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LTC6655BHMS8-2.5#TRPBF

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Analog Devices Voltage Reference, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LTC6655BHMS8-2.5#TRPBF

Analog Devices · Voltage Reference · MSOP-8

LTC6655BHMS8-2.5#TRPBF from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHDN input Active-low shutdown input that powers the device down to <20µA; if left open an internal pull-up keeps the part in normal operation, and the datasheet recommends tying it high externally for best performance.
2 VIN power_in Power supply input; bypass VIN to GND with a 0.1µF or larger capacitor, and the absolute maximum VIN to GND is 13.2V.
3 GND power_in Internal function ground pin; ground this pin (datasheet lists GND pins 3, 5 and 8 as internal ground connections).
4 GND power_in Device main ground that must be connected to a noise-free ground plane; the datasheet says to star all GND connections at pin 4.
5 GND power_in Internal function ground pin; ground this pin.
6 VOUT_S input Output sense pin to be connected at the load with a wide trace; it sinks 2mA, output error is RTRACE × 2mA, and for load currents below 100µA it should be tied directly to VOUT_F.
7 VOUT_F power_out Force output pin that sources and sinks load current and requires an output capacitor of 2.7µF to 100µF.
8 GND power_in Internal function ground pin; ground this pin.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Initial Accuracy (LTC6655B) VOUT -0.025 0.025 % 5
Output Voltage Temperature Coefficient (LTC6655B) 1 2 ppm/°C Full operating temperature range (l) 5
Load Regulation, sourcing (LTC6655MS8) 3 15 ppm/mA ISOURCE = 5mA 5
Load Regulation, sinking (LTC6655MS8) 10 30 ppm/mA ISINK = 5mA 5
Line Regulation 5 25 ppm/V VOUT + 0.5V ≤ VIN ≤ 13.2V, SHDN = 2V 5
Operating Voltage (LTC6655-2.5) VIN 3 13.2 V ISOURCE = 5mA, VOUT Error ≤ 0.1% 5
Output Short-Circuit Current ISC 20 mA Short VOUT to GND 5
Shutdown Pin Logic High Input Voltage VSHDN_IH 2 V 5
Shutdown Pin Logic High Input Current ISHDN_IH 12 µA SHDN = 2V 5
Shutdown Pin Logic Low Input Voltage VSHDN_IL 0.8 V 5
Shutdown Pin Logic Low Input Current ISHDN_IL 15 µA SHDN = 0.8V 5
Supply Current IS 5 7 mA No load 5
Shutdown Current ISD 20 µA SHDN tied to GND 5
Output Voltage Noise, 0.1Hz to 10Hz (LTC6655) en 0.25 ppmP-P 0.1Hz ≤ f ≤ 10Hz 6
Output Voltage Noise, 10Hz to 1kHz (LTC6655) en 0.67 ppmRMS 10Hz ≤ f ≤ 1kHz 6
Turn-On Time tON 400 µs 0.1% Settling, COUT = 2.7µF 6
Long-Term Drift of Output Voltage (LTC6655MS8) 60 ppm/√kHr 6
Hysteresis (LTC6655MS8) 20 ppm ΔT = 0°C to 70°C 6
Hysteresis (LTC6655MS8) 30 ppm ΔT = -40°C to 85°C 6
Hysteresis (LTC6655MS8) 60 ppm ΔT = -40°C to 125°C 6
Input Voltage VIN to GND VIN -0.3 13.2 V 2
SHDN Voltage to GND VSHDN -0.3 V Maximum stated as VIN + 0.3V 2
VOUT_F Output Voltage VOUT_F -0.3 V Maximum stated as VIN + 0.3V 2
VOUT_S Output Voltage VOUT_S -0.3 6 V 2
Operating Temperature Range TOP -40 125 °C 2
Storage Temperature Range TSTG -65 150 °C 2
Lead Temperature (Soldering, 10 sec) TLEAD 300 °C 10 sec 2
Maximum Junction Temperature TJMAX 150 °C 2
Thermal Resistance, junction to ambient (MSOP-8) θJA 300 °C/W MS8 package 2
Output Capacitor (VOUT_F) COUT 2.7 100 µF Required output capacitor 12
Input Bypass Capacitor (VIN) CIN 0.1 µF Bypass VIN to GND 12

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing abs Plastic mould compounds absorb water. With changes in 16

CAD (KiCad official)

  • Symbol: LTC6655BHMS8-2.5#TRPBF
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: ltc6655bhms8-2-5-trpbf-etched.step / ltc6655bhms8-2-5-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ltc6655bhms8-2-5-trpbf.step / ltc6655bhms8-2-5-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (30 pp, sha256 7a9d4316d6f5e786, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF