M95010-WMN6P from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	S	input	Chip Select: driving S high deselects the device and puts Q in high impedance, and driving it low selects the device; after power-up a falling edge on S is required before any instruction.
2	Q	output	Serial Data Output shifts data out on the falling edge of C and is high impedance when the device is deselected or in the Hold condition.
3	W	input	Write Protect: when held low, writes to the memory are disabled while other operations remain enabled, and W must be driven high or low and must not be left floating.
4	VSS	power_in	Ground: the reference for the VCC supply voltage.
5	D	input	Serial Data Input receives instructions, addresses and data to be written, latched on the rising edge of the Serial Clock C.
6	C	input	Serial Clock provides the serial interface timing: instructions, addresses and data on D are latched on its rising edge, and data on Q changes after its falling edge.
7	HOLD	input	Hold pauses serial communication without deselecting the device; during Hold, Q is high impedance and D and C are Don't Care, and the device must be selected with S low to enter Hold.
8	VCC	power_in	Supply voltage: 2.5 V to 5.5 V for the M950x0-W (M95010-W), which must remain stable and within VCC(min) to VCC(max) during all operations.

Key specifications

Parameter	Value
Manufacturer	STMicroelectronics
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Max	Unit	Conditions	Page
Supply voltage (operating, M950x0-W)	VCC	2.5	5.5	V		31
Ambient operating temperature (device grade 6)	TA	-40	85	°C		31
Ambient operating temperature	TAMR	-40	130	°C		30
Storage temperature	TSTG	-65	150	°C		30
Output voltage	VO	-0.5		V		30
Input voltage	VI	-0.5		V		30
DC output current (Q = 0)	IOL		5	mA	Q = 0	30
DC output current (Q = 1)	IIH		5	mA	Q = 1	30
Supply voltage (absolute maximum)	VCC	-0.5	6.5	V		30
Electrostatic pulse voltage (Human Body Model)	VESD		4000	V	Human Body Model	30
Input leakage current	ILI	-2	2	µA	VIN = VSS or VCC	33
Output leakage current	ILO	-2	2	µA	S = VCC, VOUT = VSS or VCC	33
Supply current (Read)	ICC		2	mA	VCC = 2.5 V, fC = 5 MHz, C = 0.1 VCC/0.9 VCC, Q = open	33
Supply current (Read)	ICC		5	mA	VCC = 5.5 V, fC = 20 MHz, C = 0.1 VCC/0.9 VCC, Q = open; only for process letter K devices	33
Supply current (Write)	ICC0		5	mA	During tW, S = VCC, 2.5 V < VCC < 5.5 V	33
Supply current (Standby)	ICC1		3	µA	S = VCC, VCC = 5.5 V, VIN = VSS or VCC	33
Supply current (Standby)	ICC1		2	µA	S = VCC, VCC = 2.5 V, VIN = VSS or VCC	33
Input low voltage	VIL	-0.45		V		33
Output low voltage	VOL		0.4	V	IOL = 1.5 mA, VCC = 2.5 V	33
Internal reset threshold voltage	VRES	1	1.65	V		33
Output capacitance (Q)	COUT		8	pF	VOUT = 0 V; sampled only, TA = 25 °C, 5 MHz	32
Input capacitance (D)	CIN		8	pF	VIN = 0 V; sampled only, TA = 25 °C, 5 MHz	32
Input capacitance (other pins)	CIN		6	pF	VIN = 0 V; sampled only, TA = 25 °C, 5 MHz	32
Write cycle endurance	Ncycle		4e+06		TA ≤ 25 °C, VCC(min) < VCC < VCC(max)	32
Write cycle endurance	Ncycle		1.2e+06		TA = 85 °C, VCC(min) < VCC < VCC(max)	32
Data retention		200		Year	TA = 55 °C	32
Clock frequency	fC		10	MHz	VCC = 2.5 to 5.5 V	35
S active setup time	tSLCH	30		ns	VCC = 2.5 to 5.5 V	35
S not active setup time	tSHCH	30		ns	VCC = 2.5 to 5.5 V	35
S deselect time	tSHSL	40		ns	VCC = 2.5 to 5.5 V	35
S active hold time	tCHSH	30		ns	VCC = 2.5 to 5.5 V	35
S not active hold time	tCHSL	30		ns	VCC = 2.5 to 5.5 V	35
Clock high time	tCH	40		ns	VCC = 2.5 to 5.5 V	35
Clock low time	tCL	40		ns	VCC = 2.5 to 5.5 V	35
Clock rise time	tCLCH		2	µs	VCC = 2.5 to 5.5 V	35
Clock fall time	tCHCL		2	µs	VCC = 2.5 to 5.5 V	35
Data in setup time	tDVCH	10		ns	VCC = 2.5 to 5.5 V	35
Data in hold time	tCHDX	10		ns	VCC = 2.5 to 5.5 V	35
Clock low hold time after HOLD not active	tHHCH	30		ns	VCC = 2.5 to 5.5 V	35
Clock low hold time after HOLD active	tHLCH	30		ns	VCC = 2.5 to 5.5 V	35
Clock low set-up time before HOLD active	tCLHL	0		ns	VCC = 2.5 to 5.5 V	35
Clock low set-up time before HOLD not active	tCLHH	0		ns	VCC = 2.5 to 5.5 V	35
Output disable time	tSHQZ		40	ns	VCC = 2.5 to 5.5 V	35
Clock low to output valid	tCLQV		40	ns	VCC = 2.5 to 5.5 V	35
Output hold time	tCLQX	0		ns	VCC = 2.5 to 5.5 V	35
Output rise time	tQLQH		40	ns	VCC = 2.5 to 5.5 V	35
Output fall time	tQHQL		40	ns	VCC = 2.5 to 5.5 V	35
HOLD high to output valid	tHHQV		40	ns	VCC = 2.5 to 5.5 V	35
HOLD low to output high-Z	tHLQZ		40	ns	VCC = 2.5 to 5.5 V	35
Write time	tW		5	ms	VCC = 2.5 to 5.5 V	35

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	TLEAD Lead temperature during soldering see note (1) 1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb assembly), the ST ECOPACK®	30

CAD (KiCad official)

Symbol: M95010-WMN6P
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: m95010-wmn6p-etched.step / m95010-wmn6p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); m95010-wmn6p.step / m95010-wmn6p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: STMicroelectronics datasheet (46 pp, sha256 1b7ee07d5879b564, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

M95010-WMN6P

Verified M95010-WMN6P

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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