Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

LNBH25LSPQR

STMicroelectronics · Power Management - Specialized · QFN-24-EP(4x4)

LNBH25LSPQR from STMicroelectronics, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
2 GND power_in Analog ground for the analog circuits; to be connected directly to the exposed pad.
3 LX passive Drain of the integrated N-channel power MOSFET of the DC-DC step-up converter.
4 PGND power_in DC-DC converter power ground; to be connected directly to the exposed pad.
5 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
6 ADDR input Address setting pin; the voltage level selects one of two available I²C bus addresses (see Table 15 of the datasheet).
7 SCL input Serial clock input from the I²C bus.
8 SDA bidirectional Bi-directional serial data line to and from the I²C bus.
9 ISEL passive Resistor RSEL connected between ISEL and GND sets the linear regulator current limit threshold, up to 750 mA.
10 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
11 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
12 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
13 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
14 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
15 GND power_in Analog ground for the analog circuits; to be connected directly to the exposed pad.
16 VBYP passive Bypass pin for internal pre-regulator filtering; intended only for an external ceramic capacitor, and any connection to external current or voltage sources may cause permanent damage.
17 VCC power_in Supply input of 8 to 16 V for the IC DC-DC power supply.
18 GND power_in Analog ground for the analog circuits; to be connected directly to the exposed pad.
19 GND power_in Analog ground for the analog circuits; to be connected directly to the exposed pad.
20 VOUT power_out Output of the integrated very low drop linear regulator, providing the LNB 13/18 V output and 22 kHz tone; voltage selection per Table 13.
21 VUP power_in Input of the linear post-regulator, monitored by the step-up controller to keep a minimum dropout across the pass transistor.
22 DSQIN input Logic input (TTL compatible) used as DiSEqC envelope input or external 22 kHz TTL input depending on the EXTM and TEN I²C bits; pull up high if the tone is enabled only by the TEN bit.
23 GND power_in Analog ground for the analog circuits; to be connected directly to the exposed pad.
24 NC unconnected Not internally connected; the datasheet notes it can be tied to GND to improve thermal performance.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package QFN-24-EP(4x4)
Category Power Management (PMIC)
Pins 25

CAD (KiCad official)

  • Symbol: LNBH25LSPQR
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
  • 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: lnbh25lspqr-etched.step / lnbh25lspqr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lnbh25lspqr.step / lnbh25lspqr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (30 pp, sha256 84c10c68e23fa327, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF