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Contents

README

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LSM6DSV16BXTR

STMicroelectronics · Accelerometers · LGA-14(2.5x3)

LSM6DSV16BXTR from STMicroelectronics, in a LGA-14(2.5x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDO/SA0 output SPI 4-wire serial data output (SDO) or I²C device address least significant bit selection (SA0).
2 TDMout output TDM audio data output in Mode 2; connect to GND or Vdd_IO when TDM interface is not used in Mode 1.
3 BCLK input TDM bit clock input in Mode 2; connect to GND or Vdd_IO when TDM interface is not used in Mode 1.
4 INT1 output Programmable interrupt output for sensor events; available in both I²C and SPI modes.
5 Vdd_IO power_in Power supply for I/O pins (1.08 to 3.6 V); recommend 100 nF filter capacitor.
6 AH1/QVAR1 input Analog hub input 1 or Qvar electrode 1 when enabled; connect to Vdd or GND if analog hub and Qvar are disabled.
7 GND power_in Ground supply (0 V).
8 Vdd power_in Core power supply (1.71 to 3.6 V); recommend 100 nF filter capacitor.
9 AH2/QVAR2 input Analog hub input 2 or Qvar electrode 2 when enabled; connect to Vdd or GND if analog hub and Qvar are disabled.
10 INT2 output Programmable interrupt 2 output for sensor events; available in both I²C and SPI modes.
11 WCLK input TDM word clock input in Mode 2; connect to Vdd_IO or leave unconnected when TDM interface is not used in Mode 1.
12 CS input Communication mode selection: high enables SPI idle mode or I²C/MIPI I3C communication; low enables active SPI mode.
13 SCL bidirectional I²C/MIPI I3C serial clock (open-drain in I²C) or SPI serial port clock input.
14 SDA bidirectional I²C/MIPI I3C serial data (open-drain bidirectional), SPI serial data input (SDI) in 4-wire mode, or serial data output (SDO) in 3-wire mode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package LGA-14(2.5x3)
Category Sensors
Pins 14

CAD (KiCad official)

  • Symbol: LSM6DSV16BXTR
  • Footprint: Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm
  • 3D model: LGA-14(2.5x3) (KiCad packages3D, STEP)
  • 3D model files: lsm6dsv16bxtr-etched.step / lsm6dsv16bxtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lsm6dsv16bxtr.step / lsm6dsv16bxtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (149 pp, sha256 b68ff3a7d830e1a7, retrieved 2026-09-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF