component
LP54334SPF
Public Made by Adomby adom
LOWPOWER DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| lp54334spf-etched.glb | 17d ago |
| lp54334spf-etched.step | 17d ago |
| lp54334spf-hero.glb | 17d ago |
| lp54334spf-hero.overlay.json | 17d ago |
| lp54334spf.glb | 17d ago |
| lp54334spf.kicad_mod | 17d ago |
| lp54334spf.kicad_sym | 17d ago |
| lp54334spf.lbr | 17d ago |
| lp54334spf.step | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
LP54334SPF
LOWPOWER · DC-DC Converters · ESOP-8
LP54334SPF from LOWPOWER, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | power_out | Bootstrap pin that powers the high-side MOSFET gate driver, and a 0.1-µF capacitor must be connected between this pin and SW. |
| 2 | VIN | power_in | IC power supply input, with a recommended operating range of 4.5V to 32V and an absolute maximum of -0.3V to 34V to GND. |
| 3 | SW | output | Switching node of the converter, rated -0.3V to 34V to GND with a -3V to 34V limit for 5ns transients. |
| 4 | GND | power_in | Power ground of the IC, to which the thermal pad should be connected for good power dissipation. |
| 5 | FB | input | Feedback pin that sets the output voltage through a resistor divider, with a typical regulated FB voltage of 0.8V and an absolute maximum of -0.3V to 6.5V to GND. |
| 6 | NC | unconnected | No connection inside the device. |
| 7 | EN | input | Enable input that can also control power-up sequencing, with a logic-high threshold of 1.2V typical, a 1000kΩ internal pull-down, and an absolute maximum of -0.3V to 34V to GND. |
| 8 | NC | unconnected | No connection inside the device. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LOWPOWER |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage | VIN | 4.5 | 32 | V | 4 | ||
| Output voltage | VOUT | 13.2 | V | 4 | |||
| Inductor | L | 0.7 | 13 | μH | 4 | ||
| Ambient temperature range | TA | -40 | 85 | °C | 4 | ||
| Input decoupling capacitor | CIN | 4.7 | 100 | μF | 25V rating or higher | 4 | |
| Output capacitor | COUT | 10 | 100 | μF | 10V rating or higher | 4 | |
| VIN, SW to GND | -0.3 | 34 | V | 4 | |||
| SW to GND | -3 | 34 | V | 5ns transient | 4 | ||
| EN to GND | -0.3 | 34 | V | 4 | |||
| FB to GND | -0.3 | 6.5 | V | 4 | |||
| BST to SW | -0.3 | 5.5 | V | 4 | |||
| BST to GND | -0.3 | 34 | V | EN=Low | 4 | ||
| BST to GND | -0.3 | 38 | V | EN=High | 4 | ||
| Junction Temperature Range | TJ | -40 | 150 | °C | 4 | ||
| Maximum Soldering Temperature | 260 | °C | at leads, 10 sec | 4 | |||
| ESD HBM (Human Body Model) | 2 | kV | HBM | 4 | |||
| ESD CDM (Charged-device Model) | 500 | V | CDM | 4 | |||
| Junction-to-Ambient Thermal Resistance | θJA | 63 | °C/W | 4 | |||
| Input under voltage lockout threshold (VIN rising) | VULVO_R | 4.2 | 4.5 | V | VIN rising threshold; VIN=12V, TA=25°C | 5 | |
| UVLO hysteresis | VULVO_H | 0.2 | V | VIN falling threshold | 5 | ||
| Input quiescent current | Iq_VIN | 300 | µA | No switching, EN=3V, FB=1.0V | 5 | ||
| Shutdown current | ISD | 4.5 | µA | EN=0V, VIN = 12V | 5 | ||
| Low-side valley current limit | ILIM | 2.6 | 3.6 | A | TA=25oC | 5 | |
| Reference voltage | Vref | 0.792 | 0.8 | 0.808 | V | TA=25oC | 5 |
| High-side FET on resistance | Rdson_HS | 130 | mΩ | VIN=12V | 5 | ||
| Low-side FET on resistance | Rdson_LS | 85 | mΩ | VIN=12V | 5 | ||
| Switching frequency | Fsw | 500 | kHz | 5 | |||
| Minimum on-time | ton-min | 50 | ns | Not production tested, guaranteed by design | 5 | ||
| Minimum off-time | toff-min | 100 | ns | VFB=Vref - 0.2V; not production tested | 5 | ||
| Hiccup on time | ton-hiccup | 1 | ms | Not production tested, guaranteed by design | 5 | ||
| Hiccup waiting time | toff-hiccup | 10 | ms | Not production tested, guaranteed by design | 5 | ||
| EN delay time | td | 250 | us | From EN high to first switching; not production tested | 5 | ||
| Soft-start time | tss | 600 | us | From first switching to 95%Vref; not production tested | 5 | ||
| Thermal shutdown threshold (rising) | Tjsd | 160 | °C | Rising threshold | 5 | ||
| Thermal shutdown threshold (falling) | Tjsd | 135 | °C | Falling threshold | 5 | ||
| FB pin leakage current | Ileak_FB | 0.01 | µA | 5 | |||
| EN pin logic high threshold | VH | 1.14 | 1.2 | 1.26 | V | EN Rising threshold | 6 |
| EN pin threshold hysteresis | Vhys | 0.1 | V | 6 | |||
| EN pin internal pull-down resistance | 1000 | kΩ | 6 | ||||
| OVP threshold (rising) | VOVP_rise | 108 | 110 | 112 | % | VOUT rising edge, reference to Vref | 6 |
| OVP hysteresis (falling) | VOVP_fall | 105 | % | VOUT falling edge, reference to Vref | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | ⚫ Place the input capacitors (C4, 0603 or 0402 size) as close as possible to VIN pin and GND pin and use shortest copper trace connection or GND plane, this is the most critical path and should have t | 15 |
CAD (KiCad official)
- Symbol:
LP54334SPF - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
lp54334spf-etched.step/lp54334spf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lp54334spf.step/lp54334spf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LOWPOWER datasheet (19 pp, sha256
a4b8cab263ab581e, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).