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README

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LT3757AIMSE#TRPBF

Analog Devices · DC-DC Converters · MSOP-10-EP

LT3757AIMSE#TRPBF from Analog Devices, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VC passive Error amplifier compensation pin used to stabilize the voltage loop with an external RC network.
2 FBX input Positive and negative feedback pin that receives the divider voltage from the output, regulating to 1.6V (positive) or -0.8V (negative), with an absolute maximum range of -6V to 6V.
3 SS passive Soft-start pin with a 10µA (typical) pull-up to an internal 2.5V rail, where the soft-start interval is set by an external capacitor and the pin is reset to GND by UVLO, INTVCC UV/OV or thermal lockout.
4 RT passive Switching frequency adjustment pin set by a resistor to GND, which must not be left open; RT voltage is 1.2V typical and the frequency range is 50kHz to 1MHz.
5 SYNC input Frequency synchronization input for an external clock, with the RT resistor chosen for a switching frequency 20% slower than the SYNC pulse frequency, and tied to GND when unused (SYNC input high 1.5V, low 0.4V, absolute maximum 8V).
6 SENSE input Current sense input for the control loop, Kelvin-connected to the positive terminal of the N-channel MOSFET source sense resistor, with a current limit threshold of 100mV to 120mV and an absolute maximum of ±0.3V.
7 GATE output N-channel MOSFET gate driver output that switches between INTVCC and GND and is driven to GND during shutdown, thermal lockout, or INTVCC overvoltage/undervoltage.
8 INTVCC power_out Regulated supply for internal loads and the gate driver, regulated to 7.2V typical and bypassed with a minimum of 4.7µF placed close to the pin, with an external supply limit of 17.5V.
9 SHDN/UVLO input Shutdown and undervoltage detect input with a 1.22V (nominal) falling threshold and externally programmable hysteresis, which must be tied to 0.4V or less to disable the device.
10 VIN power_in Input supply pin with an operating range of 2.9V to 40V, to be locally bypassed with a 0.22µF or larger capacitor placed close to the pin.
11 GND power_in Ground exposed pad that also serves as the negative terminal of the current sense resistor and must be soldered directly to the local ground plane.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-10-EP
Category Power Management ICs
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating temperature range (LT3757AI grade) -40 125 °C LT3757AIMSE operating temperature range 2
VIN Operating Range VIN 2.9 40 V 3
VIN Shutdown IQ IQ 0.1 1 µA SHDN/UVLO = 0V 3
VIN Shutdown IQ IQ 6 µA SHDN/UVLO = 1.15V 3
VIN Operating IQ IQ 1.6 2.2 mA VC = 0.3V, RT = 41.2k 3
VIN Operating IQ with Internal LDO Disabled IQ 280 400 µA VC = 0.3V, RT = 41.2k, INTVCC = 7.5V 3
SENSE Current Limit Threshold VSENSE(MAX) 100 110 120 mV Over full operating temperature range (l) 3
FBX Regulation Voltage (positive) VFBX(REG) 1.569 1.6 1.631 V VFBX > 0V (Note 3) 3
FBX Regulation Voltage (negative) VFBX(REG) -0.816 -0.8 -0.784 V VFBX < 0V (Note 3) 3
FBX Overvoltage Lockout (positive) VFBX(OVERVOLTAGE) 6 7 8 % VFBX > 0V (Note 4) 3
FBX Overvoltage Lockout (negative) VFBX(OVERVOLTAGE) 10 11 14 % VFBX < 0V (Note 4) 3
FBX Pin Input Current IFBX -10 10 nA VFBX = 1.6V (Note 3) 3
FBX Pin Input Current IFBX 70 100 nA VFBX = -0.8V (Note 3) 3
VFBX Line Regulation (positive) ∆VFBX/(∆VIN·VFBX(REG)) 0.002 0.0025 %/V VFBX > 0V, 2.9V < VIN < 40V (Notes 3, 7) 3
VFBX Line Regulation (negative) ∆VFBX/(∆VIN·VFBX(REG)) 0.05 0.056 %/V VFBX < 0V, 2.9V < VIN < 40V (Notes 3, 7) 3
Switching Frequency fSW 270 300 330 kHz RT = 41.2k to GND, VFBX = 1.6V 3
Switching Frequency fSW 50 kHz RT = 442k to GND, VFBX = 1.6V 3
Switching Frequency fSW 1000 kHz RT = 10.5k to GND, VFBX = 1.6V 3
SYNC Input Low VSYNC(L) 0.4 V 4
SYNC Input High VSYNC(H) 1.5 V 4
INTVCC Regulation Voltage VINTVCC 7 7.2 7.4 V Over full operating temperature range (l) 4
INTVCC Undervoltage Lockout Threshold (falling) VINTVCC(UVLO) 2.6 2.7 2.8 V Falling INTVCC 4
INTVCC Overvoltage Lockout Threshold VINTVCC(OVLO) 16 17.5 V 4
INTVCC Current Limit IINTVCC(LIM) 30 40 mA VIN = 40V 4
INTVCC Current Limit IINTVCC(LIM) 55 95 mA VIN = 15V 4
INTVCC Load Regulation ∆VINTVCC/VINTVCC -0.9 -0.5 % 0 < IINTVCC < 20mA, VIN = 8V 4
INTVCC Line Regulation ∆VINTVCC/(VINTVCC·∆VIN) 0.008 0.03 %/V 8V < VIN < 40V 4
Dropout Voltage (VIN, VINTVCC) VIN-VINTVCC 400 mV VIN = 6V, IINTVCC = 20mA 4
SHDN/UVLO Threshold Voltage (falling) VSHDN/UVLO 1.17 1.22 1.27 V VIN = INTVCC = 8V, falling (l) 4
SHDN/UVLO Input Low Voltage VSHDN/UVLO(L) 0.4 V I(VIN) drops below 1µA 4
SHDN/UVLO Pin Bias Current Low ISHDN/UVLO 1.7 2 2.5 µA SHDN/UVLO = 1.15V 4
SHDN/UVLO Pin Bias Current High ISHDN/UVLO 10 100 nA SHDN/UVLO = 1.30V 4
Gate Driver Output VOL VOL 0.05 V 4
VIN, SHDN/UVLO absolute maximum VIN, VSHDN/UVLO 40 V SHDN/UVLO per Note 6 2
INTVCC absolute maximum VINTVCC 20 V Also limited to VIN + 0.3V 2
SYNC absolute maximum VSYNC 8 V 2
VC, SS absolute maximum VC, VSS 3 V 2
RT absolute maximum VRT 1.5 V 2
SENSE absolute maximum VSENSE -0.3 0.3 V 2
FBX absolute maximum VFBX -6 6 V 2
Storage Temperature Range (MSOP) TSTG -65 150 °C MSOP package 2
Lead Temperature (Soldering, 10 sec) MSOP TLEAD 300 °C 10 sec soldering 2
Maximum Junction Temperature (MSE package) TJMAX 150 °C MSE (MSOP) package 2
Transconductance gm 230 µS ΔIVC/ΔVFBX (Note 3) 3
VC Output Impedance ZVC 5 MΩ (Note 3) 3
VC Current Mode Gain ∆VVC/∆VSENSE 5.5 V/V 3
VC Source Current IVC -15 µA VFBX = 0V, VC = 1.5V 3
VC Sink Current IVC 12 µA VFBX = 1.7V 3
VC Sink Current IVC 11 µA VFBX = -0.85V 3
RT Voltage VRT 1.2 V VFBX = 1.6V 3
Minimum Off-Time tOFF(MIN) 220 ns 3
Minimum On-Time tON(MIN) 220 ns 3
SS Pull-Up Current ISS -10 µA SS = 0V, current out of pin 4
INTVCC UVLO Hysteresis 0.1 V 4
INTVCC Current in Shutdown IINTVCC(SD) 16 µA SHDN/UVLO = 0V, INTVCC = 8V 4
INTVCC Voltage to Bypass Internal LDO 7.5 V 4
Gate Driver Output Rise Time tr 22 ns CL = 3300pF, INTVCC = 7.5V 4
Gate Driver Output Fall Time tf 20 ns CL = 3300pF, INTVCC = 7.5V 4
Thermal resistance junction-to-ambient (MSE package) θJA 40 °C/W MSE package, exposed pad soldered to full copper plane 2

CAD (KiCad official)

  • Symbol: LT3757AIMSE#TRPBF
  • Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
  • 3D model: MSOP-10-EP (KiCad packages3D, STEP)
  • 3D model files: lt3757aimse-trpbf-etched.step / lt3757aimse-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3757aimse-trpbf.step / lt3757aimse-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (38 pp, sha256 a50e40555a5ca7a0, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF