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LNBH25LSPQR
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STMicroelectronics Power Management - Specialized, QFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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LNBH25LSPQR
STMicroelectronics · Power Management - Specialized · QFN-24-EP(4x4)
LNBH25LSPQR from STMicroelectronics, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 2 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 3 | LX | passive | Drain of the integrated N-channel power MOSFET of the DC-DC step-up converter. |
| 4 | PGND | power_in | DC-DC converter power ground; to be connected directly to the exposed pad. |
| 5 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 6 | ADDR | input | Address setting pin; the voltage level selects one of two available I²C bus addresses (see Table 15 of the datasheet). |
| 7 | SCL | input | Serial clock input from the I²C bus. |
| 8 | SDA | bidirectional | Bi-directional serial data line to and from the I²C bus. |
| 9 | ISEL | passive | Resistor RSEL connected between ISEL and GND sets the linear regulator current limit threshold, up to 750 mA. |
| 10 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 11 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 12 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 13 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 14 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 15 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 16 | VBYP | passive | Bypass pin for internal pre-regulator filtering; intended only for an external ceramic capacitor, and any connection to external current or voltage sources may cause permanent damage. |
| 17 | VCC | power_in | Supply input of 8 to 16 V for the IC DC-DC power supply. |
| 18 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 19 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 20 | VOUT | power_out | Output of the integrated very low drop linear regulator, providing the LNB 13/18 V output and 22 kHz tone; voltage selection per Table 13. |
| 21 | VUP | power_in | Input of the linear post-regulator, monitored by the step-up controller to keep a minimum dropout across the pass transistor. |
| 22 | DSQIN | input | Logic input (TTL compatible) used as DiSEqC envelope input or external 22 kHz TTL input depending on the EXTM and TEN I²C bits; pull up high if the tone is enabled only by the TEN bit. |
| 23 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 24 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | QFN-24-EP(4x4) |
| Category | Power Management (PMIC) |
| Pins | 25 |
CAD (KiCad official)
- Symbol:
LNBH25LSPQR - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm - 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
lnbh25lspqr-etched.step/lnbh25lspqr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lnbh25lspqr.step/lnbh25lspqr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (30 pp, sha256
84c10c68e23fa327, retrieved 2026-10-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LNBH25LSPQR
**STMicroelectronics** · Power Management - Specialized · QFN-24-EP(4x4)
LNBH25LSPQR from STMicroelectronics, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 2 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 3 | LX | passive | Drain of the integrated N-channel power MOSFET of the DC-DC step-up converter. |
| 4 | PGND | power_in | DC-DC converter power ground; to be connected directly to the exposed pad. |
| 5 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 6 | ADDR | input | Address setting pin; the voltage level selects one of two available I²C bus addresses (see Table 15 of the datasheet). |
| 7 | SCL | input | Serial clock input from the I²C bus. |
| 8 | SDA | bidirectional | Bi-directional serial data line to and from the I²C bus. |
| 9 | ISEL | passive | Resistor RSEL connected between ISEL and GND sets the linear regulator current limit threshold, up to 750 mA. |
| 10 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 11 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 12 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 13 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 14 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 15 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 16 | VBYP | passive | Bypass pin for internal pre-regulator filtering; intended only for an external ceramic capacitor, and any connection to external current or voltage sources may cause permanent damage. |
| 17 | VCC | power_in | Supply input of 8 to 16 V for the IC DC-DC power supply. |
| 18 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 19 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 20 | VOUT | power_out | Output of the integrated very low drop linear regulator, providing the LNB 13/18 V output and 22 kHz tone; voltage selection per Table 13. |
| 21 | VUP | power_in | Input of the linear post-regulator, monitored by the step-up controller to keep a minimum dropout across the pass transistor. |
| 22 | DSQIN | input | Logic input (TTL compatible) used as DiSEqC envelope input or external 22 kHz TTL input depending on the EXTM and TEN I²C bits; pull up high if the tone is enabled only by the TEN bit. |
| 23 | GND | power_in | Analog ground for the analog circuits; to be connected directly to the exposed pad. |
| 24 | NC | unconnected | Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | QFN-24-EP(4x4) |
| Category | Power Management (PMIC) |
| Pins | 25 |
## CAD (KiCad official)
- Symbol: `LNBH25LSPQR`
- Footprint: `Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm`
- 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `lnbh25lspqr-etched.step` / `lnbh25lspqr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lnbh25lspqr.step` / `lnbh25lspqr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590169396225613824) (30 pp, sha256 `84c10c68e23fa327`, retrieved 2026-10-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/lnbh25lspqr-datasheet.pdf)