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LTC3618IUF#TRPBF

Analog Devices · DC-DC Converters · QFN-24-EP(4x4)

LTC3618IUF#TRPBF from Analog Devices, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VFB1 input Voltage feedback input for VDDQ that receives the feedback voltage from the external resistive divider across the output.
2 ITH1 passive Error amplifier compensation connection for VDDQ, used for external compensation from ITH to SGND, and tying it to SVIN enables internal compensation.
3 MODE/SYNC input Mode select: tying to SVIN selects pulse-skipping mode and tying to SGND selects forced continuous mode for VDDQ (VTT is always forced continuous), and a clock applied here synchronizes the switching frequency and forces continuous mode for VDDQ.
4 PHASE input Phase shift selection between SW1 and SW2: tied to SGND gives 0°, tied to half of SVIN gives 90°, and tied to SVIN gives 180°.
5 VFB2 input Voltage feedback input for VTT, which regulates to VDDQIN × 0.5.
6 ITH2 passive Error amplifier compensation connection for VTT, analogous to ITH1, with the control voltage setting the current comparator threshold.
7 VDDQIN input External reference input to an internal resistor divider that sets the VTT output so that VFB2 regulates to VDDQIN × 0.5.
8 SGND power_in Signal ground for all small-signal and compensation components, to be connected to PGND at one point.
9 PVIN2 power_in VTT power supply input, which may connect to a supply equal to or lower than SVIN and is independent of PVIN1.
10 PVIN2 power_in VTT power supply input (second pin of PVIN2), which may connect to a supply equal to or lower than SVIN and is independent of PVIN1.
11 SW2 output VTT switch node that connects to the external inductor and the drains of the internal synchronous power MOSFET switches.
12 SW2 output VTT switch node (second pin of SW2) that connects to the external inductor and the drains of the internal synchronous power MOSFET switches.
13 RUN2 input Enable pin for VTT, which also enables or disables the VTTR buffer output.
14 RUN1 input Enable pin for VDDQ; forcing it above the input threshold enables SW1, and forcing both RUNx pins to ground shuts down the device, which then draws <1µA.
15 RT input Oscillator frequency setting: a resistor from RT to ground sets the switching frequency, and tying RT to SVIN enables the internal 2.25MHz oscillator.
16 PGOOD2 output Open-drain power good output for VTT.
17 VTTR output Voltage buffer output equal to VDDQIN × 0.5 with ±10mA output current capability; do not exceed 0.1µF capacitance on this pin.
18 PGOOD1 output Open-drain power good output for VDDQ that is pulled to ground when FB1 is outside the power good window, when RUN1 is disabled, or when an undervoltage is detected at SVIN.
19 SW1 output VDDQ switch node that connects to the external inductor and the drains of the internal synchronous power MOSFET switches.
20 SW1 output VDDQ switch node (second pin of SW1) that connects to the external inductor and the drains of the internal synchronous power MOSFET switches.
21 PVIN1 power_in VDDQ power supply input connected to the source of the internal P-channel power MOSFET, independent of PVIN2 and at equal or lower supply than SVIN.
22 PVIN1 power_in VDDQ power supply input (second pin of PVIN1) connected to the source of the internal P-channel power MOSFET, independent of PVIN2 and at equal or lower supply than SVIN.
23 SVIN power_in Signal input supply that powers the internal control circuitry and is monitored by the undervoltage lockout comparator, with a VIN operating range of 2.25V to 5.5V.
24 TRACK/SS1 input Internal/external soft-start and external reference input for VDDQ: tying to SVIN selects fixed internal soft-start, while a capacitor to ground and resistor to SVIN set external soft-start timing.
25 PGND power_in Power ground exposed pad, connected to the sources of the power N-channel MOSFETs, common to both channels, and required to be soldered to the PCB for electrical and rated thermal performance.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package QFN-24-EP(4x4)
Category Power Management (PMIC)
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Operating Voltage Range VIN 2.25 5.5 V l (full operating junction temperature range) 3
VFB1 VDDQ Feedback Voltage, internal reference with line and load regulation VFB1 0.592 0.6 0.608 V (Note 3) VTRACK/SS1 = SVIN, 0°C < TJ < 85°C 3
VFB1 VDDQ Feedback Voltage, internal reference with line and load regulation VFB1 0.59 0.6 0.61 V (Note 3) VTRACK/SS1 = SVIN, -40°C < TJ < 125°C, l 3
VFB1 Feedback Voltage, external reference VFB1 0.289 0.3 0.311 V (Note 3) VTRACK/SS1 = 0.3V 3
VFB1 Feedback Voltage, external reference VFB1 0.489 0.5 0.511 V (Note 3) VTRACK/SS1 = 0.5V 3
VFB2 VTT Feedback Reference Voltage with line and load regulation (VTTR -6 mV to VTTR +6 mV) VFB2 -6 6 mV VDDQIN = 1.5V, l 3
IFB Feedback Input Current IFB -30 0 30 nA VFBx = 0.6V, l 3
VTTR Maximum Output Current VTTR -10 10 mA 3
Input Supply Current, Shutdown IS 0.1 1 µA SVIN = PVIN = 5.5V, VRUNx = 0V 3
Switch Leakage Current ISW(LKG) 0.01 1 µA SVIN = PVIN = 5.5V, VRUNx = 0V 3
Peak Current Limit, Positive Limit (sourcing) ILIMX 4.2 5.5 8 A Sourcing (Note 7), VFBX = 0.5V 3
Peak Current Limit, Negative Limit (sinking) ILIMX -2.5 -3.5 -5.5 A Sinking (Note 7), VFBX = 0.7V 3
Error Amplifier Output Current IEAO -30 30 µA (Note 4) 3
VDDQ Internal Soft-Start Time tSOFT-START1 0.5 1.1 2 ms VFB1 from 0.06V to 0.54V, TRACK/SS1 = SVIN 3
VTT Internal Soft-Start Time tSOFT-START2 0.25 0.6 1 ms VFB2 from 0V to 0.75V 3
Oscillator Frequency fOSC 1.85 2.25 2.65 MHz RRT = 178k, l 3
Internal Default Oscillator Frequency fOSC 1.8 2.25 2.7 MHz VRT = SVIN, l 3
Synchronization Frequency fSYNC 0.4 4 MHz tLOW, tHIGH > 30ns 3
Power Good Blanking Time tPGOOD 65 105 140 µs Entering/Leaving window 4
Power Good Pull-Down On-Resistance RPGOOD 8 12 30 Ω I = 10mA 4
PVIN1, PVIN2 Voltages PVIN1, PVIN2 -0.3 6 V 2
SVIN Voltage SVIN -0.3 6 V 2
SW1 Voltage (max = PVIN1 + 0.3V) SW1 -0.3 V 2
SW2 Voltage (max = PVIN2 + 0.3V) SW2 -0.3 V 2
RUN1 Voltage (max = SVIN + 0.6V) RUN1 -0.3 V 2
All Other Pins Voltage -0.3 6 V 2
Operating Junction Temperature Range TJ -40 125 °C LTC3618I grade 2
Storage Temperature -65 150 °C 2
Maximum Junction Temperature TJMAX 125 °C UF (QFN) package 2
Thermal Resistance, junction to ambient (QFN) θJA 46.9 °C/W UF (QFN) package 2

CAD (KiCad official)

  • Symbol: LTC3618IUF#TRPBF
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: ltc3618iuf-trpbf-etched.step / ltc3618iuf-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ltc3618iuf-trpbf.step / ltc3618iuf-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (24 pp, sha256 3071a7b98ef8f409, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF