# LM385DBZ-2.5RG

**HANSCHIP semiconductor** · Voltage Reference · SOT-23-3

LM385DBZ-2.5RG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | output | Reference voltage output, 2.5V nominal with ±0.3% maximum initial error, operating current range 10µA to 20mA. |
| 2 | ANODE | power_in | Ground connection (negative supply). |
| 3 | FB | input | Feedback pin for precision voltage adjustment and calibration. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse breakdown voltage |  | 2.47 | 2.49 | 2.52 | V | Ta=25℃,10µA≤IR≤20mA | 3 |
| Reverse breakdown voltage change with current |  |  | 1 | 1.5 | mV | 10µA ≤ IR≤1mA | 3 |
| Reverse breakdown voltage change with current |  |  | 10 | 25 | mV | 1mA≤IR≤20mA | 3 |
| Minimum operating current |  |  | 15 | 20 | µA |  | 3 |
| Reverse current |  |  |  | 30 | mA |  | 2 |
| Forward current |  |  |  | 10 | mA |  | 2 |
| Operating temperature range |  | 0 |  | 70 | ℃ |  | 2 |
| Storage temperature |  | -55 |  | 150 | ℃ |  | 2 |
| Soldering temperature (spot) |  |  |  | 260 | ℃ | 10 s spot soldering | 2 |
| Reverse dynamic impedance |  |  | 1 |  | Ω | IR=100µA, f=20Hz | 3 |
| Wideband noise (rms) |  |  | 60 |  | µV | IR=100µA,10Hz≤f≤10kHz | 3 |
| Long-term stability |  |  | 20 |  | ppm | IR=100µA, T=1000Hr, TA=25°C±0.1°C | 3 |
| Average temperature coefficient |  |  | 30 |  | ppm/℃ | IR = 100 µA | 3 |

## CAD (KiCad official)

- Symbol: `LM385DBZ-2.5RG`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `lm385dbz-2-5rg-etched.step` / `lm385dbz-2-5rg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm385dbz-2-5rg.step` / `lm385dbz-2-5rg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HANSCHIP semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590903991436472320) (9 pp, sha256 `8b65558921de94b6`, retrieved 2026-09-22, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-4-6` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lm385dbz-2-5rg-datasheet.pdf)