component
LT3013EFE#PBF
Public Made by Adomby adom
Analog Devices Pre-ordered Chips, TSSOP-16-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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LT3013EFE#PBF
Analog Devices · Pre-ordered Chips · TSSOP-16-EP
LT3013EFE#PBF from Analog Devices, in a TSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin; the exposed pad is the electrical GND connection and must be soldered directly to the PC board. |
| 2 | NC | unconnected | No internal connection; connecting to a copper area can slightly improve thermal performance. |
| 3 | OUT | power_out | Regulator output supplying the load; a minimum 3.3μF output capacitor is required to prevent oscillations. |
| 4 | OUT | power_out | Regulator output supplying the load; a minimum 3.3μF output capacitor is required to prevent oscillations. |
| 5 | ADJ | input | Error amplifier input held at 1.24V referenced to ground, internally clamped to ±7V, with a 30nA bias current flowing into the pin; output range is 1.24V to 60V. |
| 6 | GND | power_in | Ground pin, connected to the exposed pad on the PC board. |
| 7 | PWRGD | output | Open-collector power-good flag with no internal pull-up, going high-impedance when output is above 90% of nominal and the CT capacitor has charged; maximum pull-down current in the low state is 50μA and the pin voltage rating is 80V to -0.5V. |
| 8 | GND | power_in | Ground pin. |
| 9 | GND | power_in | Ground pin. |
| 10 | CT | passive | Timing capacitor pin that sets the delay between the output reaching the PWRGD threshold and PWRGD going high-impedance; charging current is 3μA and the pin voltage rating is 7V to -0.5V. |
| 11 | SHDN | input | Shutdown input that turns the output off when pulled low; if unused it must be tied to a logic high or VIN, with an input voltage rating of ±80V. |
| 12 | NC | unconnected | No internal connection; connecting to a copper area can slightly improve thermal performance. |
| 13 | IN | power_in | Input supply pin with a 4V minimum input voltage; a 1μF to 10μF bypass capacitor is recommended when the device is far from the input filter capacitor, and the pin is rated ±80V. |
| 14 | IN | power_in | Input supply pin with a 4V minimum input voltage; a 1μF to 10μF bypass capacitor is recommended when the device is far from the input filter capacitor, and the pin is rated ±80V. |
| 15 | NC | unconnected | No internal connection; connecting to a copper area can slightly improve thermal performance. |
| 16 | GND | power_in | Ground pin. |
| 17 | GND | power_in | Exposed backside pad, an electrical connection for GND that must be soldered to the PC board for thermal and electrical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | TSSOP-16-EP |
| Category | Interface ICs |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum Input Voltage (ILOAD = 250mA) | 4 | 4.75 | V | ILOAD = 250mA | 3 | ||
| ADJ Pin Voltage | VADJ | 1.225 | 1.24 | 1.255 | V | VIN = 4V, ILOAD = 1mA | 3 |
| ADJ Pin Voltage | VADJ | 1.2 | 1.24 | 1.28 | V | 4.75V < VIN < 80V, 1mA < ILOAD < 250mA (over full operating temperature range) | 3 |
| Line Regulation | 0.1 | 5 | mV | ΔVIN = 4V to 80V, ILOAD = 1mA | 3 | ||
| Load Regulation | 7 | 12 | mV | VIN = 4.75V, ΔILOAD = 1mA to 250mA | 3 | ||
| Load Regulation | 25 | mV | VIN = 4.75V, ΔILOAD = 1mA to 250mA (over full operating temperature range) | 3 | |||
| Dropout Voltage | 160 | 230 | mV | VIN = VOUT(NOMINAL), ILOAD = 10mA | 3 | ||
| Dropout Voltage | 300 | mV | VIN = VOUT(NOMINAL), ILOAD = 10mA (over full operating temperature range) | 3 | |||
| Dropout Voltage | 250 | 340 | mV | VIN = VOUT(NOMINAL), ILOAD = 50mA | 3 | ||
| Dropout Voltage | 420 | mV | VIN = VOUT(NOMINAL), ILOAD = 50mA (over full operating temperature range) | 3 | |||
| Dropout Voltage | 400 | 490 | mV | VIN = VOUT(NOMINAL), ILOAD = 250mA | 3 | ||
| Dropout Voltage | 620 | mV | VIN = VOUT(NOMINAL), ILOAD = 250mA (over full operating temperature range) | 3 | |||
| GND Pin Current | 65 | 120 | μA | VIN = 4.75V, ILOAD = 0mA | 3 | ||
| GND Pin Current | 3 | mA | VIN = 4.75V, ILOAD = 100mA | 3 | |||
| GND Pin Current | 10 | 18 | mA | VIN = 4.75V, ILOAD = 250mA | 3 | ||
| ADJ Pin Bias Current | IADJ | 30 | 100 | nA | 3 | ||
| Shutdown Threshold (VOUT Off to On) | 1.3 | 2 | V | VOUT = Off to On | 3 | ||
| Shutdown Threshold (VOUT On to Off) | 0.3 | 0.8 | V | VOUT = On to Off | 3 | ||
| SHDN Pin Current | 0.3 | 2 | μA | VSHDN = 0V | 3 | ||
| SHDN Pin Current | 0.1 | 1 | μA | VSHDN = 6V | 3 | ||
| Quiescent Current in Shutdown | 1 | 5 | μA | VIN = 6V, VSHDN = 0V | 3 | ||
| PWRGD Trip Point | 85 | 90 | 94 | % | % of nominal output voltage, output rising (over full operating temperature range) | 3 | |
| PWRGD Output Low Voltage | 140 | 250 | mV | IPWRGD = 50μA (over full operating temperature range) | 3 | ||
| Ripple Rejection | 65 | 75 | dB | VIN = 7V(Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 250mA | 3 | ||
| Current Limit | 250 | mA | VIN = 4.75V, ΔVOUT = -0.1V (over full operating temperature range) | 3 | |||
| Reverse Output Current | 12 | 25 | μA | VOUT = 1.24V, VIN < 1.24V | 3 | ||
| IN Pin Voltage | -80 | 80 | V | 2 | |||
| OUT Pin Voltage | -60 | 60 | V | 2 | |||
| IN to OUT Differential Voltage | -80 | 80 | V | 2 | |||
| ADJ Pin Voltage | -7 | 7 | V | 2 | |||
| SHDN Pin Input Voltage | -80 | 80 | V | 2 | |||
| CT Pin Voltage | -0.5 | 7 | V | 2 | |||
| PWRGD Pin Voltage | -0.5 | 80 | V | 2 | |||
| Storage Temperature Range (TSSOP Package) | -65 | 150 | °C | TSSOP package | 2 | ||
| Lead Temperature | 300 | °C | FE16 soldering, 10 sec | 2 | |||
| Operating Junction Temperature Range (LT3013E) | TJ | -40 | 125 | °C | LT3013E (Notes 3, 10, 11) | 2 | |
| Thermal Resistance, Junction-to-Ambient (TSSOP measured) | θJA | 40 | °C/W | 2500 sq mm copper area, 2500 sq mm topside board area, still air, 3/32 in FR-4 | 15 | ||
| Thermal Resistance, Junction-to-Ambient (TSSOP measured) | θJA | 45 | °C/W | 1000 sq mm copper area, 2500 sq mm topside board area, still air | 15 | ||
| Thermal Resistance, Junction-to-Ambient (TSSOP measured) | θJA | 50 | °C/W | 225 sq mm copper area, 2500 sq mm topside board area, still air | 15 | ||
| Thermal Resistance, Junction-to-Ambient (TSSOP measured) | θJA | 62 | °C/W | 100 sq mm copper area, 2500 sq mm topside board area, still air | 15 | ||
| Thermal Resistance, Junction-to-Case (exposed pad) | θJC | 16 | °C/W | measured at exposed pad on back of die | 15 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | pins have no internal connection; connecting NC pins to a copper area for heat dissipation provides a small | 11 |
CAD (KiCad official)
- Symbol:
LT3013EFE#PBF - Footprint:
Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm - 3D model: TSSOP-16-EP (KiCad packages3D, STEP)
- 3D model files:
lt3013efe-pbf-etched.step/lt3013efe-pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lt3013efe-pbf.step/lt3013efe-pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (20 pp, sha256
285ab2e67f086b18, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).