component
LMK00334RTVTQ1
Public Made by Adomby adom
Texas Instruments Clock Buffers, Drivers, Distributors, WQFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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LMK00334RTVTQ1
Texas Instruments · Clock Buffers, Drivers, Distributors · WQFN-32-EP(5x5)
LMK00334RTVTQ1 from Texas Instruments, in a WQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin. |
| 2 | VCCOA | power_in | Power supply for Bank A output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOA pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 3 | CLKoutA0 | output | Differential clock output A0 (HCSL or Hi-Z selectable). |
| 4 | CLKoutA0* | output | Complementary differential clock output A0 (HCSL or Hi-Z selectable). |
| 5 | VCCOA | power_in | Power supply for Bank A output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOA pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 6 | CLKoutA1 | output | Differential clock output A1 (HCSL or Hi-Z selectable). |
| 7 | CLKoutA1* | output | Complementary differential clock output A1 (HCSL or Hi-Z selectable). |
| 8 | GND | power_in | Ground pin. |
| 9 | CLKout_EN | input | Low-active enable for the Bank A and Bank B output buffers; CMOS control input with an internal pulldown resistor. |
| 10 | VCC | power_in | Core and input buffer supply operating from 3.3 V (3.15 V to 3.45 V recommended); bypass with a 0.1-µF low-ESR capacitor placed very close to each VCC pin. |
| 11 | OSCin | input | Crystal input, which can also be driven by an XO, TCXO, or other external single-ended clock; the device supports 10 MHz to 40 MHz crystals or single-ended clocks. |
| 12 | OSCout | output | Crystal output; leave floating if OSCin is driven by a single-ended clock. |
| 13 | CLKin_SEL0 | input | Clock input selection pin (CMOS control input with internal pulldown resistor). |
| 14 | CLKin0 | input | Universal clock input 0, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 15 | CLKin0* | input | Complementary universal clock input 0, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 16 | CLKin_SEL1 | input | Clock input selection pin (CMOS control input with internal pulldown resistor). |
| 17 | GND | power_in | Ground pin. |
| 18 | CLKoutB1* | output | Complementary differential clock output B1 (HCSL or Hi-Z selectable). |
| 19 | CLKoutB1 | output | Differential clock output B1 (HCSL or Hi-Z selectable). |
| 20 | VCCOB | power_in | Power supply for Bank B output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOB pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 21 | CLKoutB0* | output | Complementary differential clock output B0 (HCSL or Hi-Z selectable). |
| 22 | CLKoutB0 | output | Differential clock output B0 (HCSL or Hi-Z selectable). |
| 23 | VCCOB | power_in | Power supply for Bank B output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOB pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 24 | GND | power_in | Ground pin. |
| 25 | NC | unconnected | Not connected internally; may be floated, grounded, or tied to any potential within the Supply Voltage range in the Absolute Maximum Ratings. |
| 26 | CLKin1* | input | Complementary universal clock input 1, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 27 | CLKin1 | input | Universal clock input 1, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 28 | VCC | power_in | Core and input buffer supply operating from 3.3 V (3.15 V to 3.45 V recommended); bypass with a 0.1-µF low-ESR capacitor placed very close to each VCC pin. |
| 29 | REFout | output | LVCMOS reference output, enabled by pulling REFout_EN high. |
| 30 | VCCOC | power_in | Power supply for the REFout buffer, operating from 3.3 V or 2.5 V (each within ±5%); bypass with a 0.1-µF low-ESR capacitor. |
| 31 | REFout_EN | input | REFout enable input, internally synchronized to the selected clock input (CMOS control input with internal pulldown resistor). |
| 32 | VCC | power_in | Core and input buffer supply operating from 3.3 V (3.15 V to 3.45 V recommended); bypass with a 0.1-µF low-ESR capacitor placed very close to each VCC pin. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WQFN-32-EP(5x5) |
| Category | Clock/Timing |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
LMK00334RTVTQ1 - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: WQFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
lmk00334rtvtq1-etched.step/lmk00334rtvtq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lmk00334rtvtq1.step/lmk00334rtvtq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
d226e24823665475, retrieved 2026-10-11, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LMK00334RTVTQ1
**Texas Instruments** · Clock Buffers, Drivers, Distributors · WQFN-32-EP(5x5)
LMK00334RTVTQ1 from Texas Instruments, in a WQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin. |
| 2 | VCCOA | power_in | Power supply for Bank A output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOA pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 3 | CLKoutA0 | output | Differential clock output A0 (HCSL or Hi-Z selectable). |
| 4 | CLKoutA0* | output | Complementary differential clock output A0 (HCSL or Hi-Z selectable). |
| 5 | VCCOA | power_in | Power supply for Bank A output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOA pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 6 | CLKoutA1 | output | Differential clock output A1 (HCSL or Hi-Z selectable). |
| 7 | CLKoutA1* | output | Complementary differential clock output A1 (HCSL or Hi-Z selectable). |
| 8 | GND | power_in | Ground pin. |
| 9 | CLKout_EN | input | Low-active enable for the Bank A and Bank B output buffers; CMOS control input with an internal pulldown resistor. |
| 10 | VCC | power_in | Core and input buffer supply operating from 3.3 V (3.15 V to 3.45 V recommended); bypass with a 0.1-µF low-ESR capacitor placed very close to each VCC pin. |
| 11 | OSCin | input | Crystal input, which can also be driven by an XO, TCXO, or other external single-ended clock; the device supports 10 MHz to 40 MHz crystals or single-ended clocks. |
| 12 | OSCout | output | Crystal output; leave floating if OSCin is driven by a single-ended clock. |
| 13 | CLKin_SEL0 | input | Clock input selection pin (CMOS control input with internal pulldown resistor). |
| 14 | CLKin0 | input | Universal clock input 0, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 15 | CLKin0* | input | Complementary universal clock input 0, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 16 | CLKin_SEL1 | input | Clock input selection pin (CMOS control input with internal pulldown resistor). |
| 17 | GND | power_in | Ground pin. |
| 18 | CLKoutB1* | output | Complementary differential clock output B1 (HCSL or Hi-Z selectable). |
| 19 | CLKoutB1 | output | Differential clock output B1 (HCSL or Hi-Z selectable). |
| 20 | VCCOB | power_in | Power supply for Bank B output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOB pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 21 | CLKoutB0* | output | Complementary differential clock output B0 (HCSL or Hi-Z selectable). |
| 22 | CLKoutB0 | output | Differential clock output B0 (HCSL or Hi-Z selectable). |
| 23 | VCCOB | power_in | Power supply for Bank B output buffers, operating from 3.3 V or 2.5 V (each within ±5%); the VCCOB pins are internally tied together and each should be bypassed with a 0.1-µF low-ESR capacitor. |
| 24 | GND | power_in | Ground pin. |
| 25 | NC | unconnected | Not connected internally; may be floated, grounded, or tied to any potential within the Supply Voltage range in the Absolute Maximum Ratings. |
| 26 | CLKin1* | input | Complementary universal clock input 1, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 27 | CLKin1 | input | Universal clock input 1, accepting differential (LVPECL, LVDS, CML, SSTL, HSTL, HCSL) or single-ended clocks at operating frequencies up to 400 MHz. |
| 28 | VCC | power_in | Core and input buffer supply operating from 3.3 V (3.15 V to 3.45 V recommended); bypass with a 0.1-µF low-ESR capacitor placed very close to each VCC pin. |
| 29 | REFout | output | LVCMOS reference output, enabled by pulling REFout_EN high. |
| 30 | VCCOC | power_in | Power supply for the REFout buffer, operating from 3.3 V or 2.5 V (each within ±5%); bypass with a 0.1-µF low-ESR capacitor. |
| 31 | REFout_EN | input | REFout enable input, internally synchronized to the selected clock input (CMOS control input with internal pulldown resistor). |
| 32 | VCC | power_in | Core and input buffer supply operating from 3.3 V (3.15 V to 3.45 V recommended); bypass with a 0.1-µF low-ESR capacitor placed very close to each VCC pin. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WQFN-32-EP(5x5) |
| Category | Clock/Timing |
| Pins | 33 |
## CAD (KiCad official)
- Symbol: `LMK00334RTVTQ1`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm`
- 3D model: WQFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files: `lmk00334rtvtq1-etched.step` / `lmk00334rtvtq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lmk00334rtvtq1.step` / `lmk00334rtvtq1.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lmk00334-q1) (31 pp, sha256 `d226e24823665475`, retrieved 2026-10-11, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/lmk00334rtvtq1-datasheet.pdf)