component
LP0701LG-G
Public Made by Adomby adom
Microchip Tech MOSFETs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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LP0701LG-G
Microchip Tech · MOSFETs · SOIC-8
LP0701LG-G from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; this pin is not connected internally and is listed as NC in the 8-lead SOIC pin function table. |
| 2 | NC | unconnected | No connection; this pin is not connected internally and is listed as NC in the 8-lead SOIC pin function table. |
| 3 | Source | passive | Source terminal of the P-channel enhancement-mode lateral MOSFET; the datasheet gives no pin-specific electrical limit for this terminal. |
| 4 | Gate | input | Gate terminal of the MOSFET; the absolute maximum gate-to-source voltage is ±10V. |
| 5 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
| 6 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
| 7 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
| 8 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-to-Source Voltage | VGS | -10 | 10 | V | 2 | ||
| Operating Ambient Temperature | TA | -55 | 150 | °C | 2 | ||
| Storage Temperature | TS | -55 | 150 | °C | 2 | ||
| Operating Ambient Temperature | TA | -55 | 150 | °C | 3 | ||
| Storage Temperature | TS | -55 | 150 | °C | 3 | ||
| Gate Threshold Voltage | VGS(th) | -0.5 | -0.7 | -1 | V | VGS = VDS, ID = -1 mA | 2 |
| Change in VGS(th) with Temperature | ∆VGS(th) | -4 | mV/°C | VGS = VDS, ID = -1 mA (Note 1) | 2 | ||
| Gate Body Leakage Current | IGSS | -100 | nA | VGS = ±10V, VDS = 0V | 2 | ||
| Zero-Gate Voltage Drain Current | IDSS | -100 | nA | VDS = -15V, VGS = 0V | 2 | ||
| Zero-Gate Voltage Drain Current | IDSS | -1 | mA | VDS = 0.8 Maximum rating, VGS = 0V, TA= 125°C (Note 1) | 2 | ||
| On-State Drain Current | ID(ON) | -0.6 | -1 | A | VGS = VDS = -3V | 2 | |
| On-State Drain Current | ID(ON) | -1.25 | -2.3 | A | VGS = VDS = -5V | 2 | |
| Static Drain-to-Source On-State Resistance | RDS(ON) | 2 | 4 | Ω | VGS = -2V, ID = -50 mA | 2 | |
| Static Drain-to-Source On-State Resistance | RDS(ON) | 1.7 | 2 | Ω | VGS = -3V, ID = -150 mA | 2 | |
| Static Drain-to-Source On-State Resistance | RDS(ON) | 1.3 | 1.5 | Ω | VGS = -5V, ID = -300 mA | 2 | |
| Change in RDS(ON) with Temperature | ∆RDS(ON) | 0.75 | %/°C | VGS = -5V, ID = -300 mA (Note 1) | 2 | ||
| Drain-to-Source Breakdown Voltage | BVDSS | -16.5 | V | VGS = 0V, ID = -1 mA | 2 | ||
| Forward Transconductance | GFS | 500 | 700 | mmho | VGS = -15V, ID = -1A | 3 | |
| Input Capacitance | CISS | 120 | 250 | pF | VGS = 0V, VDS = -15V, f = 1 MHz | 3 | |
| Common Source Output Capacitance | COSS | 100 | 125 | pF | 3 | ||
| Reverse Transfer Capacitance | CRSS | 40 | 60 | pF | 3 | ||
| Turn-On Delay Time | td(ON) | 20 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 | ||
| Rise Time | tr | 20 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 | ||
| Turn-Off Delay Time | td(OFF) | 30 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 | ||
| Fall Time | tf | 30 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 | ||
| Diode Forward Voltage Drop | VSD | -1.2 | -1.5 | V | VGS = 0V, ISD = -500 mA (Note 1) | 3 | |
| Continuous Drain Current, 8-lead SOIC | ID | -700 | mA | Continuous; limited by maximum rated TJ (Note 1) | 3 | ||
| Pulsed Drain Current, 8-lead SOIC | ID | -1.25 | A | Pulsed | 3 | ||
| Power Dissipation, 8-lead SOIC | PD | 1.5 | W | TA = 25°C (Note 2) | 3 | ||
| Reverse Drain Current, 8-lead SOIC | IDR | -700 | mA | (Note 1) | 3 | ||
| Reverse Drain Pulsed Current, 8-lead SOIC | IDRM | -1.25 | A | 3 | |||
| Junction-to-Ambient Thermal Resistance, 8-lead SOIC | θJA | 101 | °C/W | Mounted on FR4 board, 25 mm x 25 mm x 1.57 mm (Note 1) | 3 |
CAD (KiCad official)
- Symbol:
LP0701LG-G - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
lp0701lg-g-etched.step/lp0701lg-g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lp0701lg-g.step/lp0701lg-g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (14 pp, sha256
3da64875eafd8779, retrieved 2026-10-29, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LP0701LG-G
**Microchip Tech** · MOSFETs · SOIC-8
LP0701LG-G from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; this pin is not connected internally and is listed as NC in the 8-lead SOIC pin function table. |
| 2 | NC | unconnected | No connection; this pin is not connected internally and is listed as NC in the 8-lead SOIC pin function table. |
| 3 | Source | passive | Source terminal of the P-channel enhancement-mode lateral MOSFET; the datasheet gives no pin-specific electrical limit for this terminal. |
| 4 | Gate | input | Gate terminal of the MOSFET; the absolute maximum gate-to-source voltage is ±10V. |
| 5 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
| 6 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
| 7 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
| 8 | Drain | passive | Drain terminal of the MOSFET; the drain-to-source breakdown voltage BVDSS is -16.5V minimum at VGS = 0V and ID = -1 mA. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-to-Source Voltage | VGS | -10 | | 10 | V | | 2 |
| Operating Ambient Temperature | TA | -55 | | 150 | °C | | 2 |
| Storage Temperature | TS | -55 | | 150 | °C | | 2 |
| Operating Ambient Temperature | TA | -55 | | 150 | °C | | 3 |
| Storage Temperature | TS | -55 | | 150 | °C | | 3 |
| Gate Threshold Voltage | VGS(th) | -0.5 | -0.7 | -1 | V | VGS = VDS, ID = -1 mA | 2 |
| Change in VGS(th) with Temperature | ∆VGS(th) | | | -4 | mV/°C | VGS = VDS, ID = -1 mA (Note 1) | 2 |
| Gate Body Leakage Current | IGSS | | | -100 | nA | VGS = ±10V, VDS = 0V | 2 |
| Zero-Gate Voltage Drain Current | IDSS | | | -100 | nA | VDS = -15V, VGS = 0V | 2 |
| Zero-Gate Voltage Drain Current | IDSS | | | -1 | mA | VDS = 0.8 Maximum rating, VGS = 0V, TA= 125°C (Note 1) | 2 |
| On-State Drain Current | ID(ON) | -0.6 | -1 | | A | VGS = VDS = -3V | 2 |
| On-State Drain Current | ID(ON) | -1.25 | -2.3 | | A | VGS = VDS = -5V | 2 |
| Static Drain-to-Source On-State Resistance | RDS(ON) | | 2 | 4 | Ω | VGS = -2V, ID = -50 mA | 2 |
| Static Drain-to-Source On-State Resistance | RDS(ON) | | 1.7 | 2 | Ω | VGS = -3V, ID = -150 mA | 2 |
| Static Drain-to-Source On-State Resistance | RDS(ON) | | 1.3 | 1.5 | Ω | VGS = -5V, ID = -300 mA | 2 |
| Change in RDS(ON) with Temperature | ∆RDS(ON) | | | 0.75 | %/°C | VGS = -5V, ID = -300 mA (Note 1) | 2 |
| Drain-to-Source Breakdown Voltage | BVDSS | -16.5 | | | V | VGS = 0V, ID = -1 mA | 2 |
| Forward Transconductance | GFS | 500 | 700 | | mmho | VGS = -15V, ID = -1A | 3 |
| Input Capacitance | CISS | | 120 | 250 | pF | VGS = 0V, VDS = -15V, f = 1 MHz | 3 |
| Common Source Output Capacitance | COSS | | 100 | 125 | pF | | 3 |
| Reverse Transfer Capacitance | CRSS | | 40 | 60 | pF | | 3 |
| Turn-On Delay Time | td(ON) | | | 20 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 |
| Rise Time | tr | | | 20 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 |
| Turn-Off Delay Time | td(OFF) | | | 30 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 |
| Fall Time | tf | | | 30 | ns | VDD = -15V, ID = -1.25A, RGEN = 25Ω | 3 |
| Diode Forward Voltage Drop | VSD | | -1.2 | -1.5 | V | VGS = 0V, ISD = -500 mA (Note 1) | 3 |
| Continuous Drain Current, 8-lead SOIC | ID | | | -700 | mA | Continuous; limited by maximum rated TJ (Note 1) | 3 |
| Pulsed Drain Current, 8-lead SOIC | ID | | | -1.25 | A | Pulsed | 3 |
| Power Dissipation, 8-lead SOIC | PD | | | 1.5 | W | TA = 25°C (Note 2) | 3 |
| Reverse Drain Current, 8-lead SOIC | IDR | | | -700 | mA | (Note 1) | 3 |
| Reverse Drain Pulsed Current, 8-lead SOIC | IDRM | | | -1.25 | A | | 3 |
| Junction-to-Ambient Thermal Resistance, 8-lead SOIC | θJA | | 101 | | °C/W | Mounted on FR4 board, 25 mm x 25 mm x 1.57 mm (Note 1) | 3 |
## CAD (KiCad official)
- Symbol: `LP0701LG-G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `lp0701lg-g-etched.step` / `lp0701lg-g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lp0701lg-g.step` / `lp0701lg-g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](docs/lp0701lg-g-datasheet.pdf) (14 pp, sha256 `3da64875eafd8779`, retrieved 2026-10-29, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/lp0701lg-g-datasheet.pdf)