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LM385M-2.5

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Texas Instruments Voltage Reference, SOIC-8. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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LM385M-2.5

Texas Instruments · Voltage Reference · SOIC-8

LM385M-2.5 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.
2 NC unconnected No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.
3 A power_in Anode - lower-potential terminal of the 2-terminal band-gap reference; operating reverse current 20 µA to 20 mA.
4 A power_in Anode - lower-potential terminal, internally shorted to pin 3; provides additional current-carrying pad.
5 K power_out Cathode - 2.5 V reference output terminal; reverse breakdown voltage 2.5 V typ over 20 µA to 20 mA operating range.
6 K power_out Cathode - 2.5 V reference output terminal, internally shorted to pin 5; provides additional current-carrying pad.
7 NC unconnected No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.
8 NC unconnected No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage 2.425 2.5 2.575 V TA = 25°C, 20 μA ≤ IR ≤ 20 mA 4
Minimum Operating Current 13 30 μA 4
Reverse Breakdown Voltage Change with Current 1 2.5 mV 20 μA ≤ IR ≤ 1 mA 4
Reverse Breakdown Voltage Change with Current 10 25 mV 1 mA ≤ IR ≤ 20 mA 4
Average Temperature Coefficient 150 ppm/°C IR = 100 μA 4
Reverse Current 30 mA 2
Forward Current 10 mA 2
Operating Temperature Range 0 70 °C LM385-2.5-N 2
Storage Temperature -55 150 °C 2
ESD Susceptibility 2 kV Human body model (100 pF through 1.5 kΩ) 2
Vapor Phase Soldering 215 °C 60 sec, SOIC and SOT-23 packages 2
Infrared Soldering 220 °C 15 sec, SOIC and SOT-23 packages 2
Maximum Junction Temperature (elevated temperature operation) TJ MAX 100 °C LM385-N 2
Thermal Resistance Junction to Ambient (SOIC-8) θja 165 °C/W Junction to ambient, free-air 2

CAD (KiCad official)

  • Symbol: LM385M-2.5
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: lm385m-2-5-etched.step / lm385m-2-5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm385m-2-5.step / lm385m-2-5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 c62a9316d9d7e83e, retrieved 2026-10-20, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF