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MAX14434FAWE+

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Analog Devices Inc./Maxim Integrated Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicesmax14434fawe+factory-2.0.0extractor-text

Verified MAX14434FAWE+

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 16 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MAX14434FAWE+ · SOIC-16 · 16 pins
  • ✓copper: 16 copper pads, none touching another net
  • ✓datasheet: all 16 pin names found in the 28-page datasheet
  • ✓distributor: lcsc C7456619, digikey MAX14434FAWE+-ND, mouser 700-MAX14434FAWE+
  • ✓family: SOIC-16_3.9x9.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-_i2zom2_/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 16 pins = 16 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 16 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ max14434fawe.kicad_sym✓ max14434fawe.kicad_mod✓ max14434fawe.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
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docs Publish 0.1.0 · Ray 10h ago
viewers max14434fawe: viewers · Ray 10h ago
max14434fawe-etched.glb Publish 0.1.0 · Ray 10h ago
max14434fawe-etched.step max14434fawe: factory component page (tier=mfr) · Ray 10h ago
max14434fawe-hero.glb max14434fawe: hero GLB from the etched model (keeps the MPN mark) · Ray 10h ago
max14434fawe-hero.overlay.json Publish 0.1.0 · Ray 10h ago
max14434fawe.glb Publish 0.1.0 · Ray 10h ago
max14434fawe.kicad_mod Publish 0.1.0 · Ray 10h ago
max14434fawe.kicad_sym Publish 0.1.0 · Ray 10h ago
max14434fawe.lbr Publish 0.1.0 · Ray 10h ago
max14434fawe.step Publish 0.1.0 · Ray 10h ago
package.json Publish 0.1.0 · Ray 10h ago
page.json Set visibility: public · Ray 10h ago
README.md Publish 0.1.0 · Ray 10h ago
verification.json Verified: Published by the parts factory: tier mfr, 16 pins · Ray 10h ago

MAX14434FAWE+

Analog Devices Inc./Maxim Integrated · Digital Isolators · SOIC-16

MAX14434FAWE+ from Analog Devices Inc./Maxim Integrated, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDA power_in Side A power supply, 1.71V to 5.5V relative to GNDA, bypass with a 0.1µF ceramic capacitor as close as possible to the pin.
2 GNDA power_in Ground reference for Side A.
3 IN1 input Logic Input 1 on Side A, corresponds to Logic Output 1 on Side B.
4 IN2 input Logic Input 2 on Side A, corresponds to Logic Output 2 on Side B.
5 IN3 input Logic Input 3 on Side A, corresponds to Logic Output 3 on Side B.
6 IN4 input Logic Input 4 on Side A, corresponds to Logic Output 4 on Side B.
7 I.C. passive Internally connected; leave unconnected or connect to GNDA or VDDA.
8 GNDA power_in Ground reference for Side A.
9 GNDB power_in Ground reference for Side B.
10 ENB input Active-high enable for Side B, with an internal 5µA pullup to VDDB.
11 OUT4 output Logic Output 4 on Side B.
12 OUT3 output Logic Output 3 on Side B.
13 OUT2 output Logic Output 2 on Side B.
14 OUT1 output Logic Output 1 on Side B.
15 GNDB power_in Ground reference for Side B.
16 VDDB power_in Side B power supply, 1.71V to 5.5V relative to GNDB, bypass with a 0.1µF ceramic capacitor as close as possible to the pin.

Key specifications

Parameter Value
Manufacturer Analog Devices Inc./Maxim Integrated
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDDA VDDA 1.71 5.5 V Relative to GNDA 2
Supply Voltage VDDB VDDB 1.71 5.5 V Relative to GNDB 2
Undervoltage-Lockout Threshold VUVLO_ 1.5 1.6 1.66 V VDD_ rising 2
Undervoltage-Lockout Threshold Hysteresis VUVLO_HYST 45 mV 2
Abs max VDDA to GNDA VDDA -0.3 6 V VDDA to GNDA 2
Abs max VDDB to GNDB VDDB -0.3 6 V VDDB to GNDB 2
Abs max IN_, EN_ Side A -0.3 6 V IN_, EN_ on Side A to GNDA 2
Abs max IN_, EN_ Side B -0.3 6 V IN_, EN_ on Side B to GNDB 2
Abs max OUT_ Side A -0.3 0.3 V OUT_ on Side A to GNDA; max is (VDDA + 0.3V) 2
Abs max OUT_ Side B -0.3 0.3 V OUT_ on Side B to GNDB; max is (VDDB + 0.3V) 2
Operating Temperature Range -40 125 °C 2
Maximum Junction Temperature TJ 150 °C 2
Storage Temperature Range -60 150 °C 2
Soldering Temperature (reflow) 260 °C 2
Junction to Ambient Thermal Resistance θJA 71 °C/W 16 Wide SOIC, four-layer board 2
Junction to Case Thermal Resistance θJC 24 °C/W 16 Wide SOIC, four-layer board 2
Supply Current IDDA 500kHz IDDA 0.51 0.93 mA MAX14434_, 500kHz square wave, CL = 0pF, VDDA = 3.3V 3
Supply Current IDDA 12.5MHz IDDA 1.59 2.36 mA MAX14434_, 12.5MHz square wave, CL = 0pF, VDDA = 3.3V 3
Supply Current IDDA 50MHz IDDA 4.39 6 mA MAX14434_, 50MHz square wave, CL = 0pF, VDDA = 3.3V 3
Supply Current IDDA 50MHz 5V IDDA 4.5 6.14 mA MAX14434_, 50MHz square wave, CL = 0pF, VDDA = 5V 3
Supply Current IDDA 50MHz 1.8V IDDA 4.21 5.43 mA MAX14434_, 50MHz square wave, CL = 0pF, VDDA = 1.8V 3
Supply Current IDDB 500kHz IDDB 0.82 1.41 mA MAX14434_, 500kHz square wave, CL = 0pF, VDDB = 3.3V 3
Supply Current IDDB 12.5MHz IDDB 2 2.74 mA MAX14434_, 12.5MHz square wave, CL = 0pF, VDDB = 3.3V 3
Supply Current IDDB 50MHz IDDB 5.68 6.88 mA MAX14434_, 50MHz square wave, CL = 0pF, VDDB = 3.3V 3
Supply Current IDDB 50MHz 5V IDDB 9.52 11.17 mA MAX14434_, 50MHz square wave, CL = 0pF, VDDB = 5V 3
Supply Current IDDB 50MHz 1.8V IDDB 3.46 4.18 mA MAX14434_, 50MHz square wave, CL = 0pF, VDDB = 1.8V 3
Input High Voltage VIH 0.7 x VDD_ EN_, IN_, 2.25V ≤ VDD_ ≤ 5.5V 5
Input High Voltage VIH 0.75 x VDD_ EN_, IN_, 1.71V ≤ VDD_ < 2.25V 5
Input Low Voltage VIL 0.8 V EN_, IN_, 2.25V ≤ VDD_ ≤ 5.5V 5
Input Low Voltage VIL 0.7 V EN_, IN_, 1.71V ≤ VDD_ < 2.25V 5
Input Hysteresis VHYS 80 mV EN_, IN_, MAX1443_C/F/S/V 5
Input Pulldown Current IPD 1.5 5 10 µA IN_, MAX1443_E/F/U/V 5
EN Pullup Current IPU_EN -10 -5 -1.5 µA EN_ 5
Output Voltage High VOH -0.4 V below VDD_ IOUT_ = 4mA source; min is VDD_ - 0.4 5
Output Voltage Low VOL 0.4 V IOUT_ = 4mA sink 5
Maximum Data Rate DRMAX 200 Mbps 2.25V ≤ VDD_ ≤ 5.5V 6
Maximum Data Rate DRMAX 150 Mbps 1.71V ≤ VDD_ ≤ 1.89V 6
Minimum Pulse Width PWMIN 5 ns IN_ to OUT_, 2.25V ≤ VDD_ ≤ 5.5V 6
Minimum Pulse Width PWMIN 6.67 ns IN_ to OUT_, 1.71V ≤ VDD_ ≤ 1.89V 6
Propagation Delay tPLH 5V tPLH 4.1 5.4 9.2 ns IN_ to OUT_, CL = 15pF, 4.5V ≤ VDD_ ≤ 5.5V 6
Propagation Delay tPLH 3.3V tPLH 4.2 5.9 10.2 ns IN_ to OUT_, CL = 15pF, 3.0V ≤ VDD_ ≤ 3.6V 6
Propagation Delay tPLH 2.5V tPLH 4.9 7.1 13.4 ns IN_ to OUT_, CL = 15pF, 2.25V ≤ VDD_ ≤ 2.75V 6
Propagation Delay tPLH 1.8V tPLH 7.1 10.9 20.3 ns IN_ to OUT_, CL = 15pF, 1.71V ≤ VDD_ ≤ 1.89V 6
Propagation Delay tPHL 5V tPHL 4.3 5.6 9.4 ns IN_ to OUT_, CL = 15pF, 4.5V ≤ VDD_ ≤ 5.5V 6
Propagation Delay tPHL 3.3V tPHL 4.4 6.2 10.5 ns IN_ to OUT_, CL = 15pF, 3.0V ≤ VDD_ ≤ 3.6V 6
Propagation Delay tPHL 2.5V tPHL 5.1 7.3 14.1 ns IN_ to OUT_, CL = 15pF, 2.25V ≤ VDD_ ≤ 2.75V 6
Propagation Delay tPHL 1.8V tPHL 7.2 10.9 21.7 ns IN_ to OUT_, CL = 15pF, 1.71V ≤ VDD_ ≤ 1.89V 6
Pulse Width Distortion PWD 0.3 2 ns /tPLH - tPHL/ 6
Channel-to-Channel Skew (Same Direction) LH tSCSLH 1.5 ns 1.71V ≤ VDD_ ≤ 5.5V 6
Channel-to-Channel Skew (Same Direction) HL tSCSHL 1.5 ns 1.71V ≤ VDD_ ≤ 5.5V 6
Part-to-Part Skew tSPLH 3.3V tSPLH 4.3 ns 3.0V ≤ VDD_ ≤ 3.6V 6
Part-to-Part Skew tSPHL 3.3V tSPHL 4.7 ns 3.0V ≤ VDD_ ≤ 3.6V 6
ESD Human Body Model, All Pins 4 kV printed as ±4 kV 9
Maximum Withstand Isolation Voltage VISO 5000 VRMS fSW = 60Hz, duration = 60s 11
Maximum Surge Isolation Voltage VIOSM 10 kV Basic Insulation, 1.2/50µs pulse per IEC 61000-4-5 11
Common-Mode Transient Immunity CMTI 50 kV/µs IN_ = GND_ or VDD_ 6
Input Capacitance CIN 2 pF IN_, fSW = 1MHz 5

CAD (KiCad official)

  • Symbol: MAX14434FAWE+
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: max14434fawe-etched.step / max14434fawe-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max14434fawe.step / max14434fawe.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices Inc./Maxim Integrated datasheet (28 pp, sha256 6cda92adf890ee1c, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF