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LT3061EMS8E#TRPBF

Analog Devices · Linear Voltage Regulators (LDO) · MSOP-8-EP

LT3061EMS8E#TRPBF from Analog Devices, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 REF/BYP passive A single capacitor from this pin to GND bypasses reference noise and soft-starts the reference (10nF gives 30µVRMS over 10Hz to 100kHz), the pin is actively pulled low in shutdown, must be left floating if unused, must not be driven by active circuitry, and its voltage is limited to -0.3V to 1V.
2 ADJ input This is the inverting input of the error amplifier, which regulates ADJ to 600mV referenced to GND, with a typical bias current of 15nA flowing out of the pin.
3 OUT power_out This output pin supplies load power, requires a minimum 3.3µF low-ESR ceramic output capacitor to prevent oscillation, and has an output voltage range of 600mV to 19V.
4 OUT power_out This output pin supplies load power, requires a minimum 3.3µF low-ESR ceramic output capacitor to prevent oscillation, and has an output voltage range of 600mV to 19V.
5 IN power_in This input pin supplies power to the device over a 1.6V to 45V supply range, and a 1µF to 10µF bypass capacitor is required if the device is more than six inches from the input filter capacitor.
6 IN power_in This input pin supplies power to the device over a 1.6V to 45V supply range, and a 1µF to 10µF bypass capacitor is required if the device is more than six inches from the input filter capacitor.
7 SHDN input Pulling this pin low puts the device into a low-power state and turns the output off, SHDN pin current is typically under 3µA, it must be tied to IN if unused, and it cannot be driven below GND unless tied to IN.
8 GND power_in Ground pin, where the bottom of the output-setting resistor divider should connect directly for optimum regulation, and which must be tied to exposed pad pin 9 and the PCB ground.
9 GND power_in Exposed pad, which must be tied directly to pin 8 and to the PCB ground and must be soldered to the PCB for enhanced thermal performance.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ADJ Pin Voltage VADJ 594 600 606 mV VIN = 2.1V, ILOAD = 1mA 3
ADJ Pin Voltage VADJ 588 600 612 mV 2.1V < VIN < 45V, 1mA < ILOAD < 100mA (E-, I-Grades); full operating temperature range 3
Current Limit ILIM 110 180 mA VIN = VOUT(NOMINAL) + 1V (Note 11), ΔVOUT = -5% 4
Dropout Voltage VDO 250 290 mV ILOAD = 100mA 3
Dropout Voltage VDO 430 mV ILOAD = 100mA; full operating temperature range 3
Dropout Voltage VDO 195 240 mV ILOAD = 50mA 3
Dropout Voltage VDO 350 mV ILOAD = 50mA; full operating temperature range 3
Dropout Voltage VDO 130 180 mV ILOAD = 10mA 3
Dropout Voltage VDO 270 mV ILOAD = 10mA; full operating temperature range 3
Dropout Voltage VDO 65 110 mV ILOAD = 1mA 3
Dropout Voltage VDO 180 mV ILOAD = 1mA; full operating temperature range 3
Ripple Rejection PSRR 70 85 dB VIN, VOUT = 1.5V (AVG), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 200mA (LT3061, Note 4) 4
Minimum Input Voltage VIN(MIN) 1.6 2.1 V ILOAD = 100mA 3
Line Regulation 0.5 4 mV ILOAD = 1mA; LT3061: ΔVIN = 2.1V to 45V (E-, I-Grades) 3
Load Regulation 0.2 4 mV ΔILOAD = 1mA to 100mA; LT3061: VIN = 2.1V (E-, I-Grades) 3
GND Pin Current IGND 45 90 µA VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 0 3
GND Pin Current IGND 70 120 µA VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 1mA 3
GND Pin Current IGND 225 500 µA VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 10mA 3
GND Pin Current IGND 0.8 1.8 mA VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 50mA 3
GND Pin Current IGND 2 4 mA VIN = VOUT(NOMINAL) + 0.6V, ILOAD = 100mA 3
Quiescent Current in Shutdown IQ(SHDN) 1.25 3 µA VIN = 45V, VSHDN = 0V 4
Input Reverse Leakage Current 1 mA VIN = -45V, VOUT = 0 4
Output Discharge Time 0.75 2 ms VOUT discharged to 10% of Nominal, COUT = 10µF 4
Reverse Output Current 2.5 15 µA VOUT = 3.3V, VIN = VSHDN = 2.1V (Note 4) 4
Shutdown Threshold (Off to On) VSHDN 0.3 0.8 V VOUT = Off to On 4
Shutdown Threshold (On to Off) VSHDN 0.7 1.5 V VOUT = On to Off 4
SHDN Pin Current ISHDN 1.2 µA VSHDN = 0V 4
SHDN Pin Current ISHDN 3 µA VSHDN = 45V 4
ADJ Pin Bias Current IADJ 15 60 nA 4
Output Voltage Noise VN 30 µVRMS COUT = 10µF, ILOAD = 100mA, CREF/BYP = 0.01µF, VOUT = 600mV, BW = 10Hz to 100kHz 4
IN Pin Voltage VIN -50 50 V 2
OUT Pin Voltage VOUT -1 20 V 2
Input to Output Differential Voltage VIN-VOUT -50 50 V Note 2 2
ADJ Pin Voltage VADJ -50 50 V 2
SHDN Pin Voltage VSHDN -50 50 V 2
REF/BYP Pin Voltage VREF/BYP -0.3 1 V 2
Operating Junction Temperature TJ -40 125 °C E- and I-Grades (Notes 3, 5, 12) 2
Storage Temperature Range TSTG -65 150 °C 2
Junction-to-Ambient Thermal Resistance θJA 29 45 °C/W MS8E (MSOP) package; range depends on board copper area (Table 3) 2
Junction-to-Case Thermal Resistance θJC 5 10 °C/W MS8E (MSOP) package 2

CAD (KiCad official)

  • Symbol: LT3061EMS8E#TRPBF
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: lt3061ems8e-trpbf-etched.step / lt3061ems8e-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3061ems8e-trpbf.step / lt3061ems8e-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (22 pp, sha256 a0c80e42c07d86ae, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF