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LRBN25GFER006

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by adom

NCT Current Sense Resistors/Shunt Resistors, 2512. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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LRBN25GFER006

NCT · Current Sense Resistors/Shunt Resistors · 2512

LRBN25GFER006 from NCT, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer NCT
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance tolerance (code G) R -2 2 % Tolerance code G = ±2% per spec table key 5
Temperature coefficient of resistance TCR -50 50 ppm/°C Resistance 1mΩ<R≤100mΩ 5
Operating temperature range T -55 170 °C 5
Maximum rated current (family max) 54.78 A LRBN25 row, resistance range 1mΩ~100mΩ 5
Maximum overload current (family max) 122.48 A LRBN25 row, resistance range 1mΩ~100mΩ 5
Short time overload resistance change ΔR/R -0.5 0.5 % 5 s at X5 rated power (3W), 24 h rest 10
Biased humidity resistance change ΔR/R -0.5 0.5 % 85°C, 85%RH, rated current, 90 min ON/30 min OFF, 1000 h 11
Temperature cycling resistance change ΔR/R -0.5 0.5 % -55°C to +125°C, 1000 cycles 11
Low temperature exposure resistance change ΔR/R -0.5 0.5 % -55°C, 1000 h 11
High temperature exposure resistance change ΔR/R -1 1 % 170°C, 1000 h 11
Load life resistance change ΔR/R -1 1 % 70°C, rated current, 90 min ON/30 min OFF, 1000 h 11
Resistance to solder heat resistance change ΔR/R -0.5 0.5 % 260±5°C solder bath, 10±1 s 11
Resistance to solvent resistance change ΔR/R -0.5 0.5 % Isopropanol 20~25°C, 60±5 s 11
Solderability electrode coverage 95 % 245±5°C, 3±1 s; new solder area on electrodes 11
Joint strength of solder resistance change ΔR/R -0.5 0.5 % Load applied to centre of bend test board 12
Insulation resistance IR 100 MΩ 100 VDC applied for 1 min, electrodes to protective layer and to substrate 12
Storage temperature T 5 35 °C Sealed storage, shelf life 2 years 14
Storage relative humidity RH 40 75 % Sealed storage, shelf life 2 years 14

CAD (KiCad official)

  • Symbol: LRBN25GFER006
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: lrbn25gfer006-etched.step / lrbn25gfer006-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lrbn25gfer006.step / lrbn25gfer006.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NCT datasheet (15 pp, sha256 1c7bbc6a4c0f07fe, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF