# LTC6655BHMS8-2.5#TRPBF

**Analog Devices** · Voltage Reference · MSOP-8

LTC6655BHMS8-2.5#TRPBF from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHDN | input | Active-low shutdown input that powers the device down to <20µA; if left open an internal pull-up keeps the part in normal operation, and the datasheet recommends tying it high externally for best performance. |
| 2 | VIN | power_in | Power supply input; bypass VIN to GND with a 0.1µF or larger capacitor, and the absolute maximum VIN to GND is 13.2V. |
| 3 | GND | power_in | Internal function ground pin; ground this pin (datasheet lists GND pins 3, 5 and 8 as internal ground connections). |
| 4 | GND | power_in | Device main ground that must be connected to a noise-free ground plane; the datasheet says to star all GND connections at pin 4. |
| 5 | GND | power_in | Internal function ground pin; ground this pin. |
| 6 | VOUT_S | input | Output sense pin to be connected at the load with a wide trace; it sinks 2mA, output error is RTRACE × 2mA, and for load currents below 100µA it should be tied directly to VOUT_F. |
| 7 | VOUT_F | power_out | Force output pin that sources and sinks load current and requires an output capacitor of 2.7µF to 100µF. |
| 8 | GND | power_in | Internal function ground pin; ground this pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | MSOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Initial Accuracy (LTC6655B) | VOUT | -0.025 |  | 0.025 | % |  | 5 |
| Output Voltage Temperature Coefficient (LTC6655B) |  |  | 1 | 2 | ppm/°C | Full operating temperature range (l) | 5 |
| Load Regulation, sourcing (LTC6655MS8) |  |  | 3 | 15 | ppm/mA | ISOURCE = 5mA | 5 |
| Load Regulation, sinking (LTC6655MS8) |  |  | 10 | 30 | ppm/mA | ISINK = 5mA | 5 |
| Line Regulation |  |  | 5 | 25 | ppm/V | VOUT + 0.5V ≤ VIN ≤ 13.2V, SHDN = 2V | 5 |
| Operating Voltage (LTC6655-2.5) | VIN | 3 |  | 13.2 | V | ISOURCE = 5mA, VOUT Error ≤ 0.1% | 5 |
| Output Short-Circuit Current | ISC |  | 20 |  | mA | Short VOUT to GND | 5 |
| Shutdown Pin Logic High Input Voltage | VSHDN_IH | 2 |  |  | V |  | 5 |
| Shutdown Pin Logic High Input Current | ISHDN_IH |  |  | 12 | µA | SHDN = 2V | 5 |
| Shutdown Pin Logic Low Input Voltage | VSHDN_IL |  |  | 0.8 | V |  | 5 |
| Shutdown Pin Logic Low Input Current | ISHDN_IL |  |  | 15 | µA | SHDN = 0.8V | 5 |
| Supply Current | IS |  | 5 | 7 | mA | No load | 5 |
| Shutdown Current | ISD |  |  | 20 | µA | SHDN tied to GND | 5 |
| Output Voltage Noise, 0.1Hz to 10Hz (LTC6655) | en |  | 0.25 |  | ppmP-P | 0.1Hz ≤ f ≤ 10Hz | 6 |
| Output Voltage Noise, 10Hz to 1kHz (LTC6655) | en |  | 0.67 |  | ppmRMS | 10Hz ≤ f ≤ 1kHz | 6 |
| Turn-On Time | tON |  | 400 |  | µs | 0.1% Settling, COUT = 2.7µF | 6 |
| Long-Term Drift of Output Voltage (LTC6655MS8) |  |  | 60 |  | ppm/√kHr |  | 6 |
| Hysteresis (LTC6655MS8) |  |  | 20 |  | ppm | ΔT = 0°C to 70°C | 6 |
| Hysteresis (LTC6655MS8) |  |  | 30 |  | ppm | ΔT = -40°C to 85°C | 6 |
| Hysteresis (LTC6655MS8) |  |  | 60 |  | ppm | ΔT = -40°C to 125°C | 6 |
| Input Voltage VIN to GND | VIN | -0.3 |  | 13.2 | V |  | 2 |
| SHDN Voltage to GND | VSHDN | -0.3 |  |  | V | Maximum stated as VIN + 0.3V | 2 |
| VOUT_F Output Voltage | VOUT_F | -0.3 |  |  | V | Maximum stated as VIN + 0.3V | 2 |
| VOUT_S Output Voltage | VOUT_S | -0.3 |  | 6 | V |  | 2 |
| Operating Temperature Range | TOP | -40 |  | 125 | °C |  | 2 |
| Storage Temperature Range | TSTG | -65 |  | 150 | °C |  | 2 |
| Lead Temperature (Soldering, 10 sec) | TLEAD |  |  | 300 | °C | 10 sec | 2 |
| Maximum Junction Temperature | TJMAX |  |  | 150 | °C |  | 2 |
| Thermal Resistance, junction to ambient (MSOP-8) | θJA |  | 300 |  | °C/W | MS8 package | 2 |
| Output Capacitor (VOUT_F) | COUT | 2.7 |  | 100 | µF | Required output capacitor | 12 |
| Input Bypass Capacitor (VIN) | CIN | 0.1 |  |  | µF | Bypass VIN to GND | 12 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs |  | Plastic mould compounds absorb water. With changes in | 16 |

## CAD (KiCad official)

- Symbol: `LTC6655BHMS8-2.5#TRPBF`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `ltc6655bhms8-2-5-trpbf-etched.step` / `ltc6655bhms8-2-5-trpbf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ltc6655bhms8-2-5-trpbf.step` / `ltc6655bhms8-2-5-trpbf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Analog Devices datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588937143901569024) (30 pp, sha256 `7a9d4316d6f5e786`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ltc6655bhms8-2-5-trpbf-datasheet.pdf)