuit output current IOSD 250 mA 0≤VOUT≤12V 5
Driver short-circuit output current IOSD -250 mA -7≤VOUT≤Vcc 5
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≤VCM≤12V 5
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 5
Receiver tri-state output current IOZR -1 1 μA 0≤VO≤VCC 5
Receiver input resistance RIN 96 kΩ -7V≤VCM≤12V 5
Receiver output short-circuit current IOSR 7 95 mA 0V≤VRO≤VCC 5
Supply current, no load ICC 530 900 μA No load, RE=VCC, DI=GND or VCC, DE=VCC 6
Supply current, no load ICC 475 600 μA No load, RE=VCC, DI=GND or VCC, DE=GND 6
Supply current, no load ICC 530 1000 μA No load, RE=GND, DI=GND or VCC, DE=VCC 6
Supply current, no load ICC 475 800 μA No load, RE=GND, DI=GND or VCC, DE=GND 6
Standby mode supply current ISHDN 0.05 10 μA DE=GND, RE=VCC 6
ESD IEC61000-4-2 air-gap discharge (RS-485 pins) -16 16 kV IEC61000-4-2 air-gap discharge 6
ESD IEC61000-4-2 contact discharge, half-duplex -16 16 kV IEC61000-4-2 contact discharge, half-duplex 6
ESD HBM, all pins -4 4 kV JEDEC JS-001-2010 6
ESD CDM, all pins -500 500 V JESD22-C101E 6
Driver propagation delay, low to high tDPLH 200 1000 ns Fig 2,5; RL=54Ω, CL=50pF 8
Driver propagation delay, high to low tDPHL 200 1000 ns Fig 2,5; RL=54Ω, CL=50pF 8
Driver differential output skew tDSKEW -140 140 ns Fig 2,5; RL=54Ω, CL=50pF 8
Driver rise and fall time tDR, tDF 250 900 ns Fig 2,5; RL=54Ω, CL=50pF 8
Maximum data rate (driver, 500kbps part) fMAX 500 kbps 8
Driver enable to output high tDZH 2500 ns Fig 3,6; CL=100pF; S3 closed 8
Driver enable to output low tDZL 2500 ns Fig 3,6; CL=100pF; S2 closed 8
Driver low to disable time tDLZ 100 ns Fig 3,6; CL=15pF; S2 closed 8
Driver high to disable time tDHZ 100 ns Fig 3,6; CL=15pF; S3 closed 8
Driver enable from standby to output high tDZH(SHDN) 5500 ns Fig 3,6; CL=15pF; S3 closed 8
Driver enable from standby to output low tDZL(SHDN) 5500 ns Fig 3,6; CL=15pF; S2 closed 8
Driver standby time tSHDN 50 700 ns 8
Receiver propagation delay tRPLH, tRPHL 200 ns Fig 7,8; CL=15pF; /VID/≥2.0V, VID≤15ns 8
Receiver differential output skew tRSKEW -30 30 ns Fig 7,8; CL=15pF; /VID/≥2.0V, VID≤15ns 8
Maximum data rate (receiver, 500kbps part) fMAX 500 kbps 8
Receiver enable to output low tRZL 50 ns Fig 4,9; S1=-1.5V, S2 to VCC 8
Receiver enable to output high tRZH 50 ns Fig 4,9; S1=+1.5V, S2 to GND 8
Receiver low to disable time tRLZ 50 ns Fig 4,9; S1=-1.5V, S2 to VCC 8
Receiver high to disable time tRHZ 50 ns Fig 4,9; S1=+1.5V, S2 to GND 8
Receiver enable from standby to output high tRZH(SHDN) 5500 ns Fig 4,9; S1=-1.5V, S2 to VCC 8
Receiver enable from standby to output low tRZL(SHDN) 5500 ns Fig 4,9; S1=+1.5V, S2 to GND 8
Receiver standby time tSHDN 50 700 ns 8
Input hysteresis VHYS 100 mV DE, DI, RE 5
Receiver input hysteresis ΔVTH 15 mV VA+VB=0 5
Thermal shutdown temperature TTS 165 °C 5
Thermal shutdown hysteresis TTSH 15 °C 5

CAD (KiCad official)

  • Symbol: MAX3085EIMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: max3085eimm-etched.step / max3085eimm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3085eimm.step / max3085eimm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (28 pp, sha256 a74bdc964ee9cb50, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF