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John Lauer Publish 0.1.0 6abb081 9d ago

Harwin M20-1180046 loose tin crimp contact

Off-board cable component with clearly labeled nominal geometry and harness documentation assets. Not a PCB solder footprint or qualified mating model.

Manufacturer product · Manufacturer drawing

Assets and use

The harness symbol is off-board (on_board=no). The mechanical envelope has zero copper pads and is excluded from PCB placement/BOM; it is not a solder footprint. The contact belongs inside a cable housing; it has no PCB footprint. STEP and GLB show original simplified geometry; inspect review/model-review.json for dimensions and omissions.

Tin-over-nickel brass loose contact, for 22–30 AWG. Manufacturer specifies insulation diameter 0.90–1.60 mm and strip length 3–4 mm. Recommended conductor crimp height is 0.69–0.75 mm for 26–30 AWG, or 0.83–0.89 mm for 22–24 AWG. Hand tool Z20-320 and its instructions are required for the reviewed process. Factory solder-dipped sensor ends are not automatically acceptable for crimping.

CAD is only a loose-contact illustration: socket, spine and open wings are approximate; spring tongue, retention latch and formed curves are omitted. Do not treat it as installed/crimped CAD or fit evidence.

Verification boundary

Native import, visual checks and physical harness qualification are tracked separately. Live wiki visual review remains pending because the task browser was closed. No factory connector is implied for the Sunon fan. No hardware, crimp or manufacturing release is claimed.

The copper-overlay hero generator rejects this legitimate zero-pad mechanical asset. The clean authored GLB is retained; no copper alignment pass is claimed. Tracked at component-hero issue1. An EDA device mapping from harness pins to nonexistent solder pads is deliberately not provided.