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LT3027EMSE#PBF
Public Made by Adomby adom
Analog Devices Pre-ordered Chips, MSOP-10-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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LT3027EMSE#PBF
Analog Devices · Pre-ordered Chips · MSOP-10-EP
LT3027EMSE#PBF from Analog Devices, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BYP2 | passive | Channel 2 reference bypass pin, clamped internally to ±0.6V from ground, with a maximum 0.01µF capacitor recommended for 20µVRMS noise, and must be left unconnected if not used. |
| 2 | ADJ2 | input | Channel 2 error amplifier input, internally clamped to ±7V, with a 30nA bias current flowing into the pin and regulating to 1.22V referenced to ground for an output range of 1.22V to 20V. |
| 3 | SHDN2 | input | Channel 2 shutdown control, where the output turns off when pulled low, must be connected to VIN if unused, and draws a typical pin current of 1µA. |
| 4 | ADJ1 | input | Channel 1 error amplifier input, internally clamped to ±7V, with a 30nA bias current flowing into the pin and regulating to 1.22V referenced to ground for an output range of 1.22V to 20V. |
| 5 | BYP1 | passive | Channel 1 reference bypass pin, clamped internally to ±0.6V from ground, with a maximum 0.01µF capacitor recommended for 20µVRMS noise, and must be left unconnected if not used. |
| 6 | OUT1 | power_out | Channel 1 regulated output, which requires a minimum 1µF output capacitor to prevent oscillations. |
| 7 | SHDN1 | input | Channel 1 shutdown control, where the output turns off when pulled low, must be connected to VIN if unused, and draws a typical pin current of 1µA. |
| 8 | IN1 | power_in | Channel 1 input supply operating from 1.8V to 20V, which withstands reverse voltages of 20V and benefits from a 1µF to 10µF bypass capacitor when far from the input filter. |
| 9 | IN2 | power_in | Channel 2 input supply operating from 1.8V to 20V, which withstands reverse voltages of 20V and benefits from a 1µF to 10µF bypass capacitor when far from the input filter. |
| 10 | OUT2 | power_out | Channel 2 regulated output, which requires a minimum 1µF output capacitor to prevent oscillations. |
| 11 | GND | power_in | Exposed pad ground that must be soldered to the PCB and electrically connected to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | MSOP-10-EP |
| Category | Interface ICs |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN1, IN2 Pin Voltage | -20 | 20 | V | 2 | |||
| OUT1, OUT2 Pin Voltage | -20 | 20 | V | 2 | |||
| Input to Output Differential Voltage | -20 | 20 | V | 2 | |||
| ADJ1, ADJ2 Pin Voltage | -7 | 7 | V | 2 | |||
| BYP1, BYP2 Pin Voltage | -0.6 | 0.6 | V | 2 | |||
| SHDN1, SHDN2 Pin Voltage | -20 | 20 | V | 2 | |||
| Lead Temperature (Soldering, 10 sec) | 300 | °C | Soldering, 10 sec | 2 | |||
| Storage Temperature Range, MSE Package | -65 | 150 | °C | MSE Package | 2 | ||
| Operating Junction Temperature Range | -40 | 125 | °C | Note 2 | 2 | ||
| Minimum Input Voltage | 1.8 | 2.3 | V | ILOAD = 100mA (Notes 3, 10) | 2 | ||
| ADJ1, ADJ2 Pin Voltage | 1.205 | 1.22 | 1.235 | V | VIN = 2V, ILOAD = 1mA (Note 3, 4) | 2 | |
| ADJ1, ADJ2 Pin Voltage | 1.19 | 1.22 | 1.25 | V | 2.3V < VIN < 20V, 1mA < ILOAD < 100mA | 2 | |
| Line Regulation | 1 | 10 | mV | ∆VIN = 2V to 20V, ILOAD = 1mA (Note 3) | 2 | ||
| Load Regulation | 1 | 12 | mV | VIN = 2.3V, ∆ILOAD = 1mA to 100mA (Note 3) | 2 | ||
| Load Regulation | 25 | mV | VIN = 2.3V, ∆ILOAD = 1mA to 100mA | 2 | |||
| Dropout Voltage | 0.1 | 0.15 | V | ILOAD = 1mA | 2 | ||
| Dropout Voltage | 0.19 | V | VIN = VOUT(NOMINAL), ILOAD = 1mA (Notes 5, 6, 10) | 2 | |||
| Dropout Voltage | 0.17 | 0.22 | V | ILOAD = 10mA | 2 | ||
| Dropout Voltage | 0.29 | V | ILOAD = 10mA | 2 | |||
| Dropout Voltage | 0.24 | 0.28 | V | ILOAD = 50mA | 2 | ||
| Dropout Voltage | 0.38 | V | ILOAD = 50mA | 2 | |||
| Dropout Voltage | 0.3 | 0.35 | V | ILOAD = 100mA | 2 | ||
| Dropout Voltage | 0.45 | V | ILOAD = 100mA | 2 | |||
| GND Pin Current (Per Channel) | 25 | 50 | µA | ILOAD = 0mA (Notes 5, 7) | 3 | ||
| GND Pin Current (Per Channel) | 60 | 120 | µA | VIN = VOUT(NOMINAL), ILOAD = 1mA (Notes 5, 7) | 3 | ||
| GND Pin Current (Per Channel) | 250 | 400 | µA | ILOAD = 10mA (Notes 5, 7) | 3 | ||
| GND Pin Current (Per Channel) | 1 | 2 | mA | ILOAD = 50mA (Notes 5, 7) | 3 | ||
| GND Pin Current (Per Channel) | 2.4 | 4 | mA | ILOAD = 100mA (Notes 5, 7) | 3 | ||
| ADJ1/ADJ2 Pin Bias Current | 30 | 100 | nA | Notes 3, 8 | 3 | ||
| Shutdown Threshold | 0.8 | 1.4 | V | VOUT = Off to On | 3 | ||
| Shutdown Threshold | 0.25 | 0.65 | V | VOUT = On to Off | 3 | ||
| SHDN1/SHDN2 Pin Current | 0 | 0.5 | µA | VSHDN = 0V (Note 9) | 3 | ||
| SHDN1/SHDN2 Pin Current | 13 | µA | VSHDN = 20V | 3 | |||
| Quiescent Current in Shutdown | 0.01 | 0.1 | µA | VIN = 6V, VSHDN = 0V (Both SHDN Pins) | 3 | ||
| Ripple Rejection | 55 | 65 | dB | VIN = 2.72V (Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 100mA (Note 3) | 3 | ||
| Current Limit | 200 | mA | VIN = 7V, VOUT = 0V | 3 | |||
| Current Limit | 110 | mA | VIN = 2.3V, ∆VOUT = -5% | 3 | |||
| Input Reverse Leakage Current | 1 | mA | VIN = -20V, VOUT = 0V | 3 | |||
| Output Voltage Noise | 20 | µVRMS | COUT = 10µF, CBYP = 0.01µF, ILOAD = 100mA, BW = 10Hz to 100kHz | 3 | |||
| Junction-to-Ambient Thermal Resistance (MSE) | θJA | 40 | °C/W | Topside 2500mm2, backside 2500mm2, board area 2500mm2 | 11 | ||
| Junction-to-Ambient Thermal Resistance (MSE) | θJA | 45 | °C/W | Topside 1000mm2, backside 2500mm2, board area 2500mm2 | 11 | ||
| Junction-to-Ambient Thermal Resistance (MSE) | θJA | 50 | °C/W | Topside 225mm2, backside 2500mm2, board area 2500mm2 | 11 | ||
| Junction-to-Ambient Thermal Resistance (MSE) | θJA | 62 | °C/W | Topside 100mm2, backside 2500mm2, board area 2500mm2 | 11 | ||
| Junction-to-Case Thermal Resistance (MSE) | θJC | 10 | °C/W | Measured at Exposed Pad, 10-lead MS package | 11 | ||
| Maximum Junction Temperature (MSE) | TJMAX | 150 | °C | MSE package, ordering-line rating | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | COPPER | Table 1. MSE Package, 10-Lead MSOP COPPER AREA THERMAL RESISTANCE | 11 |
CAD (KiCad official)
- Symbol:
LT3027EMSE#PBF - Footprint:
Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm - 3D model: MSOP-10-EP (KiCad packages3D, STEP)
- 3D model files:
lt3027emse-pbf-etched.step/lt3027emse-pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lt3027emse-pbf.step/lt3027emse-pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (16 pp, sha256
0a3b3d970fde50f1, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).