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LWS60110A4

Lewa Micro · MOSFETs · TO-252

LWS60110A4 from Lewa Micro, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-to-source voltage is rated ±20 V, with a typical gate threshold of -1.6 V (-1.1 V min, -2.1 V max) at ID=-250µA.
2 D passive Drain (also the exposed tab); drain-to-source voltage is rated -60 V, with continuous drain current of -12 A at TC=25℃ and pulsed drain current of -48 A.
3 S passive Source of the P-channel MOSFET, with the body diode running from drain to source; continuous diode forward current is -12 A.

Key specifications

Parameter Value
Manufacturer Lewa Micro
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS -60 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -12 A TC=25 °C 1
Continuous Drain Current ID -7.6 A TC=100 °C 1
Pulsed Drain Current IDM -48 A 1
Power Dissipation PD 30 W 1
Single pulse avalanche energy EAS 11 mJ VDD=-30V, L=0.1mH, RG=25Ω, Starting Tj=25℃ 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Maximum Temperature for Soldering TL 260 °C 1
Drain to Source Breakdown Voltage VDSS -60 V VGS=0V, ID=-250µA 2
Drain to Source Leakage Current IDSS -1 µA VDS=-60V, VGS=0V 2
Gate to Source Reverse Leakage IGSS(R) -100 nA VGS=-20V, VDS=0V 2
Gate Threshold Voltage VGS(TH) -1.1 -1.6 -2.1 V VDS=VGS, ID=-250µA 2
Diode Forward Voltage VSD -1.2 V IS=-5.0A, VGS=0V 2
Diode Forward Current IS -12 A TC =25 °C 2
Diode Pulse Current ISM -48 A 2
Thermal Resistance, Junction-to-Ambient RθJA 40 ℃/W Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection 1
Thermal Resistance, Junction-to-Case RθJC 4.2 ℃/W 1

CAD (KiCad official)

  • Symbol: LWS60110A4
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: lws60110a4-etched.step / lws60110a4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lws60110a4.step / lws60110a4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Lewa Micro datasheet (10 pp, sha256 217dd721e6cdf822, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF