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Generated by kicad-footprint-generator · KiCad file format 20260206

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lm385m-2-5-etched.glb	Publish 0.1.0 · Ray	14d ago
lm385m-2-5-etched.step	lm385m-2-5: factory component page (tier=lcsc) · Ray	14d ago
lm385m-2-5-hero.glb	lm385m-2-5: hero GLB from the etched model (keeps the MPN mark) · Ray	14d ago
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lm385m-2-5.step	Publish 0.1.0 · Ray	14d ago
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LM385M-2.5

Texas Instruments · Voltage Reference · SOIC-8

LM385M-2.5 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	NC	unconnected	No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.
2	NC	unconnected	No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.
3	A	power_in	Anode - lower-potential terminal of the 2-terminal band-gap reference; operating reverse current 20 µA to 20 mA.
4	A	power_in	Anode - lower-potential terminal, internally shorted to pin 3; provides additional current-carrying pad.
5	K	power_out	Cathode - 2.5 V reference output terminal; reverse breakdown voltage 2.5 V typ over 20 µA to 20 mA operating range.
6	K	power_out	Cathode - 2.5 V reference output terminal, internally shorted to pin 5; provides additional current-carrying pad.
7	NC	unconnected	No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.
8	NC	unconnected	No internal connection; leave unconnected or tie to adjacent terminal per layout convenience.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SOIC-8
Category	Power Management (PMIC)
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Reverse Breakdown Voltage		2.425	2.5	2.575	V	TA = 25°C, 20 μA ≤ IR ≤ 20 mA	4
Minimum Operating Current			13	30	μA		4
Reverse Breakdown Voltage Change with Current			1	2.5	mV	20 μA ≤ IR ≤ 1 mA	4
Reverse Breakdown Voltage Change with Current			10	25	mV	1 mA ≤ IR ≤ 20 mA	4
Average Temperature Coefficient				150	ppm/°C	IR = 100 μA	4
Reverse Current				30	mA		2
Forward Current				10	mA		2
Operating Temperature Range		0		70	°C	LM385-2.5-N	2
Storage Temperature		-55		150	°C		2
ESD Susceptibility				2	kV	Human body model (100 pF through 1.5 kΩ)	2
Vapor Phase Soldering				215	°C	60 sec, SOIC and SOT-23 packages	2
Infrared Soldering				220	°C	15 sec, SOIC and SOT-23 packages	2
Maximum Junction Temperature (elevated temperature operation)	TJ MAX			100	°C	LM385-N	2
Thermal Resistance Junction to Ambient (SOIC-8)	θja		165		°C/W	Junction to ambient, free-air	2

CAD (KiCad official)

Symbol: LM385M-2.5
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: lm385m-2-5-etched.step / lm385m-2-5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm385m-2-5.step / lm385m-2-5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (45 pp, sha256 c62a9316d9d7e83e, retrieved 2026-10-20, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF